Edgetech 3300 User Hardware Manual

EdgeTech

3300 HULL MOUNT SUB-BOTTOM PROFILER

USER HARDWARE MANUAL

0016732_REV_C 5/1/2018

i

4 Little Brook Road

West Wareham, MA 02576

Tel: [phone]

Fax: [phone]

www.EdgeTech.com

ii

The information, figures, and specifications in this manual are proprietary and are issued in strict
confidence on condition that they not be copied, reprinted, or disclosed to a third party, either wholly or
in part, without the prior, written consent of EdgeTech. Any reproduction of EdgeTech supplied software
or file sharing is strictly prohibited.

Copyright © 2015 – 2018 EdgeTech. All rights reserved.

Microsoft® and Windows® are registered trademarks of Microsoft Corporation.

Kevlar® is a registered trademark of the DuPont Company.

Intel® and Pentium® are registered trademarks of Intel Corporation.

Novagard G624® is a trademark of Novagard Solutions, Inc.

Storm Case™ is a trademark of Pelican.

iii

ATTENTION – READ THIS FIRST!

All personnel involved with the installation, operation, or maintenance of the equipment described in this
manual should read and understand the warnings and cautions provided below.

CAUTION! This equipment contains devices that are extremely sensitive

to static electricity. Therefore, extreme care should be taken when
handling them. Normal handling precautions involve the use of anti-static
protection materials and grounding straps for personnel.

WARNING! High Voltage may be present in all parts of the system.

Therefore, use caution when the electronics are removed from their
containers for servicing.

CAUTION! Operation with improper line voltage may cause serious

damage to the equipment. Always ensure that the proper line voltage is
used.

iv

HARDWARE VARIATIONS AND COMPATIBILITY

The 3300 Hull Mount Sub-Bottom Profiler contains both standard and proprietary hardware. At times,
EdgeTech may change the standard components due to their availability or performance improvements.
Although the component manufacturers—along with their models and styles—may change from unit to
unit, replacement parts will generally be interchangeable.

EdgeTech will make every effort to see that replacement components are interchangeable and use the
same software drivers (if applicable). At times, however, direct replacements may not exist. When this
happens, EdgeTech will provide the necessary drivers with the replacement part, if applicable.

EdgeTech may also change certain hardware per customer requirements. Therefore, portions of this
manual, such as parts lists and test features, are subject to change. These sections should be used for
reference only. When changes are made that affect system operation, they will be explicitly noted. Also,
some options and features may not be active in the customer’s unit at time of delivery. Upgrades will be
made available when these features are implemented.

Contact

EDGETECH CUSTOMER SERVICE with any questions relating to compatibility.

v

REVISION

DESCRIPTION

DATE

APPROVAL

A

Release to Production

03/09/2015

RM B Updates

08/25/2017

RM C Updates

05/01/2018

TS

ABOUT THIS DOCUMENT

We, the employees at EdgeTech, would like to thank you for purchasing 3300 Hull Mount Sub-Bottom
Profiler. At EdgeTech, it is our policy to provide high-quality, cost-effective products and support services
that meet or exceed your requirements. We also strive to deliver them on-time, and to continuously look
for ways to improve them. We take pride in the products we manufacture, and want you to be entirely
satisfied with your equipment.

Purpose of this Manual

The purpose of this manual is to provide the user with information on the setup and use of EdgeTech’s
3300 Hull Mount Sub-Bottom Profiler. Although this manual encompasses the latest operational features
of the 3300 Hull Mount Sub-Bottom Profiler, some features may be periodically upgraded. Therefore, the
information in this manual is subject to change and should be used for reference only.

Liability

EdgeTech has made every effort to document the 3300 Hull Mount Sub-Bottom Profiler in this manual
accurately and completely. However, EdgeTech assumes no liability for errors or for any damages that
result from the use of this manual or the equipment it documents. EdgeTech reserves the right to upgrade
features of this equipment, and to make changes to this manual, without notice at any time.

Warnings, Cautions, and Notes

Where applicable, warnings, cautions, and notes are provided in this manual as follows:

WARNING! Identifies a potential hazard that could cause injury or death.

CAUTION! Identifies a potential hazard that could damage equipment or

data.

NOTE: Recommendations or general information that is particular to the

material being presented.

