ELECTRONIC ASSEMBLY EA W128064-XALG Datasheet

Zeppelinstrasse 19 D-82205 Gilching Fon [phone]

5.2018

OLED 60.5x37.0mm - 128x64 DOTS

Incl. Kontroller SSD1309Z

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FEATURES

 2.42” LOW-POWER OLED

 -40..+80°C (T

 128X64 DOTS

 INCL. CONTROLLER SSD1309Z

 SPI, I²C, 8-BIT INTERFACE

 FAST RESPONSE TIME (10µS) EVEN AT -40°C

 ZIFF CONNECTION

 60.5X37.0MM OUTLINE DIM.

ORDERING CODE

OLED 2.42” - 128X64 DOTS, INCL. SSD1309Z, YELLOW EA W128064-XALG

OP.

)

ACCESSORIES

ZIF CONNECTOR SMD 0.5MM, 31 PINS, TOP CONTACT EA WF050-31T

USB TESTBOARD EA 9781-1USB

EA W128064-XALG

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Content

1.General Specification

2.Contour Drawing & Block Diagram

3.Interface Pin Function

4.Absolute Maximum Ratings

5.Electrical Characteristics

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6.Optical Characteristics

7.OLED Lifetime

8.Reliability

9.Inspection specification

10.Precautions in use of OLED Modules

11. Application example

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1. General Specification

Item Dimension Unit

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Dot Matrix 128 x 64

Module dimension 60.5 × 37.0 × 2.15 mm

Active Area 55.01 × 27.49 mm

Pixel Size 0.40 × 0.40 mm

Pixel Pitch 0.43 × 0.43 mm

Display Mode Passive Matrix

Display Color Monochrome (Yellow)

Drive Duty 1/64 Duty

－

EA W128064-XALG

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2. Contour Drawing & Block Diagram

60.50¡ Ó0.2

0.50

1.75

2.20

1.49

2.75

32.80¡ Ó0.2

28.91(VA)

37.00¡ Ó0.2

27.49 (AA)

POL 31.80¡ Ó0.2 0.50

36.00¡ Ó1.0

POL 59.50¡ Ó0.2

57.01(VA)

55.01 (AA)

Dots 128*64

14.0¡ Ó0.1 1.0¡ Ó0.15

7.0¡ Ó0.15

2.5¡ Ó0.3

1

0.5

22.2 16.0¡ Ó0.1

2

-

1

.

0

¡

Ó0

.

1

31

0.28¡ Ó0.03

P0.5*30=15.0¡ Ó0.1

View Direction

View Direction

2.30¡ Ó0.2

0.25

Polarizer

TAPE

0.3¡ Ó0.1

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2.15¡ Ó0.2

1.10¡ Ó0.1

0.70¡ Ó0.1

0.50¡ Ó0.5

POL 31.80¡ Ó0.2

SILICON

4.0¡ Ó0.5

Stiffener

Common 63

(Row 63)

Common 32

(Row 1)

Segment 127
(Column 128)

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PIN NO. SYMBOL PIN NO. SYMBOL

NC(GND)

1

VSS

2

319

NC

NC

4

NC

5

6

NC

NC

7

NC

824

NC

925

NC

10 26

VDD

11 27

BS1

12

13

BS2

NC

14

CS#

15

16

RES#

Common 31
(Row 62)

Common 0

Segment 0

(Column 1)

(Row 0)

D/C#

17

R/W#

18

E/RD#

D0

20

D1

21

D2

22

D3

23

D4

D5

D6

D7

IREF

28

29

VCOMH

30

VCC

NC(GND)

31

EA W128064-XALG

0.43

0.40

0.43

0.40

Detail D OTS Scale 1:10

The non-specified tolerance of dimension is ¡Ó0.3mm.

