Ebyte E73 2G4M04S1B, E73 2G4M04S1A, E73 Series, E73 2G4M04S1D, E73 2G4M08S1C User Manual
nRF52832/nRF52810/nRF52840/nRF51822
Wireless Module
E73 Series
This manual may be modified based on product upgrade, please refer to the latest version.
All rights to interpret and modify this manual belong to Chengdu Ebyte Electronic Technology Co., Ltd.
User Manual
Copyright ©2012–2017，Chengdu Ebyte Electronic Technology Co., Ltd. 1
Version
Date
Description
Issued by
1.00
2017/12/06
Initial version
huaa
1.10
2017/12/06
Name changed
huaa
1.20
2018/05/23
Content added
Huaa
1.30
2018/08/01
E73(2G4M08S1C) added
Huaa
Brief Introduction
E73 series are wireless Bluetooth modules designed by Chengdu Ebyte which feature small size, low power consumption, built in PCB
antenna and IPX interface. E73 series adopt the originally imported RFIC nRF52832/ nRF52810/nRF52840 of NORDIC, supporting BLE 4.2
and BLE 5.0. The chip has high-performance ARM CORTEX-M4F kernel and other peripheral resources, such as UART, I2C, SPI, ADC, DMA,
PWM etc. The module led out all the IO port of nRF52832/nRF52810 and most IO Port of nRF52840 for multilateral development. For more
details, please refer to the datasheet of NORDIC. For E73 (2G4M04S1D), We used 16MHz high precision low temperature drift active
crystal oscillator and other model used 32MHz crystal oscillator, which ensure its industrial characteristics and stability performance
Compared with Bluetooth 4.2, Bluetooth 5 has the following advantages: 2x air data bandwidth(2Mbps), The broadcasting capacity is
increased(x8). Broadcasting extension makes the data length increase to 251 bytes which enables more effective data transmission in
beacon applications. 5210 applies S112 protocol stack which has been strictly tested and upgraded. It supports 196kB Flash/24kB RAM of
nRF52810 SoCs. S112 protocol stack only take 100kbB flash which means it saves enough space for massive low consumption Bluetooth
applications and provides reliable support for upgrade for OTA applications.
E73 series are hardware platform without firmware, so users need to conduct a secondary development. This series have maximized
the RF characteristics of chip. The built-in 32.768K real-time clock crystal oscillator can benefit users in programming(Note:
E73(2G4M08S1C) did not built in the crystal oscillator.)
Model
Frequency
Transmitting power
Distance(PCB/IPX)
Packing
Antenna
E73 (2G4M04S1B)
2.4GHz
4dBm
100m
SMD
PCB/IPX
E73 (2G4M04S1A)
2.4GHz
4dBm
110m
SMD
PCB/IPX
E73 (2G4M04S1D)
2.4GHz
4dBm
110m
SMD
PCB/IPX
E73(2G4M08S1C)
2.4GHz
8dBm
120m
SMD
Ceramic antenna
Copyright ©2012–2017，Chengdu Ebyte Electronic Technology Co., Ltd. 2
目录
1.
Technical Parameter
....................................................................................................................................................................
4
1.1. Internal resources
..............................................................................................................................................................
4
1.2. E73 (2G4M04S1B)
..............................................................................................................................................................
4
1.3. E73 (2G4M04S1A)
.............................................................................................................................................................
4
1.4. E73 (2G4M04S1D)
.............................................................................................................................................................
5
1.5. E73(2G4M08S1C)
...............................................................................................................................................................
5
1.6. Parameter notes
................................................................................................................................................................
5
2. Mechanical Properties
................................................................................................................................................................
6
2.1. E73 (2G4M04S1B)/E73 (2G4M04S1A)
.........................................................................................................................
6
2.1.1. Dimension
.................................................................................................................................................................
6
2.1.2 Pin Definition
............................................................................................................................................................
6
2.2. E73 (2G4M04S1D)
.............................................................................................................................................................
8
2.2.1. Dimension
.................................................................................................................................................................
8
2.3. E73(2G4M08S1C)
...............................................................................................................................................................
9
2.3.1 dimension
..................................................................................................................................................................
9
2.3.2 Pin definition
...........................................................................................................................................................
10
3. Development and Application
...............................................................................................................................................
11
4. Antenna Type
..............................................................................................................................................................................
11
4.1. E73 (2G4M04S1A)/E73 (2G4M04S1B)
.......................................................................................................................
11
4.2. E73 (2G4M04S1D)
...........................................................................................................................................................
11
5. Production Guidance
................................................................................................................................................................
12
5.1. Reflow Soldering Temperature
...................................................................................................................................
12
5.2. Reflow Soldering Curve
.................................................................................................................................................
12
6. FAQ
................................................................................................................................................................................................
13
Copyright ©2012–2017，Chengdu Ebyte Electronic Technology Co., Ltd. 3
6.1. Communication range is too short
............................................................................................................................
13
6.2. Module is easy to damage
...........................................................................................................................................
13
6.3. Burn firmware
...................................................................................................................................................................
13
7. Schematic Diagram
...................................................................................................................................................................
14
7.1. E73 (2G4M04S1A)
...........................................................................................................................................................
14
7.2. E73 (2G4M04S1B)
...........................................................................................................................................................
14
7.3. E73 (2G4M04S1D)
...........................................................................................................................................................
15
7.4. E73 (2G4M08S1C)
...........................................................................................................................................................
15
8. Important Notes
........................................................................................................................................................................