Revision History

vi

WARRANTY STATEMENT

All equipment manufactured by EdgeTech is warranted against defective components and workmanship
for a period of one year after shipment. Warranty repair will be done by EdgeTech free of charge.

Shipping costs are to be borne by the customer. Malfunction due to improper use is not covered in the
warranty, and EdgeTech disclaims any liability for consequential damage resulting from defects in the
performance of the equipment. No product is warranted as being fit for a particular purpose, and there is
no warranty of merchantability. This warranty applies only if:

i. The items are used solely under the operating conditions and in the manner recommended in

Seller's instruction manual, specifications, or other literature.

ii. The items have not been misused or abused in any manner, nor have repairs been attempted

thereon without the approval of EdgeTech Customer Service.

iii. Written notice of the failure within the warranty period is forwarded to Seller and the directions

received for properly identifying items returned under warranty are followed.

iv. The return notice authorizes Seller to examine and disassemble returned products to the extent

Seller deems necessary to ascertain the cause for failure.

The warranties expressed herein are exclusive. There are no other warranties, either expressed or implied,
beyond those set forth herein, and Seller does not assume any other obligation or liability in connection
with the sale or use of said products. Any product or service repaired under this warranty shall be
warranted for the remaining portion of the original warranty period only.

Equipment not manufactured by EdgeTech is supported only to the extent of the original manufacturer's
warranties.

vii

SOFTWARE SERVICE OVERVIEW

EdgeTech provides software services free of charge. This software agreement does not address customer­specified modifications or enhancements. These services may be ordered separately. Furthermore,
EdgeTech software upgrades are meant for the sole use of EdgeTech customers. Any reproduction of
EdgeTech-supplied software or file sharing is strictly prohibited.

Software Updates and Enhancements

EdgeTech customers can download new software releases with all modifications and enhancements from
the EdgeTech ftp site. Major software issues, should they occur, will be reported directly to the customer.
New software releases consist of the following:

• Software enhancements that are not on the price list

• Software fixes and changes

• Product integration

• Documentation updates to on-line help

• Tests for compatibility with other modules

Software patches consist of software that has undergone the following:

• Minor software enhancements

• Software fixes and changes

EdgeTech customers are entitled to contact
to report a difficulty, to discuss a problem or to receive advice on the best way to perform a task. When
contacted, EdgeTech Customer Service will do the following:

• Respond within 24 hours via Telephone, Facsimile, and E-mail Support

• Immediately attend to serious problems affecting operations

• Attempt to find an immediate work-around

EDGETECH CUSTOMER SERVICE by telephone, facsimile, or e-mail

viii

RETURNED MATERIAL AUTHORIZATION

Prior to returning any equipment to EdgeTech, a Returned Material

Authorization (RMA) Number must be obtained from CUSTOMER SERVICE.

RMA Purpose

The RMA Number identifies returned equipment when it arrives at our receiving dock and enables tracking
while at our facility. Refer to RMA number on all documentation and correspondences.

All returned materials must be shipped prepaid. Freight collect shipments will not be accepted. All
equipment should be adequately insured for shipping, but equipment belonging to EdgeTech must be
insured for full value.

If there is more than one item per consignment, include a packing with the shipment. An invoice can
double as a packing slip only when the contents are clearly numbered and identified on the invoice.

Shipper’s Oath:

"I, ______________________________, declare that the articles herein specified are the growth,
produce, or manufacture of the United States; that they were exported from the
United States from the port of _____________________, on or about _______________; that they
are returned without having been advanced in value or improved in condition by any
process of manufacture or any other means; and that no drawback, or allowance has
been paid or admitted hereof."

CAUTION! Never attempt to ship a Portable Topside in its Storm CaseTM

alone. Although rugged, these cases are not intended to be used as
shipping containers and the delicate internal components could be
damaged. Shipping in this manner will void any warranties.

NOTE: All shipping charges shall be the responsibility of the customer,

unless under warranty, as EdgeTech will pay for return shipping.

NOTE: For International Shipments valued over $1000, the following

Shipper's oath must be sent with the invoice.