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FUNCTION BLOCK DIAGRAM

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3. Interface Pin Function

No. Symbol Function

1 NC(GND) No connection

2 VSS Ground.

3-10 NC No connection

11 VDD Power supply pin for core logic operation

MCU bus interface selection pins. Select appropriate logic setting as
described in the following table. BS2, BS1 and BS0 are pin select

12 BS1

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13 BS2

14 NC No connection

15 CS#

16 RES#

17 D/C#

18 R/W#

Note
(1) 0 is connected to VSS
(2) 1 is connected to VDD

This pin is the chip select input connecting to the MCU.
The chip is enabled for MCU communication only when CS# is pulled
LOW (active LOW).
This pin is reset signal input.
When the pin is pulled LOW, initialization of the chip is executed.
Keep this pin pull HIGH during normal operation.
This pin is Data/Command control pin connecting to the MCU.
When the pin is pulled HIGH, the data at D[7:0] will be interpreted as
data.
When the pin is pulled LOW, the data at D[7:0] will be transferred to a
command register.
In I2C mode, this pin acts as SA0 for slave address selection.
When 3-wire serial interface is selected, this pin must be connected to
VSS.
This pin is read / write control input pin connecting to the MCU
interface.
When 6800 interface mode is selected, this pin will be used as
Read/Write (R/W#) selection input. Read mode will be carried out
when this pin is pulled HIGH and write mode when LOW.
When 8080 interface mode is selected, this pin will be the Write

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(WR#) input. Data write operation is initiated when this pin is pulled
LOW and the chip is selected.
When serial or I2C interface is selected, this pin must be connected to
VSS.
This pin is MCU interface input.
When 6800 interface mode is selected, this pin will be used as the
Enable (E) signal.
Read/write operation is initiated when this pin is pulled HIGH and the

19 E/RD#

20~27 D0~D7

28 IREF

29 VCOMH

30 VCC

31 NC(GND) No connection

chip is selected.
When 8080 interface mode is selected, this pin receives the Read
(RD#) signal. Read operation is initiated when this pin is pulled LOW
and the chip is selected.
When serial or I2C interface is selected, this pin must be connected to
VSS.
These pins are bi-directional data bus connecting to the MCU data
bus.
Unused pins are recommended to tie LOW.
When serial interface mode is selected, D0 will be the serial clock
input: SCLK; D1 will be the serial data input: SDIN and D2 should be
kept NC.
When I2C mode is selected, D2, D1 should be tied together and
serve as SDAout,
SDAin in application and D0 is the serial clock input, SCL.
This pin is the segment output current reference pin.
IREF is supplied externally.
COM signal deselected voltage level.
A capacitor should be connected between this pin and VSS.
Power supply for panel driving voltage. This is also the most positive
power voltage supply pin.

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4. Absolute Maximum Ratings

Parameter Symbol Min Max Unit Notes

Supply Voltage for Logic VDD -0.3 4 V 1, 2

Supply Voltage for Display VCC 0 15 V 1, 2

Operating Temperature TOP -40 +80 °C -

Storage Temperature TSTG -40 +80 °C -

Note 1: All the above voltages are on the basis of “VSS = 0V”.
Note 2: When this module is used beyond the above absolute maximum ratings, permanent
breakage of the module may occur. Also, for normal operations, it is desirable to use this
module under the conditions according to Section 6 ‘’Electrical Characteristics’’. If this module
is used beyond these conditions, malfunctioning of the module can occur and the reliability of
the module may deteriorate

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5. Electrical Characteristics

Item Symbol Condition Min Typ Max Unit

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Supply Voltage for Logic VDD

Supply Voltage for Display VCC

High Level Input VIH
Low Level Input VIL
High Level Output VOH
Low Level Output VOL
50% Check Board operating

Current

－

－

－
－ － －
－
－ － －

VCC =13.0V 15 18 22 mA

2.8 3.0 3.3

12 13 15

0.8×VDD

0.9×VDD

－ －

－ －

0.2×VDD V

0.1×VDD V

V

V

V

V

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6. Optical Characteristics

Item Symbol Condition Min Typ Max Unit

(V)θ 160 deg

View Angle

(H)φ 160 deg

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Contrast Ratio CR Dark 2000:1

T rise

Response Time

T fall

Display with 50% check Board Brightness 70 90 cd/m2

CIEx(Yellow) (CIE1931) 0.45 0.47 0.49

CIEy(Yellow) (CIE1931) 0.48 0.50 0.52

－

－

10 μs

10 μs

－ －

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7. OLED Lifetime

ITEM Conditions Min Typ Remark

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Operating
Life Time

Notes:

1. Life time is defined the amount of time when the luminance has decayed to <50% of the
initial value.

2. This analysis method uses life data obtained under accelerated conditions to extrapolate

an estimated probability density function (pdf) for the product under normal use conditions.

