EastRising Technology ER-OLED0.91-1 User Manual

EASTRISING TECHNOLOGY CO.,LIMITED
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限 公 司
ER-OLED0 .91-1
OLED Module User Manual
EastRising Technology Co.,
URL: www.lcd-china.com Document Name: Manual i
ER-OLED0.91-1
EASTRISING TECHNOLOGY CO.,LIMITED
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CConnteennttss
11.. BBaas
1.1 Display Specifications .................................................................................................1
1.2 Mechanical
1.3 Active Area & Pixel Construction...............................................................................1
1.4 Mechanical Drawing....................................................................................................2
1.5 Pin Definition...............................................................................................................3
1.6 Block Diagram.............................................................................................................5
22.. AAbbs
sic SSppeecc
1.6.1 V
1.6.2 VCC Generated by Internal DC/DC Circuit
soluttee MMaaxxiimmuumm RRa
iffiiccaattiioonns ..................................................................................1~6
Specifications...........................................................................................1
Supplied Externally....................................................................................5
CC
tinnggss.......................................................................... 7
........................................................6
限 公 司
33.. OOppttiiccss && EElleeccttrriiccaall CChhaarraacctteerriissttiiccss......................................................................................................................88~~99
3.1 Optics Characteristics.
3.2 DC Characteristics...... .............. ..... ........ . .. .............. .. ...... ......... ...... .. ..... ...8
3.3 AC Characteristics.... .... .......... .... ...... .... .. ......... ...... ......... ...... .... ...... .... .9
.............. ..... ....... .... .... ... . ...... ...... ......... ....... .. ...... ...8
44.. FFuunnccttiioonnaall SSppeecciiffiiccaattiioon
4.1 Commands ..................................
4.2 Power down and Power up Sequence........................................................................10
4.2.1 Power up Sequence......... ................................................................................10
4.2.2 Power down Sequence .....................................................................................10
4.3 Reset Circuit......... .... ...............................................................................................10
4.4 Actual Application Example......................................................................................11
55.. RReelliiaabbiilliit
5.1 Contents of Reliability Te
5.2 Lifetime......................................................................................................................12
5.3 Failure Check Standard..............................................................................................12
utgoi
66.. OOu
6.1 Environment Required
6.2 Sampling
6.3 Criteria & Acceptable Quality Level .........................................................................13
ty...................................................................................................... 12
ngg Quualityy CConttrrooll Speciificcatioonnss..............................................13~17
Plan............................................................................................................13
6.3.1 Cosm
6.3.2 Cosmetic Check (Display Off) in Active Area.................................................16
6.3.3 Pattern Check (Display On) in Active Area.....................................................17
etic Check (Display Off) in Non-Active Area........................................13
n ....................................................................... 10~1
. ..... ....................................................................10
sts......................................................................................12
...............................................................................................13
1
77.. PPaacckkaaggee SSppeecciiffiiccaattiioonns
recaauuti
88.. PPr
8.1 Handling Precautions.................................................................................................19
8.2 S
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onss WWheen UUssiinngg TThhessee OOEEL DDiissplaayy MModullees.......................19~21