Signed ______________________________

ix

CUSTOMER SERVICE

Customer service personnel at EdgeTech are always eager to hear from users of our products. Your
feedback is welcome, and is a valuable source of information which we use to continually improve these
products. Therefore, we encourage you to contact EdgeTech Customer Service to offer any suggestions
or to request technical support:

E-mail: [e-mail]

Mail: 4 Little Brook Road

West Wareham, MA 02576

Telephone: [phone]

Facsimile: [phone]

24-Hour Emergency
Technical Support Line: [phone]

NOTE: Please have your system Serial Number available when contacting
Customer Service.

For more information please go to www.EdgeTech.com.

x

COMPANY BACKGROUND

EdgeTech (formerly EG&G Marine Instruments) traces its history in Underwater Data Acquisition and
Processing back to 1966. EdgeTech has designed, developed, and manufactured products, instruments,
and systems — for the acquisition of underwater data, including marine, estuarine, and coastal
applications — for over 50 years.

EdgeTech responds to the needs of the Scientific, Naval, and Offshore communities by providing industry­leading equipment — such as Sub-Bottom Profilers, Side Scan Sonar, Acoustic Releases, USBL Positioning
Systems, and Bathymetric Systems — that have become standards in the industry.

EdgeTech consistently anticipates and responds to future needs with an active Research and Development
Program. Current efforts are focused on adapting new cutting-edge acoustic technology.

xi

TABLE OF CONTENTS

ATTENTION – READ THIS FIRST! ......................................................................................................... iii

HARDWARE VARIATIONS AND COMPATIBILITY .................................................................................. iv

ABOUT THIS DOCUMENT .................................................................................................................... v

Purpose of this Manual ............................................................................................................................. v

Liability ...................................................................................................................................................... v

Warnings, Cautions, and Notes ................................................................................................................. v

Revision History ........................................................................................................................................ v

WARRANTY STATEMENT ................................................................................................................... vi

SOFTWARE SERVICE OVERVIEW ........................................................................................................ vii

Software Updates and Enhancements.................................................................................................... vii

RETURNED MATERIAL AUTHORIZATION .......................................................................................... viii

RMA Purpose ......................................................................................................................................... viii

CUSTOMER SERVICE .......................................................................................................................... ix

COMPANY BACKGROUND .................................................................................................................. x

TABLE OF CONTENTS ......................................................................................................................... xi

LIST OF FIGURES .............................................................................................................................. xiv

LIST OF TABLES ................................................................................................................................ xv

1.0: OVERVIEW ...............................................................................................................................1-1

1.1 Advantages of Full Spectrum CHIRP Technology .......................................................................... 1-1

1.1.1 Compared to Older Technology ............................................................................................. 1-1

1.1.2 Transducer Array .................................................................................................................... 1-2

1.1.3 Resolution ............................................................................................................................... 1-2

1.1.4 Processing Enhancements ...................................................................................................... 1-2

1.1.5 Reduction of Side Lobes and High Repeatability .................................................................... 1-3

1.2 Major Components ....................................................................................................................... 1-3

1.2.1 Deck Unit ................................................................................................................................ 1-5

1.2.2 T/R Box Assembly ................................................................................................................... 1-6

1.2.3 Transducer Array .................................................................................................................... 1-7

1.3 Applications .................................................................................................................................. 1-8

2.0: SPECIFICATIONS .......................................................................................................................2-1

2.1 Deck Unit Specifications................................................................................................................ 2-1

xii

2.1.1 Processor Specifications ......................................................................................................... 2-1

2.1.2 Amplifier Specifications .......................................................................................................... 2-2

2.1.2.1 Power Output ............................................................................................................. 2-3

2.1.2.2 Performance ............................................................................................................... 2-3

2.1.2.3 Construction ............................................................................................................... 2-4

2.1.3 Display, Keyboard, and Mouse Specifications ........................................................................ 2-4

2.2 T/R Box Specifications ................................................................................................................... 2-4

2.3 Technical Drawings ....................................................................................................................... 2-4

2.4 Spider & Array Specifications ........................................................................................................ 2-7

2.5 Technical Drawings ....................................................................................................................... 2-7

KT-216H Specifications: ..................................................................................................................... 2-9

KT-106D Specifications:...................................................................................................................... 2-9

2.5.1 Array Sizes ............................................................................................................................ 2-11

2.6 Signal Cable Specifications .......................................................................................................... 2-18

