Ebyte E28-2G4M27S User Manual

E28-2G4M27S User Manual

SX1280 2.4GHz 27dBm SPI High Speed LoRa Module

Chengdu Ebyte Electronic Technology Co.,Ltd. E28-2G4M27S User Manual

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CONTENTS

1. Product Overview ....................................................................................................................................................................................... 2

1.1 Brief Introduction ............................................................................................................................................................................ 2

1.2 Feature .............................................................................................................................................................................................. 2

1.3 Application ........................................................................................................................................................................................ 2

2. Technical Parameters ................................................................................................................................................................................. 3

2.1 Limit parameter ............................................................................................................................................................................... 3

2.2 Operating parameter ....................................................................................................................................................................... 3

3 Dimension and Pin Definition .................................................................................................................................................................. 4

4 Basic Operation ............................................................................................................................................................................................ 5

4.1 Hardware design .............................................................................................................................................................................. 5

4.2 Software editing ............................................................................................................................................................................... 6

5 Basic Application ......................................................................................................................................................................................... 6

5.1 Circuit Diagram ............................................................................................................................................................................ 6

6. FAQ ................................................................................................................................................................................................................ 7

6.1 Communication range is too short .............................................................................................................................................. 7

6.2 Module is easy to damage ............................................................................................................................................................. 7

6.3 Bit error rate is too high ................................................................................................................................................................. 7

7. Production Guidance .................................................................................................................................................................................. 8

7.1 Reflow Soldering Temperature .................................................................................................................................................... 8

7.2 Reflow Soldering Curve ................................................................................................................................................................ 8

8 E28 Series ...................................................................................................................................................................................................... 9

9 Antenna Guidance ........................................................................................................................................................................................ 9

9.2 Antenna selection ............................................................................................................................................................................ 9

Revision history ............................................................................................................................................................................................. 10

About us ........................................................................................................................................................................................................... 10

Chengdu Ebyte Electronic Technology Co.,Ltd. E28-2G4M27S User Manual

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1. Product Overview

1.1 Brief Introduction

E28-2G4M27S is a 2.4GHz small SMD module (pin spacing

1.27mm)designed by Chengdu Ebyte. With built-in PCB antenna, SPI

interface, it owns TX power of 500mW with power consumption.

The IC SX1280 from Semtech features multiple physical layers and

various modulating methods such as LoRa, FLRC and GFSK, the special

modulating methods and processing ways enable longer operating range

under LoRa and FLRC modulating methods, and the GFSK method covers

BLE protocol. The outstanding ultra-low power consumption and the DC-DC and Time-of-Flight on chip make the chip

much more capable for smart home, security system, tracking and locating, wireless distance measuring, wearable

electronics, smart bracelet and health management & etc.

E28-2G4M27S is a hardware platform without firmware, so users need to conduct secondary development.

1.2 Feature

⚫ Communication distance tested is up to 8km in ideal condition; ⚫ Maximum transmitting power of 27dBm with PA+LNA; ⚫ Compatible with BLE; ⚫ Support the global license-free ISM 2.4GHz； ⚫ Support air data rate of 0.595k～2Mbps; ⚫ Support various modulation such as GFSK Mode，FLRC Mode，LoRa Mode; ⚫ Support 2.5V~3.6V power supply, power supply over 3.3V can guarantee the best performance； ⚫ PCB and IPEX antenna optional, good for secondary and embedded development; ⚫ For high speed usage, under FLRC, it is up to 1.3Mbps; ⚫ Excellent anti-blocking ability; ⚫ With Time-of-flight function, good for ranging;

1.3 Application

⚫ Smart Home and Industrial Sensors; ⚫ Wireless toy and remote control; ⚫ Wireless alarm security system； ⚫ Building automation solutions； ⚫ Wireless industrial-grade remote control； ⚫ Health care products； ⚫ Advanced Meter Reading Architecture(AMI)； ⚫ Automotive industry applications.

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2. Technical Parameters

2.1 Limit parameter

Main parameter

Performance

Note

Min

Max

Voltage supply [V]

0

3.6

Voltage over 3.6V will cause permanent damage to module

Blocking power [dBm]

-

10

Chances of burn is slim when modules are used in short distance

Operating temperature [℃]

-40

+85

-

2.2 Operating parameter

Main parameter

Performance

Note

Min

Typ

Max

Voltage supply [V]

2.5

3.3

3.6

≥3.3 V ensures output power

Communication level [V]

3.3

For 5V TTL, it may be at risk of burning down

Operating temperature [℃]

-40 - +85

-

Frequency [MHz]

2400

2450

2500

ISM band

Power

consumption

Transmitting current

[mA]

580

Instant power consumption

Receiving current

[mA]

14.5

Turn-off current

[μA]

2.0

Software is shut down Transmitting power [dBm]

26

26.5

27

See more from 4.2

Receiving sensitivity [dBm]

-130

-131

-132

LoRa receiver sensitivity with CR=4/5 and high sensitivity mode enabled 1 SF12,BW=203kHz

