GP800NSM33
GP800NSM33
Hi-Reliability Single Switch IGBT Module
Preliminary Information
DS5372-2.0 February 2001
FEATURES
■ High Thermal Cycling Capability
■ Non Punch Through Silicon
■ Isolated MMC Base with AlN Substrates
■ 3300V Rating
■ 800A Per Module
APPLICATIONS
■ High Reliability Inverters
■ Motor Controllers
■ Traction Drives
■ Resonant Converters
The Powerline range of high power modules includes dual
and single switch configurations covering voltages from 1200V to
3300V and currents up to 4800A.
The GP800NSM33 is a single switch 3300V, n channel
enhancement mode, insulated gate bipolar transistor (IGBT)
module. The IGBT has a wide reverse bias safe operating area
(RBSOA) ensuring reliability in demanding applications. This
device is optimised for traction drives and other applications
requiring high thermal cycling capability or very high reliability.
The module incorporates an electrically isolated base plate
and low inductance construction enabling circuit designers to
optimise circuit layouts and utilise earthed heat sinks for safety.
ORDERING INFORMATION
KEY PARAMETERS
V
V
I
C
I
C(PK)
CES
CE(sat)
(typ) 3.4V
(max) 800A
(max) 1600A
External connection
Aux C
G
Aux E
External connection
Fig. 1 Single switch circuit diagram
1
C
2
E
G
3300V
C2C1
E1 E2
E1
E2
C1
C2
Order As:
GP800NSM33
Note: When ordering, please use the complete part number.
2
E
- Aux Emitter
1
C
- Aux Collector
Outline type code: N
(See package details for further information)
Fig. 2 Electrical connections - (not to scale)
Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures. 1/9
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GP800NSM33
ABSOLUTE MAXIMUM RATINGS - PER ARM
Stresses above those listed under 'Absolute Maximum Ratings' may cause permanent damage to the device. In extreme
conditions, as with all semiconductors, this may include potentially hazardous rupture of the package. Appropriate safety
precautions should always be followed. Exposure to Absolute Maximum Ratings may affect device reliability.
= 25˚C unless stated otherwise
T
case
Symbol
V
CES
V
GES
I
C
I
C(PK)
P
max
V
isol
Collector-emitter voltage
Gate-emitter voltage
Continuous collector current
Peak collector current
Max. transistor power dissipation
Isolation voltage
Parameter
THERMAL AND MECHANICAL RATINGS
Symbol
R
th(j-c)
R
th(j-c)
Thermal resistance - transistor (per arm)
Thermal resistance - diode (per arm)
Parameter
Test Conditions
= 0V
V
GE
-
T
= 80˚C
case
1ms, T
T
case
= 120˚C
case
= 25˚C, Tj = 150˚C
Commoned terminals to base plate. AC RMS, 1 min, 50Hz
Test Conditions
Continuous dissipation -
junction to case
Continuous dissipation -
Min.
-
-
Max.
3300
±20
800
1600
9.6
6000
Max.
13
26
Units
V
V
A
A
kW
V
Units
˚C/kW
˚C/kW
junction to case
R
th(c-h)
Thermal resistance - case to heatsink (per module)
Mounting torque 5Nm
-
˚C/kW
6
(with mounting grease)
-
T
Junction temperature
j
Transistor
Diode
T
stg
-
Storage temperature range
Screw torque
Mounting - M6
-
–40
Electrical connections - M4
Electrical connections - M8
125
-
125
125
-
-
-
5
2
10
˚C
˚C
˚C
Nm
Nm
Nm
2/9 Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures.
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ELECTRICAL CHARACTERISTICS
T
= 25˚C unless stated otherwise.
case
GP800NSM33
Symbol
I
CES
I
GES
V
GE(TH)
V
CE(sat)
I
F
I
FM
V
F
C
ies
L
M
Parameter
Collector cut-off current
Gate leakage current
Gate threshold voltage
Collector-emitter saturation voltage
Diode forward current
Diode maximum forward current
Diode forward voltage
Input capacitance
Module inductance
Test Conditions
= 0V, VCE = V
V
GE
VGE = 0V, VCE = V
= ±20V, VCE = 0V
V
GE
= 120mA, VGE = V
I
C
CES
CES
, T
CE
VGE = 15V, IC = 800A
= 15V, IC = 800A, T
V
GE
= 125˚C, T
DC, T
vj
= 1ms, T
t
p
= 800A
I
F
= 800A, T
I
F
V
CE
case
case
= 25V, VGE = 0V, f = 1MHz
case
= 110˚C
= 125˚C
= 70˚C
-
= 125˚C
case
= 125˚C
case
Min.
-
-
-
4.5
-
-
-
-
-
-
-
-
Typ.
-
-
-
5.5
3.4
4.3
-
-
2.3
2.4
200
15
Max.
2
70
12
6.5
4.3
5
800
1600
2.9
3
-
-
Units
mA
mA
µA
V
V
V
A
A
V
V
nF
nH
Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures. 3/9
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