深圳市燊利创科技有限公司
(Product):
5.8G
(Manufactured Part No.)
EV01S RX
(Software Version)
附录为产品规格书,有同等确认效力.一式两份
承 认 印
燊利创
Senritron
客 户
SENRITRON ELECTRONICS CO., LTD
深圳市龙华新区民治街道向南大厦2
楼201-203 518131
品名
模组型号
软件版本
客户物料编号：
说明:
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模组
：
RX : V2B
：
OT-056-000001-01
Signature for Approval
Customer
EV01S Rx
Subwoofer Module
承認書
Version: 1.0
Subject to change without further notice.
2017/04/11
Everestek Inc.
INDEX
1. Spec ......................................................................................................................................................... 3
2. Features .................................................................................................................................................... 3
3. Application .............................................................................................................................................. 3
4. Electrical Specifications .......................................................................................................................... 4
5. Mechanical Specification ........................................................................................................................ 5
6. Application .............................................................................................................................................. 6
7. Block Diagram ......................................................................................................................................... 7
8. Module Pin Definition ............................................................................................................................. 8
9. Reference Schematics .............................................................................................................................. 8
10. Sticker and Package ............................................................................................................................... 10
11. Revision History .................................................................................................................................... 12
Module
EV01S
FW
SUREV2B703135E56
Main Chip
ETK51
RF
5.8GHz
Modulation
FSK
1. Spec
2. Features
Radio Frequency: 5.8GHz unlicensed bands
Uncompressed Audio
Short Audio Latency: < 13ms (analog to analog)
Link Distance: up to 40 Meters
Advanced RF Selection Algorithm
Small RF Foot Print
Best Coexistence with Wi-Fi/Bluetooth
Highly Integrated SoC: RF/PA/CPU/Flash Embedded
Wide-Band Antenna on Module
Short RBOM List
RF Modulation: FSK
Digital I2S (master or slave) Audio Interface, 16/24bit , 32/44.1/48KHz Sampling Rate
Low Power Consumption
Supply Voltage: 2.7~3.6V
Support I2C master/slave mode and SPI/UART
Optional module version with MHF connector for external antenna
Compliant with EMC Regulations (FCC/CE)
3. Application
Wireless Soundbar/Subwoofer
Item
Min
Typ
Max
Unit
Note
RF Carrier Frequency
5725
─
5820
MHz
For 5.8Ghz
-20dB bandwidth
─ 2 ─
MHz
Output Power
7
dBm
RF Sensitivity
─
-81
dBm
Item
Min
Typ
Max
Unit
Note
SNR 142 dB
@1kHz
THD + N
-135
dB
@1kHz
Frequency response
6
KHz
Programmable, <=6KHz
Dynamic range
-140
dB
@1kHz
Item
Min
Typ
Max
Unit
Note
VDD
2.7
3.3
3.6 V Power Supply Voltage
Operating
Temperature
-5
25
60
°C
Ambient temperature
Item
Min
Typ
Max
Unit
Note
Transmitter current
47
mA
Output power 7dBm
Receiver current
45
mA
sleep mode
2
mA
Crystal enable, timer or interrupt
wake up system
Item
Min
Typ
Max
Unit
Note
VIH
0.7VDD
VDD+0.2
V
Input High Threshold
VIL
VSS
0.3VDD
V
Input Low Threshold
VOH
VDD-0.3
VDD
V
Output High Threshold
VOL 0
0.3
V
Output Low Threshold
4. Electrical Specifications
RF Specification
Audio Specification(I2S to I2S)
Operation Condition
Electrical Specification (MCU+RF)
Digital interface
Antenna Area
No trace, ground, power copper underneath this area!
1.27
1.27
5.5
16.5
1
2
25
26
4.7
18
34
9
11
13
14
25
9
2 (use plastic
screw only)
(0, 0)
5. Mechanical Specification
Dimension：34 mm x 18 mm
PCB 4 Layers
Mechanical Drawing:
Bottom view
Connector Drawing:
The no copper area is showed below in pink color. The main board layout should no copper, no trace
underneath this area.