3.0: CONTROLS & CONNECTIONS .....................................................................................................3-1

3.1 Deck Unit Controls and Indicators ................................................................................................ 3-1

3.2 Deck Unit Connections .................................................................................................................. 3-3

4.0: INSTALLATION ..........................................................................................................................4-1

4.1 Unpacking & Inspecting ................................................................................................................ 4-1

4.2 Topside Installation ....................................................................................................................... 4-2

4.2.1 Power Supply .......................................................................................................................... 4-2

4.2.2 Use of an Uninterruptable Power Supply............................................................................... 4-2

4.2.3 Selecting the Power Amplifier Input Power Voltage .............................................................. 4-2

4.2.4 Changing to a Non-US Power Plug ......................................................................................... 4-2

4.2.5 Navigation Interface ............................................................................................................... 4-3

4.2.6 Deck Unit Placement .............................................................................................................. 4-3

4.3 Hull Mount Array Installation ....................................................................................................... 4-3

4.4 Connecting the System ................................................................................................................. 4-5

5.0: OPERATION ..............................................................................................................................5-1

5.1 Activating the System ................................................................................................................... 5-1

5.2 File Format .................................................................................................................................... 5-1

5.2.1 EdgeTech’s Native JSF Format ................................................................................................ 5-1

xiii

5.2.2 Standard SEG-Y Format .......................................................................................................... 5-1

5.2.3 Palette File Format ................................................................................................................. 5-2

5.3 Triggering and Coupling ................................................................................................................ 5-2

6.0: MAINTENANCE .........................................................................................................................6-1

6.1 Hard Drive Disk ............................................................................................................................. 6-1

6.2 Array Connectors .......................................................................................................................... 6-1

7.0: TROUBLESHOOTING .................................................................................................................7-1

7.1 Freq. Plots and Raw Data Time Series Analysis Using J-STAR ....................................................... 7-1

7.2 System Does Not Operate ............................................................................................................. 7-4

7.2.1 Symptom / Probable Cause .................................................................................................... 7-5

7.2.2 Poor Image Quality or Performance Issues ............................................................................ 7-6

7.3 Sonar Errors .................................................................................................................................. 7-6

A.0: SYSTEM RESTORE .................................................................................................................... A-1

B.0: FAQ: FREQUENTLY ASKED QUESTIONS ..................................................................................... B-1

C.0: NAVIGATION SYSTEMS ............................................................................................................ C-1

C.1 NMEA Approved Sentence Structure ........................................................................................... C-1

C.2 Port Parameters ............................................................................................................................ C-1

C.3 Port Selection ................................................................................................................................ C-2

C.4 Inputs ............................................................................................................................................ C-2

GLL – Geographic Position – Latitude/Longitude ................................................................... C-3

GXY Geographic Position X and Y Coordinates ....................................................................... C-3

GUU – Geographic Position – X and Y Coordinates ................................................................ C-4

GGA – Global Positioning System Fix Data ............................................................................. C-4

RMA – Recommended Minimum Specific Loran-C Data ........................................................ C-5

RMC – Recommended Minimum Specific GNSS Data ............................................................ C-5

VTG – Track Made Good and Ground Speed.......................................................................... C-5

ZDA – Time & Date ................................................................................................................. C-6

HDG - Heading, Deviation and Variation ................................................................................ C-6

EVT – Event * Annotation (EdgeTech Custom) ...................................................................... C-7

EMA: Event, Set Mark & Annotation (EdgeTech Custom) ...................................................... C-8

C.5 Serial Port Connections ................................................................................................................. C-9

C.6 Troubleshooting ............................................................................................................................ C-9

xiv

LIST OF FIGURES

Figure 1-1: Overall System Diagram (2x2 Configuration) .......................................................................... 1-4

Figure 1-2: 3200 Rack Mount Processor .................................................................................................... 1-5

Figure 1-3: T/R Box (Interior & Exterior) .................................................................................................... 1-6

Figure 1-4: Spider Array ............................................................................................................................. 1-7

Figure 1-5: Single Transducer..................................................................................................................... 1-7

Figure 1-6: 2x2 Sea Chest Array ................................................................................................................. 1-7

Figure 2-1: Topside Processor Internals ..................................................................................................... 2-2