16
9. About Us
......................................................................................................................................................................................
16
Copyright ©2012–2017，Chengdu Ebyte Electronic Technology Co., Ltd. 4
1. Technical Parameter
Model
IC
Antenna
Size
Net weight
Operating
temperature
Operating
humidity
Storage
temperature
E73 (2G4M04S1B)
nRF52832-QFAA
PCB/IPX
17.5 * 28.7 mm
1.8±0.1g
-40 ~ 85℃
10% ~ 90%
-40 ~ 125°C
E73 (2G4M04S1A)
nRF52810-QFAA
PCB/IPX
17.5 * 28.7 mm
1.8±0.1g
-40 ~ 85℃
10% ~ 90%
-40 ~ 125°C
E73 (2G4M04S1D)
nRF51822
PCB/IPX
17.5 * 28.7 mm
1.8±0.1g
-40 ~ 85℃
10% ~ 90%
-40 ~ 125°C
E73(2G4M08S1C)
nRF52840-QIAAC0
Ceramic antenna
13*18*0.8mm
1.02±0.1g
-40 ~ 85℃
10% ~ 90%
-40 ~ 125°C
1.1. Internal resources
Model
IC
FLASH
RAM
Core
E73(2G4M04S1B)
nRF52832-QFAA/QFN48
512KB
64KB
ARM® Cortex™-M4F
E73(2G4M04S1A)
nRF52810-QFAABB/QFN48
192KB
24KB
ARM Cortex®-M4
E73 (2G4M04S1D)
nRF51822-QFAA/QFN48
256KB
16KB
ARM® Cortex™ M0
E73(2G4M08S1C)
nRF52840-QIAAC0/ aQFN ™ 73
1024KB
256KB
ARM® Cortex ® -M4
1.2. E73 (2G4M04S1B)
Parameter
Min
Type
Max
Unit
Transmitting current
13
1415mA
Receiving current
456
mA
Turn-off current
1
23μA
Transmitting power
3.8
4
4.3
dBm
Receiving sensitivity
-94
-95
-96
dBm
Recommended band
2379
2430
2496
MHz
Voltage supply
1.8
3.3
3.6
V
Communication level
1.8
3.3
3.6
V
1.3. E73 (2G4M04S1A)
Parameter
Min
Typ
Max
Unit
Transmitting current
171820
mA
Receiving current
121314
mA
Turn-off current
123
μA
Transmitting power
3.744.2
dBm
Receiving sensitivity
-94
-95
-96
dBm
Recommended band
2379
2430
2496
MHz
Voltage supply
1.8
3.3
3.6
V
Communication level
1.8
3.3
3.6
V
Copyright ©2012–2017，Chengdu Ebyte Electronic Technology Co., Ltd. 5
1.4. E73 (2G4M04S1D)
Parameter
Min
Typ
Max
Unit
Transmitting current
13.0
14.0
15.4
mA
Receiving current
11.3
12.6
13.8
mA
Turn-off current
0.5
1.0
2.5
μA
Transmitting power
3.6
4.0
4.5
dBm
Receiving sensitivity
-95.4
-96.0
-96.8
dBm
Recommended band
2379
2430
2496
MHz
Voltage supply
2.1
3.3
3.6
V
Communication level
2.1
3.3
3.6
V
1.5. E73(2G4M08S1C)
Parameter
Condition
Min
Typ
Max
Unit
Transmitting current
TX only run current (DC/DC, 3 V) PRF= +8 dBm
17.05
mA
TX only run current (DC/DC, 3 V) PRF= +4 dBm
12.68
TX only run current (DC/DC, 5 V, REG0 out = 3.3 V)PRF= 0dBm
7.25
TX only run current (DC/DC, 3 V)P RF = 0 dBm
7.63
Receiving current
RX only run current (DC/DC, 3 V) 1 Mbps / 1 Mbps BLE
7.71
mA
RX only run current (DC/DC, 3 V) 2 Mbps / 2 Mbps BLE
8.27
Transmitting power
-
7
dBm
Receiving sensitivity
-
-103 dBm@BLE 125kbps（long distance mode）、 -95 dBm@BLE 1M
dBm
Recommended band
-
2360
2402
24500
MHz
Voltage supply
-
1.7
3.3
5.5
V
Communication level
-
0.7 X VDD
VDD
V
Note: The current is the current of the whole machine. 64 MHz CPU clock, 52 μA/MHz running from flash memory.
1.6. Parameter notes
1 When designing current supply circuit, 30% margin is recommended to be remained so as to ensure long-term stable operation of
the whole module.
2. The current at the instant of transmitting may be high, but the total energy consumed may be lower due to very short transmitting
time.
3. When using external antenna, the impedance matching degree at different frequency points between antenna and module may
affect the transmitting current at different levels.
4. The current consumed when the RF chip is only working at receiving mode is called as receiving current. The tested receiving current
may be higher for some RF chips with communication protocol or when the developers have loaded their own protocol to the whole
module.
5. The current at pure receiving mode is at mA level. To achieve µA level receiving current, the users need to manage it through
firmware development.
6. The turn-off current is always lower than the current consumed when the power supply source of the whole module is at no-load
status.
7. Each LRC component has ±0.1% error, and the error will accumulate since multiple LRC components are used in the whole RF circuit,
and the transmitting current will be different at different modules.
8. The power consumption can be lowered by lowering the transmitting power, but the efficiency of the internal PA will be decreased
by lowering transmitting power due to various reasons
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