6. Application
EV01
Module
I2C
External MCU
External Power Stage
I2S
Control signal
Buttons / LED
Blue Too th
EV01
Module
I2C
I2S
5.8G
RF
Soundbar
Subwoofer
ETK51
RFN_RX
RFP_RX
RFP_TX
RFN_TX
VDDPA
PA
Bias
Balun
Balun
Low
pass
filter
Low
pass
filter
Connector
7. Block Diagram
Pin
Name
I/O
Function Definition
1
VDD
P
VDD (2.7V~3.6V)
2
DGND
P
System ground
3
CODEC_12M
O
For audio codec system clock(12.288MHz or 11.2896MHz)
4
P2.0
I/O
GPIO
5
P2.1
I/O
GPIO
6
P2.6_PWM
I/O
GPIO or PWM
7
P2.7_PWM
I/O
GPIO or PWM
8
P0.2_UART_TXD
I/O
GPIO or UART TXD
9
P0.7_SPI_CS
I/O, C
GPIO and SPI chip select for programming internal flash
mode, or Arm Debug port
10
P0.3_UART_RXD_Debug
I/O
General I/O or UART RXD, ARM debug port
11
DGND
P
System ground
12
DGND
P
System ground
13
P0.6_SPI_SCK
I/O
General I/O and SPI SCK for SPI in programming internal
flash mode, or Arm Debug port
14
P3.2_ADC_IN
I/O, A
GPIO or ADC input
15
P0.5_SPI_MISO
I/O, C
General I/O and SPI MISO for SPI in programming
internal flash mode, or Arm Debug port
16
FLASH_PROG
C
Program mode select, active high, default pull low
For programming internal flash memory
Please leave this pin float for normal operation.
17
P0.4_SPI_MOSI
I/O, C
General I/O and SPI MOSI for SPI in programming internal
flash mode, or Arm Debug port
18
P0.0_I2C_SCL
I/O
General I/O, I2C clock
19
P0.1_I2C_SDA
I/O
General I/O, I2C data
20
P3.1_ADC_IN
I/O, A
GPIO or ADC input
21
P3.0_ADC_IN
I/O, A
GPIO or ADC input
22
I2S_PCM_LRCK
I/O
I2S LRCK(input for I2S slave, output for I2S master)
23
DGND
P
Power ground
24
I2S_PCM_BCK
I/O
I2S BCK(input for I2S slave, output for I2S master)
25
I2S_PCM_DIN
I/O
I2S Data in(from audio codec, or from ADC I2S DATA out)
26
I2S_PCM_DOUT
I/O
I2S Data out(to audio codec, or to DAC I2S DATA in)
8. Module Pin Definition
Note: P:Power, I/O:GPIO, S:System use only, A:DAC/ADC, C:control
9. Reference Schematics
LBD
RX_EN
C16
9pF
C_0201
R1
0R/NC
R_0402
DGND
A2
MHF
2
1
3
GND
ANT
GND
GPIO_P2.6_PWM
RX_EN
C38
1uF
C_0402
DGND
XTAL_N
ANT2
PCB_ANT
1
IN
DGND
I2C_SDA
C11
1uF
C_0402
DGND
XTAL_N
L9
1.0nH
L_0201
VDD_3V
I2S_PCM_LR CK
C52
4.7pF
C_0201
C3
4.7uF
C_0603
XTAL_P
DGND
C24
0.1uF
C_0402
VDD_3V
GPIO_P2.4
C51
100nF
C_0201
EAR_LP
C45
12pF
C_0402
I2C_SDA
DGND
C55
NC/9pF
C_0201
DGND
I2S_PCM_BC K
P3.2_ADC_I N
SPI_MISO
C42
0.1uF
C_0402
XTAL_P
TP1
3V
TP_1.0MM
DGND
C25
0.5pF
C_0201
DGND
GPIO_P2.7_PWM
SPI_SCK
C56
NC/9pF
C_0201
I2C_SCL
DGND
U7
XTAL16MHZ
XTAL_3.2X2.5MM
1
2
4
3
DGND
C34
4.7pF
C_0201
SPI_MOSI
FLASH_WP
RSTN
TP12 GPIO_P2.4 TP_0.8MM
DGND
C53
0.5pF
C_0201
VDD_3V
A1
MHF
2
1
3
GND
ANT
GND