3. Screen saving mode will extend OLED lifetime.

Ta= 25 ℃
/ Initial 50% check board

brightness Typical Value

50,000 Hrs

－

Note

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8. Reliability

Content of Reliability Test

Environmental Test

Test Item Content of Test Test Condition

High Temperature
storage
Low Temperature
storage

High Temperature
Operation

Low Temperature
Operation
High Temperature/
Humidity Storage

Temperature Cycle

Endurance test applying the high storage
temperature for a long time.
Endurance test applying the low storage
temperature for a long time.
Endurance test applying the electric stress
(Voltage & Current) and the thermal stress to the
element for a long time.
Endurance test applying the electric stress under
low temperature for a long time.
Endurance test applying the high temperature
and high humidity storage for a long time.
Endurance test applying the low and high
temperature cycle.

-40 25 80

30min 5min 30min
1 cycle

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80
240hrs

-40
240hrs

80
240hrs

-40
240hrs
60,90%RH
240hrs

-40/80
100 cycles

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Applicable
Standard

——

——

——

——

——

——

Mechanical Test

Vibration test

Shock test

Atmospheric
pressure test

Others

Static electricity
test

Endurance test applying the vibration during
transportation and using.

Constructional and mechanical endurance test
applying the shock during transportation.

Endurance test applying the atmospheric
pressure during transportation by air.

Endurance test applying the electric stress to the
terminal.

*** Supply voltage for OLED system =Operating voltage at 25℃

EA W128064-XALG

10~22Hz
22~500Hz→1.5G
Total 0.5hr
50G Half sin
wave 11 ms
3 times of each
direction

115mbar
40hrs

→1.5mmp

-p

VS=±600V(contact),
±800v(air),
RS=330Ω

CS=150pF
10 times

——

——

——

——

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Test and measurement conditions

1. All measurements shall not be started until the specimens attain to temperature stability.

After the completion of the described reliability test, the samples were left at room
temperature for 2 hrs prior to conducting the failure test at 23±5°C; 55±15% RH.

2. All-pixels-on is used as operation test pattern.

3. The degradation of Polarizer are ignored for High Temperature storage, High Temperature/

Humidity Storage, Temperature Cycle

Evaluation criteria

1. The function test is OK.

2. No observable defects.

3. Luminance: > 50% of initial value.

4. Current consumption: within ± 50% of initial value

APPENDIX:
RESIDUE IMAGE

Because the pixels are lighted in different time, the luminance of active pixels
may reduce or differ from inactive pixels. Therefore, the residue image will occur.
To avoid the residue image, every pixel needs to be lighted up uniformly.

.

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9. Inspection specification

NO Item Criterion AQL
01 Electrical

Testing

02 Black or white

spots on
OLED
(display only)

03 OLED black

spots, white
spots,
contamination
(non-display)

3.2 Line type : (As following drawing)

04 Polarizer

bubbles

1.1 Missing vertical, horizontal segment, segment contrast
defect.

1.2 Missing character , dot or icon.

1.3 Display malfunction.

1.4 No function or no display.

1.5 Current consumption exceeds product specifications.

1.6 OLED viewing angle defect.

1.7 Mixed product types.

1.8 Contrast defect.

2.1 White and black spots on display 0.25mm, no more
than three white or black spots present.

2.2 Densely spaced: No more than two spots or lines within
3mm.

3.1 Round type : As
following drawing
Φ=( x + y ) / 2

Length Width Acceptable Q TY

--­L≦3.0 0.02＜W≦0.03

If bubbles are visible,
judge using black
spot specifications,
not easy to find, must
check in specify
direction.