Air data rate

LoRa（bps）

0.595k

-

253.9k

Defined by user via programming

FLRC（bps）

260k

-

1.3M

Defined by user via programming

GFSK（bps）

125k

-

2M

Defined by user via programming

Main parameter

Description

Note

Distance

8000m

Test condition：clear and open area, antenna gain: 5dBi，antenna height: 2.5m，air data rate: 1kbps

FIFO

256Byte

Max. Transmitting length per packet

Crystal oscillator

52MHz

±10ppm/11pF

Modulation

LoRa [Recommended]

GFSK，FLRC，LoRa

Package

SMD

Connector

1.27mm

Interface

SPI

0～10Mbps

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Size

15*26.5mm

Antenna

IPEX/PCB

50Ω Impedance

3 Dimension and Pin Definition

No.

Pin item

Pin direction

Application

1

VCC

Power supply, 2.5 ~ 3.6V (recommend to add external ceramic filter capacitor)

2

GND

Ground, connecting to power source reference ground

3

MISO_TX

Output

SPI data output pin, can be used as UART transmitting pin

4

MOSI_RX

Input

SPI data input pin, can be used as UART receiving pin

5

SCK_RTSN

Input

SPI clock input pin, can be used as UART request transmitting pin

6

NSS_CTS

Input

Module chip selection pin, used to start a SPI communication; and can be used as UART clearing transmitting pin(refer to SX1280 Datasheet for details)

7

GND

Ground, connecting to power source reference ground

8

RX_EN

Input

LNA control pin，valid in high level

9

TX_EN

Input

PA control pin，valid in high level

10

GND

Ground, connecting to power source reference ground

11

NRESET

Input

Chip reset initiation input pin, valid under low level, built-in 50k pull-up resistor

12

BUSY

Output

For status indication(refer to SX1280 Datasheet for details)

13

DIO1

Input/Output

GPIO(refer to SX1280 Datasheet for details)

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14

DIO2

Input/Output

GPIO(refer to SX1280 Datasheet for details)

15

DIO3

Input/Output

GPIO(refer to SX1280 Datasheet for details)

16

GND

Ground, connecting to power source reference ground

4 Basic Operation

4.1 Hardware design

⚫ It is recommended to use a DC stabilized power supply. The power supply ripple factor is as small as possible, and

the module needs to be reliably grounded;

⚫ Please pay attention to the correct connection of the positive and negative poles of the power supply. Reverse

connection may cause permanent damage to the module;

⚫ Please check the power supply to ensure it is within the recommended voltage otherwise when it exceeds the

maximum value the module will be permanently damaged;

⚫ Please check the stability of the power supply, the voltage can not be fluctuated frequently; ⚫ When designing current supply circuit, 30% margin is recommended to be remained so as to ensure long-term stable

operation of the whole module;

⚫ The module should be as far away as possible from the power supply, transformers, high-frequency wiring and other

parts with large electromagnetic interference;

⚫ High-frequency digital routing, high-frequency analog routing, and power routing must be avoided under the module.

If it is necessary to pass through the module, assume that the module is soldered to the Top Layer, and the copper is

spread on the Top Layer of the module contact part(well grounded), it must be close to the digital part of the module

and routed in the Bottom Layer;

⚫ Assuming the module is soldered or placed over the Top Layer, it is wrong to randomly route over the Bottom Layer

or other layers, which will affect the module's spurs and receiving sensitivity to varying degrees;

⚫ It is assumed that there are devices with large electromagnetic interference around the module that will greatly affect

the performance. It is recommended to keep them away from the module according to the strength of the interference.

If necessary, appropriate isolation and shielding can be done;

⚫ Assume that there are traces with large electromagnetic interference (high-frequency digital, high-frequency analog,

power traces) around the module that will greatly affect the performance of the module. It is recommended to stay

away from the module according to the strength of the interference.If necessary, appropriate isolation and shielding

can be done;

⚫ If the communication line uses a 5V level, a 1k-5.1k resistor must be connected in series (not recommended, there is

still a risk of damage);

⚫ Try to stay away from some physical layers such as TTL protocol at 2.4GHz , for example: USB3.0; ⚫ The antenna installation position has a great influence on the performance of the module. Make sure that the antenna

is exposed, preferably vertically. When the module is installed inside the shield, a high-quality antenna extension

cable can be used to extend the antenna outside;

⚫ The antenna must not be installed inside the metal case, which will greatly reduce the transmission distance.

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4.2 Software editing

⚫ With SX1280+PA+LNA，its driving method is similar to SX1280, please refer to SX1280 datasheet for operation guidance; ⚫ GDO0 is GPIO，refer to SX1280 datasheet for details; ⚫ GDO2 is generally configured as an IRQ-like function, or it can be disconnected. The SPI query mode can be used to obtain the

interrupt status, but it is recommended to use the external interrupt via connecting MCU;

⚫ After the SX1280 restores the IDLE mode or configured in sleep mode, it is recommended to reinitialize the power configuration

table;

⚫ It is recommended that the power output parameter of the SX1280 be set to 0dBm. At this time, the module outputs 27dBm. When

the output power of the SX1280 is increased, the current will become larger and the power will not increase significantly.