Figure 2-2: T/R Box Assembly Drawing - 0007914 ..................................................................................... 2-5

Figure 2-3: T/R Box Wiring Diagram - 0004638 ......................................................................................... 2-6

Figure 2-4: Spider Wiring Diagram - 0009969 ............................................................................................ 2-8

Figure 2-5 : KT-106 Non-Symmetrical Array Configurations .................................................................... 2-10

Figure 2-6: Deck Cable, T/R Box, and Spider Wiring Diagram (2x2 Configuration) ................................. 2-12

Figure 2-7: Single Transducer Drawing - 0013579 ................................................................................... 2-13

Figure 2-8: 2x2 Transducer Configuration - 0011720 .............................................................................. 2-14

Figure 2-9: 3x3 Transducer Configuration - 0015753 .............................................................................. 2-15

Figure 2-10: 4x4 Transducer Configuration - 0013960 ............................................................................ 2-16

Figure 2-11: 5x5 Transducer Configuration - 0016713 ............................................................................ 2-17

Figure 2-12: Topside Unit Deck Cable for Hull Mount Systems (Female) Amphenol #97-3106A-20-33F2-18

Figure 2-13: Female Marshal Connector – 86-5FC (Deck Cable to T/R Box Connection) ........................ 2-19

Figure 2-14: Male Marshal Connector – 86-5MC (T/R Box to Deck Cable Connection) .......................... 2-19

Figure 2-15: Deck Cable Schematic - 0002976 ......................................................................................... 2-20

Figure 3-1: Topside Front Panel Controls and Connections....................................................................... 3-2

Figure 3-2: Topside Rear Panel Controls and Connections ........................................................................ 3-4

Figure 3-3: Rear Panel Schematic - 0004957 ............................................................................................. 3-5

Figure 7-1: Graph Display Tab .................................................................................................................... 7-2

xv

LIST OF TABLES

Table 2-1: Overall Physical Deck Unit Specs .............................................................................................. 2-1

Table 2-2: Processor Specifications ........................................................................................................... 2-1

Table 2-3: Power Amp Specifications: Power Output ................................................................................ 2-3

Table 2-4: Power Amp Specifications: Performance ................................................................................. 2-3

Table 2-5: Power Amp Specifications: Construction .................................................................................. 2-4

Table 2-6: Display, Keyboard, and Mouse Specifications .......................................................................... 2-4

Table 2-7: Physical Specifications of T/R Box ............................................................................................. 2-4

Table 2-8: General Array Specifications ..................................................................................................... 2-7

Table 2-9: KT-216A2H Array Specifications................................................................................................ 2-9

Table 2-10: KT-106D Array ......................................................................................................................... 2-9

Table 2-11: Array Size vs. Expected Signal-to-Noise Ratio (SNR) ............................................................. 2-11

Table 2-12: Signal Cable Specifications .................................................................................................... 2-18

Table 2-13: Deck Cable Pinouts................................................................................................................ 2-18

Table 2-15: Deck CABLE Connector Pinouts............................................................................................. 2-19

Table 4-1: AC Power Cord Wiring .............................................................................................................. 4-2

Table 7-1: Troubleshooting Causes and Solutions ..................................................................................... 7-5

Table 7-2: Image Quality or Performance Issues ....................................................................................... 7-6

Table 7-3: Troubleshooting Sonar Errors ................................................................................................... 7-6

Table C-1: NMEA Approved Sentence Structure ....................................................................................... C-1

Table C-2: Port Parameters ........................................................................................................................ C-1

Table C-3: GLL Geographic Position – Latitude/Longitude ........................................................................ C-3

Table C-4: GXY Geographic Position X and Y Coordinates ......................................................................... C-3

Table C-5: GUU – Geographic Position – X and Y Coordinates .................................................................. C-4

Table C-6: GGA – Global Positioning System Fix Data ............................................................................... C-4

Table C-7: VTG – Track Made Good and Ground Speed ............................................................................ C-5

Table C-8: ZDA – Time and Date ................................................................................................................ C-6

Table C-9: HDG: Heading, Deviation, and Variation .................................................................................. C-6

Table C-10: EVT – Event * Annotation (EdgeTech Custom) ....................................................................... C-7

Table C-11: EMA: Event, Set Mark & Annotation ...................................................................................... C-8

Table C-12: 9 Male Pin Out ........................................................................................................................ C-9

1-1

1.0: OVERVIEW

The 3300 Hull Mounted Sub-Bottom Profiler (3300-HM SBP) Full Spectrum Sonar is a versatile, wideband,
FM sub-bottom profiler that generates cross-sectional images of the seabed and collects digital normal
incidence reflection data over a wide variety of frequency ranges.

