Ebyte E19-868M20S User Manual

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E19-868M20S User Manual
SX1276 868MHz 100mW SMD Wireless Module
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Chengdu Ebyte Electronic Technology Co., Ltd. E19-868M20S User Manu al
Copyright ©2012–2018Chengdu Ebyte Electronic Technology Co.,Ltd. 1
目录
1. Overview................................................................................................................................................................................................2
1.1 Brief introduction ......................................................................................................................................................................2
1.2 Features .......................................................................................................................................................................................2
1.3 Application .................................................................................................................................................................................2
2.Spec ification and parameter ................................................................................................................................................................3
2.1 Limit parameter .........................................................................................................................................................................3
2.2 Operating para meter .................................................................................................................................................................3
3.Size and pin definition ..........................................................................................................................................................................4
4. Basic operation .....................................................................................................................................................................................5
4.1 Hardware design ................................................................................................................................................................5
4.2 Software ed iting ........................................................................................................................................................................6
5.Basic application .........................................................................................................................................................................6
5.1 Basic circuit diagram ................................................................................................................................................................6
6.FA Q..........................................................................................................................................................................................................7
6.1 Communication range is too short .........................................................................................................................................7
6.2 Module is easy to damage........................................................................................................................................................7
6.3 BER(Bit Error Rate) is high ....................................................................................................................................................7
7.Production guidance..............................................................................................................................................................................7
7.1 Reflow soldering te mperature .................................................................................................................................................7
7.2 Reflow soldering curve ............................................................................................................................................................8
8. E19 Ser ies ..............................................................................................................................................................................................9
9. Antenna guidance .................................................................................................................................................................................9
9.1 Antenna recommendation ........................................................................................................................................................9
Revision history ..................................................................................................................................................................................... 10
About us .................................................................................................................................................................................................. 10
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Chengdu Ebyte Electronic Technology Co., Ltd. E19-868M20S User Manu al
Copyright ©2012–2018Chengdu Ebyte Electronic Technology Co.,Ltd. 2
1. Overview
1.1 Brief introduction
E19-868M20S is a s mall-sized 868MHz LoRaTM SMD wireless
module, based on the original imported RF chip SX1276 from SEMTECH.
Due to the use of the imported SX1276 as the core of the module, with
its stable and reliable characteristics, it is favored by the majority of us ers.
Compared with the FSKGFSK products, it has made great progress in
receiving current, receiving sensitivity, transmitting power, receiving rate
range and anti-interference ability. The module is aimed at smart home,
wireless meter reading, scientific research and medical, and medium and
long distance wireless communication equipment. Since RF performance
and component selection are in accordance with industrial standards, and the
product has obtained FCC, CE, RoHS and other international authoritative certification reports , us ers do not need to worry about its performance. High precision 32MHz crystal is used.
Since the module is a pure RF transceiver module, you need to use the MCU driver or a dedicated SPI debug tool.
1.2 Features
Communication distance tested is up to 5km Maximum transmiss ion power of 100mW, software multi-level adjustable
Support the global license-free ISM 868MH band Support air date rate of 0.018kbps~37.5kbp in LoRaTM;  The maximum data trans miss ion rate 300kpbs in FSK mode Support multiple modulation methods, LoRaTM/FSK/GFSK/MSK/GMSK/OOK Large capacity FIFO, supports 256Byte data buffer Support 2.5V~3.6V power supply, power supply over 3.3V can guarantee the bes t performance Industrial grade standard design, support -40 ~ 85 °C for working over a long time Stamp hole, good for s econdary development and integration.
1.3 Application
Home security alarm and remote keyless entry Smart home and industrial sens ors Wireless alarm security system Building automation solutions Wireless industrial-grade remote control Health care products Advanced Meter Reading Architecture(AMI) Automotive industry applications .
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2.Specification and parameter
2.1 Limit parameter
Main parameter
Performance
Remark
Min.
Max.
Power supplyV
0
3.6
Voltage over 3.6V will cause permanent damage to module
Blocking powerdBm
-
10
Chances of burn is slim when modules are used in short distance
Operating temperature
-40
85
-
2.2 Operating parameter
Main parameter
Performance
Remark
Min.
Typ.
Max.
Operating voltage(V)
1.8
3.3
3.6
3.3V ensures output power
Communication levelV
-
3.3
-
For 5V TTL, it may be at risk of burning down
Operating temperature
-40 - 85
Industrial design
Operating frequencyMHz
862
868
893
Support ISM band
Power consumpti on
TX currentmA
-
630
-
Instant power consumption
RX currentmA
-
14
-
-
Sleep current μA
-
1.0
-
Software is shut down
Max Tx powerdBm
19
20
21
-
Receiving sensitivitydBm
-145
-147
-148
Sensitivity test conditions air data rate: 0.3 kbps, Coding rate 4/5, Spread Spectrum
Factor 12.