torage Precautions....................................................................................................20
s ................................................................................ 18
ER-OLED0.91-1
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8.3 Designing Precautions
8.4 Precautions when disposing of the OEL display modules.........................................21
8.5 Other Precautions.......................................................................................................21
...............................................................................................20
有 限 公 司
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ER-OLED0.91-1
EASTRISING TECHNOLOGY CO.,LIMITED
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Basiicc
11. B
1.1 Display Specifications
1.2 Mechanical Specifications
1 3 Active Area & Pixel Const uction
Speciifficationss
1) Display Mode:
2) Display Color: Monochrome (White)
3) Drive Duty: 1/32 Duty
1) Outline Drawing: According to the annexed outline drawing
2) Number of Pixels: 128 × 32
3) Panel Size: 30.0 × 11.50 × 1.45 (mm)
4) Active Area: 22.384 × 5.584 (mm)
5) Pixel Pitch: 0.175 × 0.175 (mm)
6) Pixel Size: 0.159 × 0.159 (mm)
7) Weight: 1.05 (g)
Passive Matrix
限 公 司
P0.175x1
"A"
Segment 127
( Column 1 )
-0.016=5.584
P0.175x32
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28 0.016=22.384
Segment 0
( Column 128 )
ER-OLED0.91-1
Common 0
( Row 32 )
Common 31
( Row 1 )
0.175
0.159
9
0.175
0.15 "A"
Detail
Scale (10:1)
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1.4 Mechanical Drawing
Remark
Original Drawing
DateItem
20090511
A
6 8
3
15 3
16 3±0
) (46 3
)
zer)
/A (V
2 (Panel Size)
Polari
2 (Cap Size)
384
30±0
24
6±0
25 9 (
26
限 公 司
A
Rev
C1P
C2P
VSS
C1N
C2N
VBAT
Symbol
2
576
431
1 )
2 )
on 31
mon 0
( Row
( Row 3
mn 128 )
Comm
Com
Segment 0
( Colu
75x128-0 016=22 384 P0 1
"A"
125)
(0
3
03
0 ± 8
0 9
1
0 1±0
5 8±02
5±0 310±0
3
P0.65x
W=0
15
(0 86)
11 25±
R
8±0 3
-1) 9.1±0.05
35 0
9 25±0
P0 17
0 2
0
P
B
1
t 127
1 )
( Column
Segmen
5x32-0 016=5584
0 1 0 8±
1
φ
2-
#1318B M
x0 063mm
3
8 4x8
0 1±
0 03
pe
move Ta Re
ct Side
Conta
t=0 15mm Max
Pin
75
59
0 1
0 1
ide act S
ont C
e Glu
9
0 15
5
17
0
(1
(1 6)(16 99)
IN
CS#
VDD
RES#
8
9
"A"
Detail
Scale (10:1)
D/C#
SD
SCLK
11
101214
VCC
IREF
VCOMH
13
Material
g Number
Drawin
15
EASTRISING TECHNOLOGY CO.,LTD
ss Otherwise S cifi Unle
1)
6
cal Design)
Signature
Customer Approval
0 91"
/A)
32 Pixels
ctive Area A
x
128
22 384 (A
r arize
t=0 2mm
Pol
(31 6)
erence Mechni
f (Re
A3
Size
et She
1 of 1
me / Polyimide
1:1
Soda Li
Scale
P M
20090511
Cherry Lin
Ivy Lo
Panel / EE E
20090511
uo Hu
20090511
Ting-K
ER-OLED0.91-1
11
rey Lin
awn Dr
200905
Humph
By
Date
Tit
3
±1
mm
±0
rance To
l Roughness
Unit
Ang e
Dimension
Genera
1)
(2 1)
±0 3
(2 1)
(1
)
(1 1
0 35
0 5
0 5±
A/A)
5.584 (
7 584 (V/
A)
8 8
rizer)
(Pola
2 (Cap Size)
11 5±0
11 5±02 (Panel Size)
1 45±
0 1
Notes:
2 Driver IC: SSD1306
1 Color: White
3 FPC Number:ER-OLED0 91-1
The actual assembled total thickness with above materials should be 1 80 Max
4 Interface: 4-wire SPI
6 The total thickness (155 Max) is without polarizer protective film & remove tape
5 General Tolerance: ±0 30
The drawing contained herein is the exclusive property of EastRising It is not allowed to copy, reproduce and or disclose in any formats without permission of EastRising
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ER-OLED0.91-1
b
n
t
r
d
r
p
a
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1.5 Pin Definition Pin Number Symbol
PPoowweerr SSuuppppllyy
7 VDD P
6 VSS P
15 VCC P
r
Drive
13 IREF I
14 VCOMH O
限 公 司
Type Function
r Supply for Logic
Powe
This is a vo external source.
GGrroouunndd ooff OOEELL SSyysstteemm
This i logic pins, the OEL driving voltages, and the analog circuits. It must be connected to external ground.
PPoowweer SSuuppppl
This is the mo A stabilization capacitor should be connected this pin and connected to external source when the converter is no used.
CCuurrrreenntt RReeffeerreennccee ffoorr BBrriigghhttnneessss AAddjjuussttmmeenntt
This pi shoul current lower than 12 5μA
oltage Output High Level for COM Signal
V
This
pin is the input pin for the voltage output high level for COM signals. A capacitor should be connecte betwee
ltage supply pin. It must be connected to
s a ground pin. It also acts as a reference for the
y ffoorr OOELL PPanell
l
st positive voltage supply pin of the chip.
etwee
VSS when the converter is used. It must be
n is segment current reference pin. A resisto
d be connected between this pin and VSS. Set the
n this pin and VSS.