L≦2.5 0.03＜W≦0.05

---

SIZE Acceptable Q

TY

Φ≦0.10

0.10＜
Φ≦0.20

0.20＜
Φ≦0.25

0.25＜Φ

W≦0.02

0.05＜W

Size Φ Acceptable Q TY
Φ≦0.20

0.20＜Φ≦0.50

0.50＜Φ≦1.00

1.00＜Φ
To ta l Q TY 3

Accept no
dense
2

1

0

Accept no dense

2

As round type

Accept no dense
3
2
0

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0.65

2.5

2.5

2.5

2.5

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NO Item Criterion AQL
05 Scratches Follow NO.3 OLED black spots, white spots, contamination

Symbols Define:
x: Chip length y: Chip width z: Chip thickness
k: Seal width t: Glass thickness a: OLED side length
L: Electrode pad length:

6.1 General glass chip :

6.1.1 Chip on panel surface and crack between panels:

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06

Chipped
glass

z: Chip thickness y: Chip width x: Chip length
Z≦1/2t

1/2t＜z≦2t

☉If there are 2 or more chips, x is total length of each chip.

6.1.2 Corner crack:

z: Chip thickness y: Chip width x: Chip length
Z≦1/2t

1/2t＜z≦2t

☉If there are 2 or more chips, x is the total length of each chip.

Not over viewing
area
Not exceed 1/3k

Not over viewing
area
Not exceed 1/3k

x≦1/8a

x≦1/8a

x≦1/8a

x≦1/8a

2.5

EA W128064-XALG

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NO Item Criterion

Symbols :
x: Chip length y: Chip width z: Chip thickness
k: Seal width t: Glass thickness a: OLED side length
L: Electrode pad length

6.2 Protrusion over terminal :

6.2.1 Chip on electrode pad :

y: Chip width x: Chip length z: Chip thickness
y≦0.5mm x≦1/8a 0 ＜ z ≦ t

6.2.2 Non-conductive portion:

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AQL

06

Glass
crack

2.5

y: Chip width x: Chip length z: Chip

thickness

y≦ L x≦1/8a 0 ＜ z ≦ t

☉If the chipped area touches the ITO terminal, over 2/3 of the ITO

must remain and be inspected according to electrode terminal
specifications.

☉If the product will be heat sealed by the customer, the alignment

mark not be damaged.

6.2.3 Substrate protuberance and internal crack.

y: width x: length
y≦1/3L x ≦ a

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NO

07

08

09

10

11

Item Criterion
Cracked
glass

Backlight
elements

Bezel

PCB、COB

Soldering

The OLED with extensive crack is not acceptable. 2.5

8.1 Illumination source flickers when lit.

8.2 Spots or scratched that appear when lit must be judged.
Using OLED spot, lines and contamination standards.

8.3 Backlight doesn’t light or color wrong.

9.1 Bezel may not have rust, be deformed or have
fingerprints, stains or other contamination.

9.2 Bezel must comply with job specifications.

10.1 COB seal may not have pinholes larger than 0.2mm or
contamination.

10.2 COB seal surface may not have pinholes through to the
IC.

10.3 The height of the COB should not exceed the height
indicated in the assembly diagram.

10.4 There may not be more than 2mm of sealant outside the
seal area on the PCB. And there should be no more than
three places.

10.5 No oxidation or contamination PCB terminals.

10.6 Parts on PCB must be the same as on the production
characteristic chart. There should be no wrong parts,
missing parts or excess parts.

10.7 The jumper on the PCB should conform to the product
characteristic chart.

10.8 If solder gets on bezel tab pads, OLED pad, zebra pad
or screw hold pad, make sure it is smoothed down.

11.1 No un-melted solder paste may be present on the PCB.

11.2 No cold solder joints, missing solder connections,

oxidation or icicle.

