GP401DDM18
GP401DDM18
FEATURES
■ Low V
■ 400A Per Switch
■ High Thermal Cycling Capability
■ Non Punch Through Silicon
■ Isolated MMC Base with AlN Substrates
CE(SAT)
APPLICATIONS
■ High Reliability
■ Motor Controllers
■ Traction Drives
■ Low Loss System Retrofit
Hi-Reliability Dual Switch Low V
KEY PARAMETERS
V
V
I
C
I
C(PK)
CES
CE(sat)
(typ) 2.6V
(max) 400A
(max) 800A
2
12(C
)
2(C
)
2
1
7(C
)
1800V
4(E2)
CE(SAT)
IGBT Module
Advance Information
DS5397-1.2 January 2001
2
)
11(G
10(E2)
3(C1)
1(E1)
5(E
6(G
1
)
1
)
The Powerline range of high power modules includes dual
and single switch configurations covering voltages from 1200V to
3300V and currents up to 4800A.
The GP401DDM18 is a dual switch 1800V, n channel
enhancement mode, insulated gate bipolar transistor (IGBT)
module. Designed with low V
losses, the module is of particular relevance in low to medium
to minimise conduction
CE(SAT)
frequency applications. The IGBT has a wide reverse bias safe
operating area (RBSOA) ensuring reliability in demanding
applications. This device is optimised for traction drives and
other applications requiring high thermal cycling capability.
The module incorporates an electrically isolated base plate
and low inductance construction enabling circuit designers to
optimise circuit layouts and utilise earthed heat sinks for safety.
ORDERING INFORMATION
Order As:
GP401DDM18
Note: When ordering, please use the complete part number.
Fig. 1 Dual switch circuit diagram
Outline type code: D
Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures. 1/7
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(See Package Details for further information)
Fig. 2 Electrical connections - (not to scale)
GP401DDM18
ABSOLUTE MAXIMUM RATINGS - PER ARM
Stresses above those listed under 'Absolute Maximum Ratings' may cause permanent damage to the device. In extreme
conditions, as with all semiconductors, this may include potentially hazardous rupture of the package. Appropriate safety
precautions should always be followed. Exposure to Absolute Maximum Ratings may affect device reliability.
= 25˚C unless stated otherwise
T
case
Symbol
V
CES
V
GES
I
C
I
C(PK)
P
max
V
isol
Collector-emitter voltage
Gate-emitter voltage
Continuous collector current
Peak collector current
Max. transistor power dissipation
Isolation voltage
Parameter
THERMAL AND MECHANICAL RATINGS
Symbol
R
th(j-c)
R
th(j-c)
Thermal resistance - transistor (per arm)
Thermal resistance - diode (per arm)
Parameter
Test Conditions
= 0V
V
GE
-
= 80˚C for Tj = 125˚C
T
case
1ms, T
T
case
= 110˚C
case
= 25˚C, Tj = 150˚C
Commoned terminals to base plate. AC RMS, 1 min, 50Hz
Test Conditions
Continuous dissipation -
junction to case
Continuous dissipation -
Min.
-
-
Max.
1800
±20
400
800
3000
4000
Max.
36
80
Units
V
V
A
A
W
V
Units
˚C/kW
˚C/kW
junction to case
R
th(c-h)
Thermal resistance - case to heatsink (per module)
Mounting torque 5Nm
-
15
˚C/kW
(with mounting grease)
-
T
Junction temperature
j
Transistor
Diode
T
stg
-
Storage temperature range
Screw torque
Mounting - M6
-
–40
Electrical connections - M4
Electrical connections - M8
150
-
125
125
-
-
-
5
2
10
˚C
˚C
˚C
Nm
Nm
Nm
2/7 Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures.
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ELECTRICAL CHARACTERISTICS
T
= 25˚C unless stated otherwise.
case
GP401DDM18
Symbol
I
CES
I
GES
V
GE(TH)
V
CE(sat)
I
F
I
FM
V
F
C
ies
L
M
Parameter
Collector cut-off current
Gate leakage current
Gate threshold voltage
Collector-emitter saturation voltage
Diode forward current
Diode maximum forward current
Diode forward voltage
Input capacitance
Module inductance
Test Conditions
= 0V, VCE = V
V
GE
VGE = 0V, VCE = V
= ±20V, VCE = 0V
V
GE
I
= 20mA, VGE = V
C
CES
CES
, T
CE
VGE = 15V, IC = 400A
= 15V, IC = 400A, , T
V
GE
DC
= 1ms
t
p
= 400A
I
F
= 400A, T
I
F
= 25V, VGE = 0V, f = 1MHz
V
CE
= 125˚C
case
-
= 125˚C
case
case
= 125˚C
Min.
-
-
-
4.5
-
-
-
-
-
-
-
-
Typ.
-
-
-
5.5
2.6
3.3
-
-
2.2
2.3
45
20
Max.
1
12
2
6.5
3.2
4
400
800
2.5
2.6
-
-
Units
mA
mA
µA
V
V
V
A
A
V
V
nF
nH
Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures. 3/7
www.dynexsemi.com