The system transmits an FM pulse that is linearly swept over a full spectrum frequency range (also called
a “CHIRP pulse”). The reflections, measured by the system, are displayed as shades of gray or color on a
computer monitor. Data is stored real-time into a large capacity hard drive, and can be archived to a
CD/DVD ROM or thumb drive.

1.1 Advantages of Full Spectrum CHIRP Technology

EdgeTech’s Full Spectrum Technology has several distinct advantages over conventional sub-bottom
systems, including increased penetration and higher resolution. The tapered wave form spectrum results
in images that have virtually constant resolution with depth.

The 3300-HM SBP system generates virtually no side lobes, due to the wide bandwidth of the sweep
frequency. This bandwidth has an effect of smearing the side lobes of the transducer, resulting in a beam
pattern with almost no side lobes.

Because the FM pulse is generated by a digital-to-analog converter with a wide dynamic range and a
transmitter with linear components, the energy, amplitude, and phase characteristics of the acoustic
pulse can be precisely controlled. This precision produces the high repeatability and signal definition
required for sediment classification.

The operating frequency range is determined by the acoustic characteristics and mounting schematic of
the transducers. EdgeTech offers various transducer configurations that can transmit acoustic pulses with
different center frequencies and bandwidths. Pulse selection is made by the operator while profiling to
achieve the best imagery.

For detailed information regarding configuration options, contact

EDGETECH CUSTOMER SERVICE.

1.1.1 Compared to Older Technology

EdgeTech’s 3300-HM SBP Full Spectrum sonar system transmits FM pulses. FM pulses have been used in
radar and sonar systems for over 40 years and are sometimes referred to as CHIRP or Swept-frequency
pulses. The advent of modern digital signal processing components has provided tools for realizing the
potential of these methods.

Full Spectrum signal processing technology does not use a conventional matched filter (the typical
correlation filter used to compress FM signals) to process wide band signals. It uses proprietary amplitude
and phase weighting functions for the transmitted pulse and a pulse compression filter that maximizes
the Signal-to-Noise Ratio (SNR) of the acoustic images over a wide band of operating frequencies. These

1.0: OVERVIEW 1-2

functions provide a significant SNR improvement in the acoustic image over other impulse and CHIRP
sonar with band-limited components that are limited in dynamic range.

1.1.2 Transducer Array

Acoustic projectors in the 3300-HM SBP system are constructed from wideband, piston-type transducers
and the acoustic receivers are a discrete line array of PZT crystals. The acoustic hull-mounted transducers
are designed for profiling at ship speeds varying from zero (drifting) to 7 knots.

The transducer array receives the low amplitude sub-bottom reflections, while a 24-dB gain preamplifier
amplifies and drives the signal through a 50-meter cable. A software-controlled, programmable gain
amplifier provides a final amplification stage before the signal is digitized with a 16-bit Analog-to-Digital
(A/D) converter at a sampling rate of 24, 40, 50, and 66 kHz. To achieve the theoretical temporal resolution
predicted by the inverse of the bandwidth, the FM pulse is compressed using a digital compression filter.

The correlation process is implemented in real-time, with forward and inverse Fast Fourier Transforms.
The compressed pulse resulting from this signal processing procedure has a time duration approximately
equal to the inverse of the bandwidth of the FM pulse.

1.1.3 Resolution

High temporal resolution allows for the measurement of fine layering. Good resolution is an important
factor in sediment classification, as it provides a more precise impulse response of the sediment, and, in
turn, a realistic picture of the true geologic variability of the seafloor and accurate determination of the
depositional processes. When the time duration of the processed pulse is too large, individual reflections
will be lumped together with random phase causing constructive and destructive interference, thereby
making it difficult to estimate the impedance and examine the geologic processes.