11.3 No residue or solder balls on PCB.

11.4 No short circuits in components on PCB.

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AQL

0.65

2.5

0.65

2.5

0.65

2.5

2.5

0.65

2.5

2.5

0.65

0.65

2.5

2.5

2.5

2.5

0.65

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NO Item Criterion

12.1 No oxidation, contamination, curves or, bends on
interface Pin (OLB) of TCP.

12.2 No cracks on interface pin (OLB) of TCP.

12.3 No contamination, solder residue or solder balls on
product.

12.4 The IC on the TCP may not be damaged, circuits.

12.5 The uppermost edge of the protective strip on the
interface pin must be present or look as if it cause the

12

General
appearance

interface pin to sever.

12.6 The residual rosin or tin oil of soldering (component or
chip component) is not burned into brown or black color.

12.7 Sealant on top of the ITO circuit has not hardened.

12.8 Pin type must match type in specification sheet.

12.9 OLED pin loose or missing pins.

12.10 Product packaging must the same as specified on
packaging specification sheet.

12.11 Product dimension and structure must conform to
product specification sheet.

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AQL

2.5

0.65

2.5

2.5

2.5

2.5

2.5

0.65

0.65

0.65

0.65

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Check Item Classification Criteria

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Missing Line

Darker Short

No Display

Pixel Short

Major

Major

Major

Major

Wrong Display

Un-uniform

B/A x 100% < 70%

A/C x 100% < 70%

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Major

Major

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10. Precautions in use of OLED Modules

Modules

(1)Avoid applying excessive shocks to module or making any alterations or modifications to it.
(2)Don’t make extra holes on the printed circuit board, modify its shape or change the

components of OLED display module.
(3)Don’t disassemble the OLED display module.
(4)Don’t operate it above the absolute maximum rating.
(5)Don’t drop, bend or twist OLED display module.
(6)Soldering: only to the I/O terminals.
(7)Storage: please storage in anti-static electricity container and clean environment.
(8)It's pretty common to use "Screen Saver" to extend the lifetime and Don't use fix information

for long time in real application.
(9)Don't use fixed information in OLED panel for long time, that will extend "screen burn" effect

time..
(10) ELECTRONIC ASSEMBLY has the right to change the passive components, including

R2and R3 adjust resistors. (Resistors, capacitors and other passive components will have

different appearance and color caused by the different supplier.)
(11) ELECTRONIC ASSEMBLY have the right to change the PCB Rev. (In order to satisfy the

supplying stability, management optimization and the best product performance...etc, under

the premise of not affecting the electrical characteristics and external dimensions,

ELECTRONIC ASSEMBLY have the right to modify the version.)

10.1. Handling Precautions

(1) Since the display panel is being made of glass, do not apply mechanical impacts such us

dropping from a high position.
(2) If the display panel is broken by some accident and the internal organic substance leaks out,

be careful not to inhale nor lick the organic substance.
(3) If pressure is applied to the display surface or its neighborhood of the OLED display module,

the cell structure may be damaged and be careful not to apply pressure to these sections.
(4) The polarizer covering the surface of the OLED display module is soft and easily scratched.

Please be careful when handling the OLED display module.
(5) When the surface of the polarizer of the OLED display module has soil, clean the surface. It

takes advantage of by using following adhesion tape.

* Scotch Mending Tape No. 810 or an equivalent

Never try to breathe upon the soiled surface nor wipe the surface using cloth containing

solvent such as ethyl alcohol, since the surface of the polarizer will become cloudy.
Also, pay attention that the following liquid and solvent may spoil the polarizer:
* Water
* Ketone
* Aromatic Solvents

(6) Hold OLED display module very carefully when placing OLED display module into the

System housing. Do not apply excessive stress or pressure to OLED display module. And, do

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not over bend the film with electrode pattern layouts.
These stresses will influence the display performance. Also, secure sufficient rigidity for the
outer cases.

(7) Do not apply stress to the LSI chips and the surrounding molded sections.
(8) Do not disassemble nor modify the OLED display module.
(9) Do not apply input signals while the logic power is off.
(10) Pay sufficient attention to the working environments when handing OLED display modules

to prevent occurrence of element breakage accidents by static electricity.

* Be sure to make human body grounding when handling OLED display modules.
* Be sure to ground tools to use or assembly such as soldering irons.
* To suppress generation of static electricity, avoid carrying out assembly work under dry

environments.