DC/DC
IInntteerrffaaccee
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Converteer
PPoowweerr SSuuppppllyy ffoorr DDCC//DDCC CCoonnvveerrtteerr CCiirrccuuiitt
This is the power sup
5 VBAT P
DC/DC voltage converter. It must be connected to external source when the converter is used. It should be connected to VDD when the converter is not used.
Posit
3 / 4 1 / 2
C1P / C1N C2P / C2N
NNeeggaattiivvee TTeerrmmiinnaall ooff tthhee FFllyyiinngg BBoooosstt CCaappaacciittoorr
I
The cha terminals. They must be floated when the converter is not used.
Powe
9 RES# I
This p initialization of the chip is executed.
CChhiipp SSeelleecctt
8 CS# I
This pi MCU comm
DDaattaa//CCoommmmaanndd CCoonnttrrooll
This pi
ulled high and serial i
10 D/C# I
at SDIN is treated as d data at SDIN will be transferred to the command register. For detail relationship to MCU interface signals, please refer to the Timing Characteristics Diagrams.
ply pin for the internal buffer of the
ive Terminal of the Flying Inverting Capacitor
rge-pump capacitors are required between the
r Resset for Controller and Driver
in is reset signal input. When the pin is low,
n is the chip select input. The chip is enab led fo
unication only when CS# is pulled low.
n is Data/Command control pin. When the pin is
nterface mode is selected, the dat
ata. When it is pulled low, the
ER-OLED0.91-1
a
n
t
K
bit
p
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1.5 Pin Definition (Continued) Pin Number
Intter
face ((CCoonntiinuuedd))
11 S
12 SDIN I
Symbol Type Function
CLK
Cloocckk Input SSiiggnnaall
SSeerriiaall
I
The transm cloc
k signal. Each
place during a
SSeerriiaall Daat
This
pin acts as a communication channel. The inpu data through SDIN are latche in th
e sequence of
arallel data and handled at clock. SDIN is identified to display data or command by D/C# bit data at the rising of first SCLK.
限 公 司
ission if information in the bus is following
transmission of data bit is take
single cl
a Input SSiiggnnaall
t
ock period of th
MSB first and converted to 8-
d at the rising edge of SCL
the rising edge of last serial
is pin.
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1.6 Block Diagram
1.6.1 VCC Supplied Externa
有 限 公 司
lly
Active Area 0.91"
gment 127 Se
x
32 Pixels
~~~ ~
ent 0
Common 0
Segm
128
Common 31
SSD1306
RES#
F
VCC
VCOMH
D/C#
IRE
SDIN
SCLK
C3
C2
N
C1P
C1
C2N
C2P
D
VSS
VBAT
VD
CS#
C1
Pins connected to MCU interface: CS#, RES#, D/C#, SCLK, and SDIN
C1: 1μF C2, C3: 2.2μF R1: 390kΩ, R1 = (V
oltage at IREF – VSS) / IREF
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ER-OLED0.91-1
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1.6.2 VCC Generated by Internal DC/DC Circuit
有 限 公 司
Active Area 0.91"
128
Segment 127
x
32 Pixels
~~~ ~
Segment 0
0
Common
Common 31
SSD1306
T
VBA
C1P
C1N
C2N
C2P
C6
C5
Pins connected to MCU interface: CS#, RES#, D/C# SCLK, and SDIN
C1, C2, C5, C6: 1μF C3, C4: 2.2μF R1: 390kΩ, R1 = (Voltage at IREF –
D
VSS
VD
RES#
D/C#
CS#
C2
C1
SCLKSDIN
VCC
VCOMH
IREF
R1
C4
C3
VSS) / IREF
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22.. AAbbssoolluuttee MMaaxxiimmuumm RRaattiinnggss
Parameter
Supply Voltage for Logic VDD -0.3 4 V 1, 2
Supply Voltage for Display VCC 0 11 V 1,
Operating Te
orage T emperatu r
St
Note 1: All the abov Note 2:
When this module is used beyond the above absolute maximum ratings, permanent breakage of the module may occur. Also, for normal operations, it is desirable to use this module under the conditions according to Section 3. “Optics & Electrical Characteristics”. If this module is used beyond these conditions, malfunctioning of the module can occur and the reliability of the module may deteriorate.
Symbol Min Max
mperature T
e T
e voltages are on the basis of “VSS = 0V”.