1.1.4 Processing Enhancements

In addition to the resolution improvement, correlation processing achieves a signal processing gain over
the background noise. This gain is approximately ten times the log of the time-bandwidth product. This
improvement is due to the signal having a time duration longer than the inverse of the bandwidth, thus
increasing signal energy without increasing the power of the outgoing pulse. To equal the typical
performance of the Full Spectrum sonar pulse, conventional pulse sonar would have to operate at a peak
pulse power of 100 times greater than the Full Spectrum pulse with a time-bandwidth product of 100.

Another important feature of the Full Spectrum Sub-Bottom Sonar is that the computer generates a signal
that optimizes the performance of the system. The sonar contains many components, each with a unique
dynamic range and linearity characteristic, which are frequency dependent.

In addition to this, the amplitude spectrum of the outgoing pulse is chosen to be approximately Gaussian
in shape in order to limit the side lobe level and temporal resolution losses due to attenuation. As a
wavelet with a Gaussian-shaped spectrum is attenuated by the sediment, energy is lost but its bandwidth

1-3

is nearly preserved. Thus, even after being attenuated by sand, the acoustic pulse has approximately the
same resolution as an un-attenuated pulse.

1.1.5 Reduction of Side Lobes and High Repeatability

Full Spectrum sonar has the unique ability to reduce side lobes in the effective transducer aperture. The
wide bandwidth of the sweep frequency has the effect of smearing the side lobes of the transducer and
thus achieving a beam pattern with virtually no side lobes. The effective spatial beam width obtained after
processing the 2-10 kHz signal is 20 degrees measured to -3db points.

Since the transmitted Full Spectrum pulse is highly repeatable, and its peak amplitude is precisely known,
the sediment reflectivity values can be estimated from the peak pulse amplitude measurements of the
bottom returns.

1.2 Major Components

The hull mounted configuration consists of the topside unit, deck cable, T-R box, spider box assembly, and
the transducer arrays (see an example of a 2x2 system configuration is shown in

FIGURE 1-1.

1.0: OVERVIEW 1-4

Figure 1-1: Overall System Diagram (2x2 Configuration)

1.2.1 Deck Unit

LCD Monitor

19-inch Rack

Power Amplifier

DISCOVER Software

Keyboard

Trackball

3200-XS Topside Processor

1-5

The Deck Unit consists of a processor, amplifier, and monitor as shown in
Mount enclosure consists of a computer-based controller containing a Sonar Interface Board (SIB). The
SIB stores the transmitted waveform and the correlation filter, and performs the correlation processing
and spherical range correction. At periodic intervals, the SIB sends the transmitted waveform to the 16­bit digital-to-analog converter, which generates an analog pilot signal that is amplified by a 2 kW power
amplifier. This amplifier drives the transducer.

The acoustic signal returns from the seafloor are measured by the receiving arrays, and are then increased
by a preamplifier. The output of the preamplifier is connected via the underwater signal cable to a
digitally-controlled amplifier on the sub-bottom board (mounted on the SIB) before being sampled by a
16-bit analog-to-digital converter. The SIB board performs the correlation processing, corrects for
spherical spreading, and transfers the data to the system board.

Figure 1-2: 3200 Rack Mount Processor

FIGURE 1-2. The 19-inch Tack

1.0: OVERVIEW 1-6

Connect to array T/R Box

The DISCOVER Sub-Bottom software is supported on Windows 7 OS. The data and control connections to
the DISCOVER Sub-Bottom program are entirely through TCP/IP connections.

EdgeTech’s Full Spectrum sonar systems employ advanced CHIRP technology to obtain high resolution,
low-noise data records. EdgeTech’s advanced CHIRP technology employs long-duration, wide-band,
frequency-modulated transmit pulses. Return sonar echo data is processed to remove the FM carrier, and
produce high-resolution images of the echo field. DISCOVER Sub-Bottom allows monitoring of this normal,
de-CHIRPed, sub-bottom data, as well as raw, CHIRPed data. This latter data type is often useful for
diagnostic purposes.

For compatibility with other EdgeTech products, the DISCOVER Sub-Bottom program interfaces to a
second program that is run in the background called sonar.exe. Sonar.exe interfaces with both the SIB and
the analog interface boards to generate and transmit CHIRP pulses. A startup file launches the sonar.exe
program automatically every time the system is booted.

