S
9110-N-11-02 802.11bgn WLAN Module
R
Data Sheet
VVeerrssiioonn 11..4488
Sep
tember 2011
2107 N. First Street, #680
n Jose, CA 95131.
Sa
Tel: (408) 748-3385
Fax: (408) 705-2019
Email: info@redpinesignals.com
bsite: www.redpinesignals.com
We
Redpine Signals, Inc. Proprietary and Confidential
Data Sheet
Overview
h
e RS9110-N-11-02 module is a
T
complete IEEE 802.11bgn Wi-Fi client
device with an integrated MAC,
Baseband processor, and RF transceiver
with power amplifier. Based on the
Redpine Signals RS9110-LI MAC/BBP
chip, the module provides a complete
end-to-end solution for low-power
WLAN applications. It includes a multithreaded processor and a rich set of
peripheral interfaces. It can connect to
a host processor through SDIO and SPI
interfaces.
Applications:
• VOIP handsets
• Interactive remote control devices
• Industrial automation and telemetry
• MP3 music and MP4 video players
• Digital cameras and camcorders
Device Features:
• Conforms to IEEE 802.11b/g/e/i
standards, single-stream 802.11 n
• 802.11n MAC features for high user
throughput
• 802.11n Space Time Block Code
(STBC) support for extended range
and higher throughput
• Host interface through SDIO and SPI
• Bluetooth coexistence
• Integrated multi-threaded processor
• TCP checksum offloading
• Rich set of peripherals – UART, SPI,
I2C, GPIO, and timers
• 2.4 GHz, 802.11n RF transceiver with
high performance power amplifier
• Complete WLAN software along with
host driver for various operating
systems such as Windows XP, Linux,
Windows CE
• Single supply 3.1 to 3.6 V operation
RS9110-N-11-02 System Block Diagram
T/R
Switch
Balun
3.3V
RF Transce iver
+
PA
Frequency Reference
RS9110-LI
Host
Interface
EEPROM
RS9110-N-11-02
Periphe ral
I/O
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Data Sheet
a
of Contents
ble
T
1
Detailed Feature List ............................................................ 7
:
1.1: Host Interfaces...................................................................... 7
1.2: WLAN .................................................................................... 7
1.2.1: MAC .............................................................................................. 7
1.2.2: Baseband Processing.................................................................... 7
1.2.3: RF Transceiver.............................................................................. 7
1.3: Multi-Threaded Processor ...................................................... 7
1.4: Peripherals............................................................................ 8
1.5: Coexistence ........................................................................... 8
1.6: Software ............................................................................... 8
1.7: Compliance and Certification.................................................. 8
2: Package Description ............................................................. 9
2.1: Top View ............................................................................... 9
2.2: Bottom View.......................................................................... 9
2.3: Package Dimensions ............................................................ 10
2.4: Recommended Reflow Profile............................................... 11
2.5: Baking Instructions ............................................................. 11
3: Pin Description ................................................................... 12
3.1: Module Pinout...................................................................... 12
3.2: Pin Description .................................................................... 12
4: Electrical Characteristics .................................................... 19
4.1: Absolute Maximum Ratings.................................................. 19
4.2: Recommended Operating Conditions .................................... 19
4.3: DC Characteristics – Digital I/O Signals ............................... 19
4.4: AC Characteristics – Digital I/O Signals................................ 20
4.4.1: SDIO Interface ........................................................................... 20
4.4.1.1: Full Speed Mode.................................................................... 20
4.4.1.2: High Speed Mode .................................................................. 21
4.4.2: SPI Interface .............................................................................. 21
4.4.2.1: Full Speed Mode.................................................................... 22
4.4.2.2: High Speed Mode .................................................................. 22
4.4.3: Reset Timing............................................................................... 23
4.4.4: JTAG Interface............................................................................ 24
5: Module Power Consumption ............................................... 25
6: Performance Specifications ................................................ 26
6.1: Wireless Specifications ........................................................ 26
6.2: Receive Characteristics........................................................ 26
6.2.1: Sensitivity................................................................................... 26
6.3: Standards Compliance ......................................................... 26
7: Software Details................................................................. 28
7.1: Architecture ........................................................................ 28
7.2: Details................................................................................. 28
7.2.1: 802.1x Supplicant....................................................................... 29
7.2.2: Configuration Utility ................................................................... 29
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pine Signals, Inc. Proprietary and confidential Page 3
Data Sheet
7.2.3: WLAN Driver ............................................................................... 29
7.
