Ebyte E22 Series, SX1268, SX1262 User Manual

SX1262/SX1268 Wireless Module
E22 Series
This manual may be modified based on product upgrade, please refer to the latest version.
All rights to interpret and modify this manual belong to Chengdu Ebyte Electronic Technology Co., Ltd.
User Manual
Copyright ©2012–2017,Chengdu Ebyte Electronic Technology Co.,Ltd.
1
Version
Date
Description
Issued by
1.00
2018/04/27
Initial version
huaa
1.10
2018/08/06
Modified version 01
Huaa
Brief Introduction
With multiple frequency band and wide frequency range , E22 series are small size (pin spacing :1.27mm) SMD wireless transceiver
module designed by Chengdu Ebyte. It features long range transmission and super low power consumption.
The E22 series is the first wireless module in China to adopt Semtech's SX1262, SX1268 RF chip. This chip provides a variety of
modulation methods, such as LoRaTM and traditional GFSK. Its special LoRaTM modulation method increases the communication
distance. At the same time, SX126x owns two distribution methods, low-dropout regulator (LDO) and high-efficiency step-down
DC-DC converter, under the premise of the choice of DC-DC mode, the receiving current is extremely low to achieve Low power
consumption. Compared with SX127x series, SX126x can achieve up to 62.5kbps air data rate in Lora mode. In GFSK mode, air data
rate can support up to 300kbps; according to the application of choice of power management, in the DC/DC mode, when in the
maximum power output of 22dBm The SX126x's power consumption is only 118mA, and the efficiency is improved significantly. The
SX126x RF receiver power consumption is 4.8mA, which is less than half of the SX127x series' 10mA receiving current.
E22 series strictly stick to the design rules home and abroad of FCC, CE, CCC and meet the related RF certifications and export
standards. As hardware platform, users need to carry out secondary development.
Model
Frequency
Transmitting power
Distance
Packing
Antenna
E22-400M22S
410-493MHz
22dBm
6500m
SMD
Stamp hole/IPEX
E22-900M22S
850-930MHz
22dBm
6500m
SMD
Stamp hole/IPEX
E22-400M30S
410-493MHz
30dBm
12000m
SMD
Stamp hole/IPEX
E22-900M30S
850-930MHz
30dBm
12000m
SMD
Stamp hole/IPEX
Copyright ©2012–2017,Chengdu Ebyte Electronic Technology Co.,Ltd.
2
Contents
Brief Introduction
...........................................................................................................................................................................
1
1. Technical Parameter
..................................................................................................................................................................
3
1.1. E22-400M22S
.....................................................................................................................................................................
3
1.2. E22-900M20S
.....................................................................................................................................................................
3
1.3. E22-400M30S/ E22-900M30S
..........................................................................................................................................
4
1.4. Parameter descriptions
......................................................................................................................................................
4
2. Mechanical characteristic
..........................................................................................................................................................
5
2.1 E22-400M22S/E22-900M22S
............................................................................................................................................
5
2.1.1 Dimensions
....................................................................................................................................................................
5
2.1.2. Pin definition
................................................................................................................................................................
5
2.2 E22-400M30S/E22-900M30S
................................................................................................................................................
6
2.2.1 Dimensions
........................................................................................................................................................................
6
2.2.2 Pin definition
.....................................................................................................................................................................
7
3. Recommended Circuit Diagram
...............................................................................................................................................
8
3.1. E22-433M22S/E22-900M22S
............................................................................................................................................
8
3.2. E22-400M30S/E22-900M30S
............................................................................................................................................
8
4. Production Guidance
.................................................................................................................................................................
9
4.1. Reflow Soldering Temperature
..........................................................................................................................................
9
4.2. Reflow Curving Diagram
....................................................................................................................................................
9
5. FAQ
...........................................................................................................................................................................................
10
5.1. Communication range is too short
.................................................................................................................................
10
5.2. Module is easy to damage
..............................................................................................................................................
10
6. Important Notes
......................................................................................................................................................................
10
7. About Us
...................................................................................................................................................................................
10
Copyright ©2012–2017,Chengdu Ebyte Electronic Technology Co.,Ltd.
3
1. Technical Parameter
Model
Core IC
Size
Net Weight
Operating
Temperature
Operating
Humidity
Storage
Temperature
E22-400M22S
SX1268
20* 14*2.8 mm
1.35±0.1 g
-40 ~ 85℃
10% ~ 90%
-40 ~ 125°C
E22-900M22S
SX1262
20* 14*2.8 mm
1.35±0.1 g
-40 ~ 85℃
10% ~ 90%
-40 ~ 125°C
E22-400M30S
SX1268
38.5* 24*3.6 mm
4.8±0.1g
-40 ~ 85℃
10% ~ 90%
-40 ~ 125°C
E22-900M30S
SX1262
38.5* 24*3.6 mm
4.64±0.1g
-40 ~ 85℃
10% ~ 90%
-40 ~ 125°C
1.1. E22-400M22S
Parameter
Min
Typ
Max
Unit
Tx current
(LoRa@2.4kbps)
95
100
105
mA
Rx current
(LoRa@2.4kbps)
4.6
4.8
5.7
mA
Turn-off current
150
180
200
nA
Tx power
21.4
21.5
22.3
dBm
Rx sensitivity
-144
-146
-147
dBm
TCXO323232MHz
TCXO voltage setting
1.8
1.8
3.3
V
Operating frequency
410
433/470/490
493
MHz
Voltage supply
1.8
3.3
3.7
V
Communication level
1.8
3.3
3.7
V
1.2. E22-900M20S
Parameter
Min
Typ
Max
Unit
Tx current
(LoRa@2.4kbps)
114
119
124
mA
Rx current
(LoRa@2.4kbps)
4.8
5.0
5.9
mA
Turn-off current
150
185
200
nA
Tx power
21.4
21.5
22.3
dBm
Rx sensitivity
-144
-146
-147
dBm
TCXO323232MHz
TCXO voltage setting
1.8
1.8
3.3
V
Operating frequency
850
868/915
930
MHz
Voltage supply
1.8
3.3
3.7
V
Communication level
1.8
3.3
3.7
V
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