* Protective film is being applied to the surface of the display panel of the OLED display module.

Be careful since static electricity may be generated when exfoliating the protective film.

(11) Protection film is being applied to the surface of the display panel and removes the
protection film before assembling it. At this time, if the OLED display module has been stored
for a long period of time, residue adhesive material of the protection film may remain on the
surface of the display panel after removed of the film. In such case, remove the residue
material by the method introduced in the above Section 5.
(12) If electric current is applied when the OLED display module is being dewed or when it is
placed under high humidity environments, the electrodes may be corroded and be careful to
avoid the above.

10.2. Storage Precautions

(1) When storing OLED display modules, put them in static electricity preventive bags
avoiding exposure to direct sun light nor to lights of fluorescent lamps. and, also, avoiding
high temperature and high humidity environment or low temperature (less than 0°C)
environments.
(We recommend you to store these modules in the packaged state when they were shipped
from ELECTRONIC ASSEMBLY.
At that time, be careful not to let water drops adhere to the packages or bags nor let dewing

occur with them.

(2) If electric current is applied when water drops are adhering to the surface of the OLED
display module, when the OLED display module is being dewed or when it is placed under
high humidity environments, the electrodes may be corroded and be careful about the above.

10.3. Designing Precautions

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(1) The absolute maximum ratings are the ratings which cannot be exceeded for OLED
display module, and if these values are exceeded, panel damage may be happen.
(2) To prevent occurrence of malfunctioning by noise, pay attention to satisfy the VIL and VIH
specifications and, at the same time, to make the signal line cable as short as possible.
(3) We recommend you to install excess current preventive unit (fuses, etc.) to the power
circuit (VDD). (Recommend value: 0.5A)
(4) Pay sufficient attention to avoid occurrence of mutual noise interference with the
neighboring devices.
(5) As for EMI, take necessary measures on the equipment side basically.
(6) When fastening the OLED display module, fasten the external plastic housing section.
(7) If power supply to the OLED display module is forcibly shut down by such errors as taking
out the main battery while the OLED display panel is in operation, we cannot guarantee the
quality of this OLED display module.
* Connection (contact) to any other potential than the above may lead to rupture of

the IC.

10.4. Precautions when disposing of the OLED display modules

1) Request the qualified companies to handle industrial wastes when disposing of the OLED
display modules. Or, when burning them, be sure to observe the environmental and hygienic
laws and regulations.

10.5. Other Precautions

(1) When an OLED display module is operated for a long of time with fixed pattern may remain

as an after image or slight contrast deviation may occur.

Nonetheless, if the operation is interrupted and left unused for a while, normal state can be

restored. Also, there will be no problem in the reliability of the module.

(2) To protect OLED display modules from performance drops by static electricity rapture, etc.,

do not touch the following sections whenever possible while handling the OLED display
modules.

* Pins and electrodes
* Pattern layouts such as the TCP & FPC
(3) With this OLED display module, the OLED driver is being exposed. Generally speaking,

semiconductor elements change their characteristics when light is radiated according to the
principle of the solar battery. Consequently, if this OLED driver is exposed to light,
malfunctioning may occur.

* Design the product and installation method so that the OLED driver may be shielded from light

in actual usage.

* Design the product and installation method so that the OLED driver may be shielded from light

during the inspection processes.

(4) Although this OLED display module stores the operation state data by the commands and the

indication data, when excessive external noise, etc. enters into the module, the internal status
may be changed. It therefore is necessary to take appropriate measures to suppress noise
generation or to protect from influences of noise on the system design.

(5) We recommend you to construct its software to make periodical refreshment of the operation

statuses (re-setting of the commands and re-transference of the display data) to cope with
catastrophic noise.

[e-mail]

http://www.lcd-module.de

EA W128064-XALG

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(6)Resistors, capacitors and other passive components will have different appearance and color

caused by the different supplier.

(7)Our company will has the right to upgrade and modify the product function.
(8) The limitation of FPC bending

[e-mail]

http://www.lcd-module.de

EA W128064-XALG

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11. Application example

[e-mail]

http://www.lcd-module.de

EA W128064-XALG

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