The 3300-HM SBP interfaces with the ship’s Navigation (GPS, IMU, etc), triggers, motion and heave
sensors, echo sounder, and printers.

The 3300-HM SBP’s computer-based controller and amplifier components are mounted in a rugged
Optima Case. The computer-based controller and amplifier can be removed from Optima case and
installed in a 19-inch rack.

1.2.2 T/R Box Assembly

The T/R Box connects the topside to the transducers array. It contains a pre-amp, a matching transformer,
and the T/R switch. See

FIGURE 1-3 below:

3300 HULL MOUNT SUB-BOTTOM PROFILER 0016732_REV_C

Figure 1-3: T/R Box (Interior & Exterior)

1-7

1.2.3 Transducer Array

The transducers for the 3300-HM SBP are mounted in a two-dimensional array inside a closed well on
board a survey vessel. These transducers act as both projectors and hydrophones.

EdgeTech offers a range of transducer arrays, each designed to provide various beam widths. In general,
lower operating frequencies require multiple receiving arrays and larger transducers, therefore requiring
different array sizes.

Figure 1-4: Spider Array

Figure 1-6: 2x2 Sea Chest Array

Figure 1-5: Single Transducer

1.0: OVERVIEW 1-8

NOTE: Each transducer is fitted with an 81 cm (32 in.) pigtail with a single

pin (2 contacts) connectors. All Transducer Cables connect to a T/R Box.

1.3 Applications

The 3300-HM SBP has the unique ability to strip-away the world’s oceans during imaging and provide high
resolution sub-bottom images.

This tool lends itself to various tasks that include:

• Imaging fluidized mud to a resolution of 8 cm

• Sediment classification

• Buried pipeline and cable location and routing

• Dredging studies for inlets

• Scour/erosion surveys in rivers and streams

• Marine geotechnical surveys

• Bridge erosion surveys

• Hazardous waste target location

• Geological surveys

• Archeological surveys

• Imaging biologics in water column

• Mapping shellfish populations

• Beach re-nourishment

• Military and Offshore Oil applications

• Full ocean depth sub-bottom imaging

3300 HULL MOUNT SUB-BOTTOM PROFILER 0016732_REV_C

2-1

Temperature

0 to 40°C (32 to 104°F)

Portable aluminum case suitable for transit. Unit can be
Size

50W x 60D x 33H cm (19.5x23.5x13 in)

Weight

46 kg (102 lbs.)

Size

76L x 71W x 50H cm (30x28x20 in)

Weight

82 kg (330 lbs.)

Material

Sealed high impact polyurethane case

Main Processor

Intel I7 Quad Core 3.4GHz 8MB Cache

Memory

8GB DDR4 RAM

Hard drive

500GB capacity minimum (operating system)

CDRW

10x4x32 min speed

Operating System

Windows 7 64 bit

Input Power

120 or 220 VAC auto sense

Front Panel: (2) USB2

(4) port RS-232

Analog Input

16-bit resolution, 200 kHz max. sampling rate

Analog Output

16-bit resolution, 200 kHz max. sampling rate

2.0: SPECIFICATIONS

The 3300-HM SBP system is composed of a deck unit, T/R Box, and hull-mounted transducer array. This
section details the sub-components of the system and provides their specifications. For information
related to the provided DISCOVER software, refer to 0019800 in the Manual Folder.

2.1 Deck Unit Specifications

The Deck Unit is composed of a computer processor, trackball, keyboard, LCD monitor, and a power
amplifier, as shown in

2-1, and the minimum specifications for the individual parts are given in the sub-sections that follow.

SPEC TYPE SPECIFICATION VALUE

FIGURE 1-2. The physical specifications for the entire deck unit are provided in TABLE

Environment

Enclosure

Shipping Containers

Humidity 5% to 95% relative

Vibration Normal ship environment

removed from case and mounted in a 19” rack.

Deck Unit (No topside Processor)

Table 2-1: Overall Physical Deck Unit Specs

2.1.1 Processor Specifications

SPECIFICATION VALUE

I/O

Data Acquisition
SIB & A/D-D/A

Rear Panel: (2) USB2 (2) USB3.1
(2) USB3 (2) Ethernet

Table 2-2: Processor Specifications