JTAG_M
CODEC_12M
P0.2_UART_TXD
C13
1uF
C_0402
DGND
C20
0.5pF
C_0201
DGND
I2S_DOUT2
P3.0_ADC_I N
P3.1_ADC_I N
L6
1.6nH
L_0201
C6
0.1uF
C_0402
DGND
L12
0R
L_0201
DGND
P0.3_UART_RXD_Debug
EAR_LN
I2C_SCL
L17
1.0nH
L_0201
C54
0.5pF
C_0201
VDD_3V
L5
1.2nH
L_0201
DGND
SPI_CS
EAR_RP
I2S_PCM_D OUT
C36
NC
C_0201
DGND
DGND
L8
2.2nH
L_0201
I2S_PCM_D OIN
FLASH_PROG
U8
ETK51
MQFN48_0.5_7X7
1
2
3
4
5
6
7
8
9
10
31
27
28
29
141516
172018
11
12
13
38
37
33
36
32
34
26
25
24
232122
484746454443424140
39
49
19
30
35
EAR_RN
EAR_RP
EAR_LP
EAR_LN
VDD3V
XTAL_P
XTAL_N
VDD3V
RFN_R X
RFP_RX
P0.0
RSTN
P0.3
P0.2
VDD3V
3V_OUT
5V_IN
P3.2
P0.7
P3.1
RFP_TX
RFN_TX
VDDPA
P1.2
P1.3
P2.6
P2.0
P2.7
P2.4
VDD3V
CDVDD
LBD
P0.4
P0.6
P0.5
VbgDAC
VDD3V
TX_EN
RX_EN
CLK12M
WP
JTAG_M
PROG_M
P1.0
P1.1
GND
P3.0
P0.1
P2.1
VDD_3V
DGND
I2S_DOUT1EAR_RN
C44
12pF
C_0402
C19
0.8pF
C_0201
VDD_IN
ANT1
PCB_ANT
1
IN
I2S_PCM_DOIN
P0.2_UART_TXD
I2S_PCM_DOUT
J1 26pin_Connector
PIN_2X13_1.27MM_SMD
1 2
3 4
5 6
7 8
9 10
11 12
13 14
15 16
17 18
19 20
2221
23 24
25 26
GPIO_P2.6_PWM
I2S_PCM_BCK
TP6 FLASH_WPTP_0.8MM
GPIO_P2.7_PWM
I2S_PCM_LRCK
GPIO_P2.4
H1
H_2.0mm
P3.0_ADC_IN
I2S_DOUT1
TP5 EAR_RN TP_0.8MM
DGND
P3.1_ADC_IN
I2S_DOUT2
TP4 EAR_RP TP_0.8MM
DGND
P3.2_ADC_IN
CODEC_12M
DGND
TP7 JTAG_M TP_0.8MM
EAR_LN
TP3 EAR_LP TP_0.8MM
I2C_SCL
DGND
EAR_LP
I2C_SDA
SC1
SC_PAD
VDD_IN
EAR_RP
FLASH_PROG
DGND
TP8 RSTN TP_0.8MM
EAR_RN
TP10 GPIO_P2.4 TP_0.8MM
SPI_CS
FLASH_WP
SC2
SC_PAD
SPI_SCK
JTAG_M
SPI_MISO
TP9 LBD TP_0.8MM
RSTN
SPI_MOSI
TP2 EAR_LN TP_0.8MM
LBD
P0.3_UART_RXD_Debug
Items
Type
Package
Spec
Quantity
Part ref
Remark
1
C CHIP
0201
0.5pF±0.1pF_25V
4
C20,C25,C53,C54
2
C CHIP
0201
0.8pF±0.1pF_25V
1
C19
BOM:
3
C CHIP
0201
4.7pF±0.25pF_25V
2
C34,C52
4
C CHIP
0201
9pF±0.25pF_25V
1
C16
5
C CHIP
0201
100nF±10%_6.3V
1
C51
6
C CHIP
0402
100nF±10%_6.3V
3
C6,C24,C42
7
C CHIP
0402
1uF-20%~+80%_6.3V
3
C11,C13,C38
8
C CHIP
0402
12pF±5%_50V
2
C44,C45
9
C CHIP
0603
4.7uF-20%~+80%_6.3V
1
C3
10
L CHIP
0201
1nH±0.3nH
2
L9,L17
11
L CHIP
0201
1.2nH±0.3nH
1
L5
12
L CHIP
0201
1.6nH±0.3nH
1
L6
13
L CHIP
0201
2.2nH±0.3nH
1
L8
14
R CHIP
0201
0R±5%
1
L12
15
R CHIP
0402
0R±5%_ 1/16W
1
R1
16
26pin_Connector
PIN_2X13_1.27MM_SMD
1
J1
17
XTAL
XTAL16MHZ
1
U7
18
ETK51
MQFN48_0.5_7X7
1
U8
C CHIP
0201
9pF±0.25pF_25V
2
C55,C56
NC
C CHIP
0201
NC 0201
1
C36
NC
MHF
MHF_3.1X3_SMD
2
A1,A2
NC
10. Sticker and Package
The 1st Line: Module Model Number
The 2nd Line: F/W Version
The 3rd Line: Serial Number
Date
Revision
Descriptions
2017/04/10
1.0
Initial Version
11. Revision History
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