有 限 公 司
Unit Notes
2
-30 70
OP
-40 80
STG
°C °C
-
-
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3. Op
ticcs & EElleecctrricaall CChaarraacctteerristtiicss
3.1 Optics Characteristics Characteristics Symbol Conditions
Brightness Lbr
C.I.E. (White)
Dark Room Contrast
V iew Angle
* Optical measurement taken at VDD = 2.8V, VCC = 7.25V.
Software configuration follows Section 4.4 Initialization.
3.2 DC Characteristics Characteristics
Supply Voltage for Logic VDD - 1 65
Supply Voltage for Display
(Supplied Externa
Supply Voltage for DC/DC V Supply Voltage for Display
(Generated by Internal DC/DC)
High Level Input VIH
Low Level Input VIL
lly)
限 公 司
Min Typ Max Unit
(x) (y)
With Polarizer
(Note 3)
Without Polarizer
120
0.26
0.29
CR -
>160 - -
Symbol
V
Note 3 7
CC
BAT
Conditions Min Typ Max Unit
Internal DC/
DC Enable
3 3 - 4.2 V
VCC Note 3 7
-
0.8×V
-
150 - cd/m
0.32
0.33
>2000:1
2.8 3.3 V
7.25 7.5 V
7.25 7.5 V
- VDD V
DD
0 -
0.34
0.37
- degree
0.2×VDD
2
V
High Level Output VOH
Low Level Output VOL
Operating Current for
Operating Current for
V
V
DD
CC
(VCC Supplied Externally)
Operating Current for V
(VCC Gene
rated by Internal DC/DC)
Sleep Mode Current fo Sleep Mode Current fo
BAT
r V
DD IDD, SLEEP
r V
CC
I
= 100μA, 3.3MHz
OUT
I
= 100μA, 3.3MHz
OUT
0.9×V 0 -
IDD - - 180
ICC
Note 4 - 4.3 Note 5 - 6.8
Note 4 - 12.6
I
I
BAT
CC, SLEEP
Note 5 - 18.4
-
-
-
-
- VDD V
DD
0.1×VDD 300
5.4 mA
8.5 mA
15.8 mA
23.0 mA
1 5 1 5
Note 3: Brightness (Lbr) and Supply Voltage for Display (VCC) are subject to the
change of the panel characteristics and the custom Note 4: V Note 5: V
* Software configuration follows Section 4.4 Initialization.
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= 2.8V, VCC = 7.25V, 50% Display Area Turn on.
DD
= 2.8V, VCC = 7.25V, 100% Display Area Turn on.
DD
ER-OLED0.91-1
er’s request.
V
μA
μA μA
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3.3 AC Characteristics Symbol Description Min
t
Clock Cycle Tim
cycle
tAS Address Setup Tim
tAH Address Hold Tim
t
Chip Select Setup Tim
CSS
t
Chip Select Hold Tim
CSH
t
W
DSW
t
Write Data Hold Time
DHW
t
Clock Low Time 20 -
CLKL
t
Clock High Tim
CLKH
tR Rise Tim
e 100 -
e 15 -
e 15 -
rite Data Setup Time
e 20 -
e - 40
有 限 公 司
Max Unit
ns ns ns
e 20 -
e 10 -
15 - ns
15 - ns
ns ns
ns ns ns
tF Fall Tim
e - 40 ns
* (VDD - VSS = 1.65V to 3.3V, Ta = 25°C)
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ER-OLED0.91-1
C
C
f
D
C
C
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Funcctiioonnaall
44.. F
4.1. Commands
Refer to the Technical Manual for the SSD1306
4.2 Power down and Power up Sequence
To protect OEL panel and extend the panel life time, the driver IC power up/down routine should include a delay period between high voltage and low voltage power sources during turn on/off. It gives the OEL panel enough time to complete the action of charge and discharge before/after the operation.
4.2.1 Power up Sequence:
4.2.2 Power down Sequence:
4.3 Reset Circuit
Sppeecifiiccaattiioonn
1. Power up VDD
2. Send Display off command
3. Initialization
4. Clear Screen
5. Power up VCC
6. D lay 100ms (When VCC is stable)
7. Send D splay on command
1. Send Display off command
2. Power down VCC
3. Delay 100ms (When VCC is reach 0 and panel is completely discharges)
4. Power down VDD
V
CC
V
DD
VSS/Ground
V
CC
V
DD
VSS/Ground
限 公 司
on
V
DD
V
on
Displ
ay off
of
V
f
VDD off
spplay on
iis
When RES# input is low, the chip is initialized with the following status:
1. Display is OFF
2. 128×64 Display Mode
3. Normal segment and display data column and row address mapping (SEG0 mapped to column address 00h and COM0 mapped to row address 00h)
4. Shift register data clear in serial interface
5. Display start line is set at display RAM address 0
6. Column address counter is set at 0
7. Normal scan direction of the COM outputs
8. Contrast control register is set at 7Fh
9.