Air data ratebps
1.2 - 300
Kbps
FSK
0.018
-
37.5
Kbps
Lora
TM
Main parameter
Description
Remark
Distance for reference
5000m
Test conditionclear and open area, antenna gain: 5dBiantenna height : 2.5mair data rate: 0.3kbp s
FIFO
256Byte
Max length transmitted each time
Crystal frequency
32MHz
-
Modulation
LoRaTM (recommended)
FSK/GFSK/MSK/GMSK/OOK
Package
SMD
-
Connector
1.27mm
-
Communication interface
SPI
0-10Mbps
Size
17.6*25.2 mm
-
Antenna
Stamp hole
50 ohm impedance
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3.Size and pin definition
Pin No
Pin item
Pin direction
Pin application
1
GND
Input
Ground electrode, connected to the power reference ground
2
DIO5
Input/Output
Configurable IO portPlease find more on SX1278 datasheet
3
DIO4
Input/Output
Configurable IO portPlease find more on SX1278 datasheet
4
DIO3
Input/Output
Configurable IO portPlease find more on SX1278 datasheet
5
DIO2
Input/Output
Configurable IO portPlease find more on SX1278 datasheet
6
DIO1
Input/Output
Configurable IO portPlease find more on SX1278 datasheet
7
DIO0
Input/Output
Configurable IO portPlease find more on SX1278 datasheet
8
RST
Input
Reset
9
NC
--
Not connect
10
GND
Input
Ground electrode, connected to the power reference ground
11
VCC
Input
Power sup p ly: 1.8~3.6V (3.3V Ceramic filter capacitor is advised to add)
12
SCK
Input
SPI clock
13
MISO
Output
SPI clock
14
MOSI
Input
SPI clock
15
NSS
Input
Chip select
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16
TXEN
Input
Radio frequency switch control, make sure the TXEN pin is in high level, RXEN p in is in low level when transmitting.
17
RXEN
Input
Radio frequency switch control, make sure the TXEN pin is in high level, RXEN p in is in low level when transmitting
18
GND
Ground electrode, connected to the power reference ground
19
GND
Ground electrode, connected to the power reference ground
20
ANT
Output
Antenna
21
GND
Ground electrode, connected to the power reference ground
4. Basic operation
4.1 Hardware design
It is recommended to use a DC stabilized power supply. The power s upply ripple factor is as small as possible, and
the module needs to be reliably grounded.
Please pay attention to the correct connection of the pos itive and negative poles of the power supply. Reverse
connection may cause permanent damage to the module
Please check the power supply to ensure it is within the recommended voltage otherwise when it exceeds the
maximu m value the module will be permanently damaged
Please check the stability of the power supply, the voltage can not be fluctuated frequently When designing the power s upply circuit for the module, it is often recommended to reserve more than 30% of the
margin, s o the whole machine is beneficial for long -term s table operation.
The module should be as far away as possible from the power supply, trans formers, high-frequency wiring and other
parts with large electromagnetic interference.
High-frequency digital routing, high-frequency analog routing, and power routing must be avoided under the module.
If it is neces s ary to pass through the module, assume that the module is soldered to the Top Layer, and the copper is
spread on the Top Layer of the module contact part(well grounded), it must be close to the digital part of the module
and routed in the Bottom Layer
As suming the module is soldered or placed over the Top Layer, it is wrong to randomly route over the Bottom Layer
or other layers, which will affect the module's s purs and receiving sens itivity to varying degrees
It is assumed that there are devices with large electromagnetic interference around the module that will greatly affect
the performance. It is recommended to keep them away from the module according to the strength of the interference.
If necessary, appropriate isolation and shielding can be done
As sume that there are traces with large electromagnetic interference (high -frequency digital, high-frequency analog,
power traces ) around the module that will greatly affect the performance of the module. It is recommended to s tay
away from the module according to the strength of the interference.If necessary, appropriate isolation and shielding
can be done.
If the communication line us es a 5V level, a 1k-5.1k resistor must be connected in series (not recommended, there is
still a risk of damage)
Try to s tay away from some phys ical layers such as TTL protocol at 2.4GHz , for example: USB3.0
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The mounting structure of antenna has a great influence on the performance of the module. It is necessary to ens ure
that the antenna is exposed, preferably vertically upward. When the module is mounted inside the cas e, us e a good
antenna extension cable to extend the antenna to the outside
The antenna must not be installed ins ide the metal case, which will caus e the transmission distance to be greatly
weakened.
4.2 Software editing
SX1278/SX1276+PA+LNAs ame drive way as SX1278/SX1276us er can refer to SX1278/SX1276 datas heet. DIO0DIO1DIO2DIO3DIO4DIO5 are configurable I/O ports for various applicationsee more in SX1276
datasheet. It can be floated when not us ed.
RSTTXENRXEN must be connected,among which RST control chip resetTXEN, RXEN are for controlling
RF s witch.
Make it ground well with large space for grounding and small power ripple. Filter capacitor is necess ary and make
sure it is clos e to pin VCC and GND.