5 Basic Application

5.1 Circuit Diagram

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6. FAQ

6.1 Communication range is too short

⚫ The communication distance will be affected when obstacle exists. ⚫ Data lose rate will be affected by temperature, humidity and co-channel interference. ⚫ The ground will absorb and reflect wireless radio wave, so the performance will be poor when testing near ground. ⚫ Seawater has great ability in absorbing wireless radio wave, so performance will be poor when testing near the sea. ⚫ The signal will be affected when the antenna is near metal object or put in a metal case. ⚫ Power register was set incorrectly, air data rate is set as too high (the higher the air data rate, the shorter the distance). ⚫ When the power supply at room temperature is lower than the recommended low voltage, the lower the voltage is,

the lower the transmitting power is.

⚫ Due to antenna quality or poor matching between antenna and module.

6.2 Module is easy to damage

⚫ Please check the power supply and ensure it is within the recommended range. Voltage higher than the peak will lead

to a permanent damage to the module.

⚫ Please check the stability of power supply and ensure the voltage not to fluctuate too much. ⚫ Please make sure anti-static measures are taken when installing and using, high frequency devices have electrostatic

susceptibility.

⚫ Please ensure the humidity is within limited range for some parts are sensitive to humidity. ⚫ Please avoid using modules under too high or too low temperature.

6.3 Bit error rate is too high

⚫ When there are co-channel signal interference nearby, be away from interference sources or modify frequency and

channel to avoid interference;

⚫ The clock waveform on the SPI is not standard. Check whether there is interference on the SPI line. The SPI bus

should not be too long.

⚫ Unfavorable power supply may cause messy code. Make sure that the power supply is reliable. ⚫ Extension line and feeder with poor quality or too long ones will cause high bit error rate.

Chengdu Ebyte Electronic Technology Co.,Ltd. E28-2G4M27S User Manual

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7. Production Guidance

7.1 Reflow Soldering Temperature

Profile Feature

Sn-Pb Assembly

Pb-Free Assembly

Solder Paste

Sn63/Pb37

Sn96.5/Ag3/Cu0.5

Preheat Temperature min （Tsmin）

100℃

150℃

Preheat temperature max (Tsmax)

150℃

200℃

Preheat Time (Tsmin to Tsmax)(ts)

60-120 sec

Average ramp-up rate(Tsmax to Tp)

3℃/second max

Liquidous Temperature (TL)

183℃

217℃

Time（tL）Maintained Above（TL）

60-90 sec

30-90 sec

Peak temperature（Tp）

220-235℃

230-250℃

Aveage ramp-down rate（Tp to Tsmax）

6℃/second max

Time 25℃ to peak temperature

6 minutes max

8 minutes max

7.2 Reflow Soldering Curve

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8 E28 Series

Model

IC

Frequency

TX power

Distance

Size

Package

Interface

Hz

dBm

km

mm

E28-2G4T12S

SX1280

2.4G

12.5

3

17.5*28.7

SMD

TTL

E28-2G4M27S

SX1280

2.4G

27

8

15*26.5

SMD

SPI

E28-2G4M20S

SX1280

2.4G

20

6

15*26.5

SMD

SPI

E28-2G4M12S

SX1280

2.4G

12.5

3

25*14

SMD

SPI

9 Antenna Guidance

9.1 Antenna recommendation

Antenna plays an important role in the communication process. Inferior antennas often have a great impact on the

communication system. Therefore, we recommend some antennas that support our wireless modules and have excellent

performance and reasonable price.

Model

Type

Frequency

Gain

Size

Feeder

Interface

Feature

Hz

dBi

mm

cm

TX2400-NP-5010

FPC

2.4G

2.0

10x50 - IPEX

FPC antenna

TX2400-JZ-3

Rubber

2.4G

2.0

30 - SMA-J

Straight antenna,ultra short

TX2400-JZ-5

Rubber

2.4G

2.0

50 - SMA-J

Straight antenna,ultra short

TX2400-JW-5

Rubber

2.4G

2.0

50 - SMA-J

Fixed bending antenna

TX2400-JK-11

Rubber

2.4G

2.5

110 - SMA-J

Flexible antenna，omnidirectional

TX2400-JK-20

Rubber

2.4G

3.0

200 - SMA-J

Flexible antenna，omnidirectional

TX2400-XPL-150

Sucker

2.4G

3.5

150

SMA-J

Small sucker antenna，high gain

9.2 Antenna selection

PCB（Default） IPEX

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Revision history

Version

Date

Description

Operator

1.0

2019-02-28

Initial Version

Ray

1.1

2019-04-04

Content Update

Ray

About us

Website: www.ebyte.com Sales: info@cdebyte.com Support: support@cdebyte.com Tel: +86-28-61399028 Ext. 812 Fax: +86-28-64146160 Address: Innovation Center B333~D347, 4# XI-XIN road,High-tech district (west), Chengdu, Sichuan, China

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