Normal display mode (Equivalent to A4h command)
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4.4 Actual Application Example
Comm
<Initialization>
and usage and explanation of an actual exam
Set Display Off
0xAE
spla
y Clock Divide Ratio/Oscillator Frequency
Set Di
0xD5, 0x
80
Set Segment Re-Map
0xA1
Set COM Output Sc
an Direction
0xC8
ple
有 限 公 司
Set Entire Display On/Off
0xA4
Set Normal/In
verse Display
0xA6
Set Multiplex Ratio
0xA8, 0x1F
Set Display Offset
, 0x00
0xD3
Set Disp
0x8D, 0x10
lay Start Line 0x40
* Set Charge
(1)
Pump
/ 0x14
(2)
Set COM Pi
* Set
Set VCOMH Deselect
ns Hardware Configuration
0xDA, 0x02
Set C nt ast C
0x81, 0xCF
Pre-Char
0xD9, 0x22
0xDB, 0x4
(1)
* Written Value for Parameters
)
(1
Î VCC Supplied Externally
(2)
Î VCC Generated by Internal DC/DC Circuit
If the noise is accide
ntally occurred at the displaying window during the operation,
please reset the display in order to recover th
ontr l
ge Period
(2)
/ 0xF1
Level
0
e display function.
r Screen
Clea
Set Display On
0xAF
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55.. RReelliiaabbiilliittyy
5.1 Contents of Reliability Tests
High Temperature Operation Low Temperature Operation High Temperature Storage Low Temperature Storage High Temperature/Humidity Operation
Thermal Shock
* The samples used for the above tests do not include polarizer. * No moisture condensation is observed during tests.
5.2 Lifetime
Item Conditions Criteria
有 限 公 司
70°C, 240 hrs
-30°C, 240 hrs 80°C, 240 hrs
-40°C, 240 hrs 60°C, 90% RH, 120 hrs
-40°C ⇔ 85°C, 24 cycles 60 mins dwell
The operational functions work.
End of lifetime is specified as 50% of initial brightness reached.
Parameter Min Max Unit Condition Notes
Operating Life Time
Storage Life Time
Note 6: The average operating lifetime at room temperature is estimated by the
accelerated operation at high temperature conditions.
5.3 Failure Check Standard
After the completion of the described reliability test, the samples were left at room temperature for 2 hrs prior to conducting the failure test at 23±5°C; 55±15% RH.
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10 000 20,000
- hr 120 cd/m2, 50% Checkerboard 6
- hr
ER-OLED0.91-1
Ta = 25°C, 50% RH
-
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66.. OOuuttggooiinngg QQuuaalliittyy CCoonnttrrooll SSppeecciiffiiccaattiioonnss
6.1 Environment Required
Customer’s test & measurement are required to be conducted under the following conditions:
Temperature: 23 ± 5°C Humidity: 55 ± 15 %RH Fluorescent Lamp: 30W Distance between the Panel & Lamp: 50 cm Distance between the Panel & Eyes of the Inspector: 30 cm Finger glove (or finger cover) must be worn by the inspector. Inspection table or jig must be anti-electrostatic.
6.2 Sampling Plan
Level II, Normal Inspection, Single Sampling, MIL-STD-105E
6.3 Criteria & Acceptable Quality Lev l
有 限 公 司
Partition AQL Definition
Major 0.65 Defects in Pattern Check (Display On) Minor 1.0 Defects in Cosmetic Check (Display Off)
6.3.1 Cosmetic Check (Display Off) in Non-Active Area
Check Item
Classification
Criteria
X > 6 mm (Along with Edge) Y > 1 mm (Perpendicular to edge)
X
Panel
General Chipping
Minor
Y
X
Y
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6.3.1 Cosmetic Check (Display Off) in Non-Active
Check Item
Panel Crack Minor
Cupper Exposed
(Even Pin or Film)
Classification
Minor
Area (Continued)
Any crack is not allowable.