SPI communication rate should not be set too high, usually around 1Mbps. In trans mittingset TXEN as high communication levelRXEN pin is low level; In receiving, set RXEN as high
communication level,TXEN is low level; Before powering off, s et TXENRXEN as low level.
Re-initialize register configuration when the chip is idle for higher stability.
5.Basic application
5.1 Basic circuit diagram
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6.FAQ
6.1 Communication range is too short
The communication distance will be affected when obs tacle exists. Data lose rate will be affected by temperature, humidity and co-channel interference. The ground will abs orb and reflect wireless radio wave, s o the performance will be poor when tes ting near groun d. Sea water has great ability in abs orbing wireless radio wave, so performance will be poor when tes ting near the sea. The signal will be affected when the antenna is near metal object or put in a metal case. Power register was set incorrectly, air data rate is set as too high (the higher the air data rate, the shorter the
distance).
The power s upply low voltage under room temperature is lower than 2.5V, the lower the voltage, the lower the
trans mitting power.
Due to antenna quality or poor matching between antenna and module.
6.2 Module is easy to damage
Please check the power supply source, ensure it is 2.0V~3.6V, voltage higher than 3.6V will damage the module. Please check the stability of power s ource, the voltage cannot fluctuate too much. Please make sure antistatic measure are taken when installing and us ing, high frequency devices have electrostatic
susceptibility.
Please ensure the humidity is within limited range, some parts are sensitive to humidity. Please avoid us ing modules under too high or too low temperature.
6.3 BER(Bit Error Rate) is high
There are co-channel signal interference nearby, pleas e be away from interference sources or modify frequency and
channel to avoid interference;
Poor power supply may caus e messy code. Make sure that the power supply is reliable. The extension line and feeder quality are poor or too long, so the bit error rate is high;
7.Production guidance
7.1 Reflow soldering temperature
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Profile Feature
Curve characteristics
Sn-Pb Assembly
Pb-Free Assembly
Solder Paste
Solder paste
Sn63/Pb37
Sn96.5/Ag3/Cu0.5
Preheat Temperature min Tsmin
Min preheating temp.
100℃
150℃
Preheat temperature max (Tsmax)
Mx preheating temp.
150℃
200℃
Preheat Time (Tsmin to Tsmax)(ts)
Preheating time
60-120 sec
60-120 sec
Average ramp-up rate(Tsmax to Tp)
Average ramp-up rate
3℃/second max
3℃/second max
Liquidous Temperature (TL)
Liquid phase temp.
183℃
217℃
TimetL)Maintained Above(TL)
Time below liquid phase line
60-90 sec
30-90 sec
Peak temperatureTp
Peak temp.
220-235℃
230-250℃
Aveage ramp-down rateTp to Tsmax
Aveage ramp-down rate
6℃/second max
6℃/second max
Time 25℃ to peak temperature
Time to peak temperature
for 25℃
max 6 minutes
max 8 minutes
7.2 Reflow soldering curve
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8. E19 Series
Model No.
IC
Frequency
(Hz)
Tx power
(dBm)
Test distance
km
Package
Antenna
Model No.
E19-433M20S2
SX1278
433M
20
5
SMD
15 * 15
Stamp hole
E19-915M30S
SX1276
915M
30
10
SMD
25 * 40
Stamp hole /IPEX
E19-868M30S
SX1276
868M
30
10
SMD
25 * 40
Stamp hole /IPEX
E19-868M20S
SX1276
868M
20
5
SMD
17.6*25.2
Stamp hole
E19-433M30S
SX1278
433M
30
10
SMD
25*37
Stamp hole
E19-915M20S
SX1276
915M
20
5
SMD
17.6*25.2
Stamp hole
E19-433M20SC
SX1278
433M
20
5
SMD
17.6*25.2
Stamp hole
9. Antenna guidance
9.1 Antenna recommendation
The antenna is an important role in the communication process. A good antenna can largely improve the
communication s ystem. Therefore, we recommend some antennas for wireless modules with excellent performance and
reasonable price.
Model No.
Type
Frequency
Hz
Interface
Gain
dBi
Height
Cable
Function feature
TX868-XP-100
Sucker
868M
SMA-J
3.5
29cm
100cm
Sucker antenna, High gain
TX868-JK-20
Rubber
868M
SMA-J
3
200mm - Flexible &omnidirectional
TX868-JZ-5
Rubber
868M
SMA-J
2
50mm
-
Short straight &omnidirectional
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Revision history
Version
Date
Description
Issued by
1.00
2017/10/16
Initial version
huaa
1.10
2018/5/23
Content updated
huaa
1.20
2018/9/21
Model No. split
Huaa
About us
Technical support: s upport@cdebyte.com Documents and RF Setting download link: www.ebyte.com Thank you for us ing Ebyte products ! Please contact us with any questions or suggestions: info@cdebyte.com
------------------- -- -- --- -- -- -- --- ----------------------------- -- -- --- -- -- --- -- ----------------­Fax: 028-64146160 ext. 821 Web: www.ebyte.com Address: Innovation Center D347, 4# XI-XIN Road,Chengdu, Sichuan, China
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