2.4: HAL- Hardware Abstraction Layer............................................... 29
7.2.5: Upper MAC .................................................................................. 29
7.2.6: Lower MAC.................................................................................. 30
7.3: OS Support .......................................................................... 30
8: Ordering Information ......................................................... 31
8.1: Contact Information ............................................................ 31
8.2: Device Ordering Information................................................ 31
8.2.1: Device Packaging........................................................................ 31
8.3: Collateral............................................................................. 32
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pine Signals, Inc. Proprietary and confidential Page 4
Data Sheet
Ta
ble
of Figures
i
gure 1: Top View of the Module ................................................................. 9
F
Figure 2: Bottom View of the Module ........................................................... 9
Figure 3: Package and Pad dimensions ...................................................... 10
Figure 4: Reflow Profile.............................................................................. 11
Figure 5: Pinout of the Module ................................................................... 12
Figure 6: Interface Timings – SDIO Interface Full-Speed Mode.................. 20
Figure 7: Interface Timings – SDIO Interface High-speed Mode ................ 21
Figure 8: SPI Protocol ................................................................................ 22
Figure 9: Interface Timings – SPI Interface Full-Speed Mode .................... 22
Figure 10: Interface Timings – SPI Interface High-Speed Mode................. 23
Figure 11: Reset Pin Timing Diagram ......................................................... 24
Figure 12: Interface Timings – JTAG Interface........................................... 24
Figure 13: RS9110-N-11-02 Software Architecture .................................... 28
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pine Signals, Inc. Proprietary and confidential Page 5
Data Sheet
List of Tables
a
ble 1: Absolute Maximum Ratings........................................................... 19
T
Table 2: Recommended Operating Conditions ............................................ 19
Table 3: Input/Output DC Characteristics .................................................. 20
Table 4: AC Characteristics – SDIO Interface Full-Speed Mode .................. 20
Table 5: AC Characteristics – SDIO Interface High-Speed Mode................. 21
Table 6: AC Characteristics – SPI Interface Full-Speed Mode..................... 22
Table 7: AC Characteristics – SPI Interface High-Speed Mode.................... 23
Table 8: AC Characteristics – JTAG Interface ............................................. 24
Table 9: Wireless Specificiation.................................................................. 26
Table 10: Receive sensitivity...................................................................... 26
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pine Signals, Inc. Proprietary and confidential Page 6
Data Sheet
Version 1.4
8
1: D
1.1
etailed Feature List
: Host Interfaces
• SDIO
• Version 2.0-compatible
• Supports SD-SPI, 1-bit, and 4-bit SDIO modes
• Operation up to a maximum clock speed of 50 MHz
• SPI Interface
• Operation up to a maximum clock speed of 80 MHz
1.2: WLAN
1.2.1: MAC
• Conforms to IEEE 802.11b/g/n/e/i standards for MAC 1
• Dynamic selection of fragment threshold, data rate, and antenna
depending on the channel statistics
• Hardware accelerators for WEP 64/128-bit and AES
• WPA, WPA2, WPA2-Enterprise, Voice Personal, WPS (PIN/PBC),
• WMM and WMM-PS support
• AMPDU and AMSDU aggregation for high performance
• Firmware downloaded from host based on application
1.2.2: Baseband Processing
• Supports DSSS (1, 2 Mbps) and CCK (5.5, 11 Mbps) modes
• Supports all OFDM data rates (6, 9, 12, 18, 24, 36, 48, and 54 Mbps)
• Supports IEEE 802.11n single-stream modes with data rates up to 65
Mbps
• Supports long, short, and HT preamble modes
• High-performance multipath compensation in OFDM, DSSS, and CCK
modes
1.2.3: RF Transceiver
• Highly integrated 2.4 GHz transceiver with direct conversion architecture
• Receiver with 38 dB RF selectable gain range and 60 dB baseband variable
gain range
• Power amplifier with 17 dBm maximum output power
• Integrated LNA, BPF, and T/R switch
1.3: Multi-Threaded Processor
• RISC-based pipelined architecture
1
Compliance to inter-operability specifications based on the standards
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ne Signals, Inc. Proprietary and confidential Page 7
• Non-blocking thread operation
• P
rocessing capability of up to 118 million instructions per second (MIPS)
at 118 MHz
1.4: Peripherals
• I2C interface with support for multiple masters and high-speed mode
• SPI peripheral interface
• UART interface with programmable baud-rate generator
• GPIO interface
1.5: Coexistence
• Flexible BT coexistence mechanism with 3-wire hardware interface
1.6: Software
• Drivers for Windows Embedded CE, Windows XP and Linux
• Control and management GUI
Data Sheet
• Embedded software for complete WLAN functionality including 802.11n
aggregation and Block-ACK, auto rate adaptation, security, and QoS
modes
1.7: Compliance and Certification
• Reference design certified for Wi-Fi 802.11n, WPA, WPA2, WPA2Enterprise, WMM, WMM-PS, WPS, Voice-Personal
• FCC, IC, and CE certified
• RoHS (Restriction of Hazardous Substances) compliant
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pine Signals, Inc. Proprietary and confidential Page 8
ackage Description
2: P
2
.1: Top View
Data Sheet
2: Bottom View
2.
Figure
Figure
1: Top View of the Module
2: Bottom View of the Module
Red
pine Signals, Inc. Proprietary and confidential Page 9
Data Sheet
2.3: P
ackage Dimensions
T
he module measures 13.7 x 12.9 x 1.7 mm.
gure
Fi
Red
pine Signals, Inc. Proprietary and confidential Page 10
3: Package and Pad dimensions