Not Allowable by Naked Eye
有 限 公 司
Criteria
Inspection
Film or Trace Dam
Terminal Lead Tw
Terminal Lead Broken Minor
age Minor
ist Minor
Not Allowable
Not Allowable
Terminal Lead Prober
Mark
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Acceptable
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6.3.1 Cosmetic Check (Display Off) in Non-Active
Check Item
Terminal Lead Bent
(Not Tw
ist or Broken)
Classification
Minor
Area (Continued)
NG if any bent lead cause lead
NG for horizontally bent lead more
than 50% of its width.
有 限 公 司
Criteria
shorting.
Minor
Glue or Contamination
on Pin
(Couldn’t Be Rem
by Alcohol)
Ink Marking on Back
Side of panel
(Exclude on Film)
oved
Minor
Acceptable Ignore for Any
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b
EASTRISING TECHNOLOGY CO.,LIMITED
旭 日 东 方 科 技
6.3.2 Cosmetic Check (Display Off) in
Check Item
Any Dirt & Scratch on
Polarizer’s Protective Film
Scratches, Fiber, Line-Shape
Defect
(On Polarizer)
Dirt, Black Spot, Foreign
Material,
(On Polarizer)
Active Area
Classification
Acceptable
Minor
Minor
W 0.1 W > 0.1, L ≤ 2 n ≤ 1 L > 2 n = 0 Φ 0.1 Ignore
0.1 <Φ 0.25
0.25 <Φ n = 0
有 限 公 司
Criteria
Ignore for not Affect the
Polarizer
Ignore
n ≤ 1
Φ 0.5 Î Ignore if no Influence on
Display
0.5 < Φ n = 0
Dent, Bubbles, White spot
(Any Tr
ansparent Spot on
Minor
Polarizer)
Fingerprint, Flow Mark
(On Polarizer)
* Protective film should not be tear off when cosm
Minor Not Allowable
etic check.
** Definition of W & L & Φ (Unit: mm): Φ = (a + b) / 2
L
: Mino
r Axis
W
a: Major Axis
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EASTRISING TECHNOLOGY CO.,LIMITED
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6.3.3 Pattern Check (Display On) in Active Area Check Item
No Display Major
Flicker Major
Missing Line Major
Classification
有 限 公 司
Criteria
Not Allowable
Pixel Short Major
Darker Pixel
ong Display
Wr
Major
Major
Un-uniform Major
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ER-OLED0.91-1
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77.. PPaacckkaaggee SSppeecciiffiiccaattiioonnss
E COVER FOAM 351x212x1,
EP ANTISTATIC x 1 Pcs
Module
Tray 4
20x285 T=0.8mm
Vacuum
x 1 pcs (Empt
y)
x pcs
A
ggered Stacking
Sta
Wrapped with adhesive tape x p
cs
B
packing bag
EPE PROTECTTIVE
有 限 公 司
Pcs Tray Vacuum packing
B
Primary Box C SET
EPE PR
ECTTIVE
OT
280mm x 20mm
370mm x
CART
O BOX
Label
Prim y L4
50mm x W296 x H110, B wave
x Pcs
C
:
Label
Carton Box L464mm x W313mm x H472mm, AB wave
(Major / Maximum)
Part ID
Lot ID :
Q'ty :
QC :
Item Quantity
Holding Trays (A) 15 per Prim
T otal Trays (B) 16
per Primary Box (Including 1 Empty Tray)
ary Box
Primary Box (C) 1~4 per Carton (4 as Major / Maximum
)
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8.1 Handling Precautions
1) Since the display panel is being made of glass, do not apply m impacts such us dropping from a high position.
2) If the display panel is broken by some accident and the internal organic substance leaks out, be careful not to inhale nor lick the organic substance.
3) If pressure is applied to the display surface or its neighborhood of the OEL display module, the cell structure may be damaged and be careful not to apply pressure to these sections.
4) The polarizer covering the surface of the OEL display module is soft and easily scratched. Please be careful when handling the OEL display module.
5) When the surface of the polarizer of the OEL display module has soil, clean the surface. It takes advantage of by using following adhesion tape. * Scotch Mending Tape No. 810 or an equivalent Never try to breathe upon the soiled surface nor wipe the surface using cloth containing solvent such as ethyl alcohol since the surface of the polarizer will become cloudy. Also, pay attention that the following liquid and solvent may spoil the polariz r: * Water * Ketone * Aromatic Solvents
6) Hold OEL display module very carefully when placing OEL display module into the system housing. Do not apply excessive stress or pressure to OEL display module And, do not over bend the film with electrode pattern layouts. These stresses will influence the display performance. Also, secure sufficient rigidity for the outer cases.
有 限 公 司
echanical
7) Do not apply stress to the LSI chips and the surrounding m
8) Do not disassem
9) Do not apply input signals while the logic power is off.
10) Pay sufficient attention to the working environments when handing OEL display modules to prevent occurrence of element breakage accidents by static electricity. * Be sure to make human body grounding when handling OEL display
modules. * Be sure to ground tools to use or assembly such as soldering irons. * To suppress generation of static electricity, avoid carrying out assembly work
under dry environments.
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* Protective film is being applied to the surface of the display panel of the OEL
display module. Be careful since static electricity may be generated when
exfoliating the protective film.
ble nor modify the OEL display module.
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olded sections.
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11) Protection film is being applied to the surface of the display panel and removes the protection film before assembling it. At this time, if the OEL display module has been stored for a long period of time, residue adhesive material of the protection film may remain on the surface of the display panel after removed of the film. In such case, remove the residue material by the method introduced in the above Section 5).
12) If electric current is applied when the OEL display module is being dewed or
8.2 Storage Precautions
8.3 Designing Precautions
when it is placed under high humidity environments, the electrodes may be corroded and be careful to avoid the above.
1) When storing OEL display modules, put them in static electricity preventive bags avoiding exposure to direct sun light nor to lights of fluorescent lamps, etc. and, also, avoiding high temperature and high humidity environments or low temperature (less than 0°C) environments. (We recommend you to store these modules in the packaged state when they were shipped from EastRising Technology Ltd.) At that time, be careful not to let water drops adhere to the packages or bags nor let dewing occur with them
2) If electric current s applied when water drops ar adhering to the surface of the OEL display module when the OEL display module is being dewed or when it is placed under high humidity environments, the electrodes may be corroded and be careful about the above
限 公 司
1) The absolute maximum ratings are the ratings which cannot be exceeded for OEL display module, and if these values are exceeded, panel damage may be happen.
2) To prevent occurrence of malfunctioning by noise, pay attention to satisfy the VIL and VIH specifications and, at the same time, to make the signal line cable as short as possible.
3) We recommend you to install excess current preventive unit (fuses, etc.) to the power circuit (VDD). (Recommend value: 0.5A)
4) Pay sufficient attention to avoid occurrence of mutual noise interference with the neighboring devices.
5) As for EMI, take necessary measures on the equipment side basically.
6) When fastening the OEL display module, fasten the external plastic housing section.
7) If power supply to the OEL display module is forcibly shut down by such errors as taking out the main battery while the OEL display panel is in operation, we cannot guarantee the quality of this OEL display module.
8) The electric potential to be connected to the rear face of the IC chip should be as follows: SSD1306
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* Connection (contact) to any other potential than the above may lead to
rupture of the IC.
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8.4 Precautions when disposing of the OEL display modules
1) Request the qualified companies to handle industrial wastes when disposing of the OEL display modules. Or, when burning them, be sure to observe the environmental and hygienic laws and regulations.
8.5 Other Precautions
1) When an OEL display module is operated for a long of time with fixed pattern may remain as an after image or slight contrast deviation may occur. Nonetheless, if the operation is interrupted and left unused for a while, normal state can be restored. Also, there will be no problem in the reliability of the module.
2) To protect OEL display modules from performance drops by static electricity rapture, etc., do not touch the following sections whenever possible while handling the OEL display modules. * Pins and electrodes * Pattern layouts such as the FPC
3) With this OEL display module, the OEL driver is being exposed. Generally speaking, semiconductor elements change their characteristics when light is radiated according to the principle of the solar battery. Consequently, if this OEL driver is exposed to light, malfunctioning may occur. * Desig the product and installation method so that the OEL driver may be
shielded from light in actual usage.
* Design the product and installation method so that the OEL driver may be
shielded from light during the inspection processes.
4) Although this OEL display module stores the operation state data by the commands and the indication data, when excessive external noise, etc. enters into the module, the internal status may be changed. It therefore is necessary to take appropriate measures to suppress noise generation or to protect from influences of noise on the system design.
5) We recommend you to construct its software to make periodical refreshment of the operation statuses (re-setting of the commands and re-transference of the display data) to cope with catastrophic noise.
有 限 公 司
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