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23SXX
User man
36 pgs1.18 Mb0

dresden elektronik ingenieurtechnik 23SXX User man

deRFsamR21E
-23S00/-23S20
Datasheet
deRFsamR21E-23S00
deRFsamR21E-23S20
2. Features
ATSAMR21E18 Single-chip ARM Cortex-M0+ based 32-bit Microcontroller with Low
Power 2.4 GHz Transceiver for IEEE 802.15.4 and ZigBee Applications with 256 KB Flash and 16 I/O’s - all accessible outside the module (four occupied by data flash)
- Maximum operating frequency 48 MHz
- 128-bit AES crypto engine
- 32-bit MAC symbol counter
- Temperature sensor
- Automatic transmission modes
4 Mbit data flash for firmware updates over the air and data storage Ready-to-use RF design Radio module with a link budget of up to 103 dBm CE compliant according to RED 2014/53/EU and FCC certified Single 2.5 V - 3.6 V supply Industrial temperature range -40°C to 85°C 1.27 mm / 50 mil pin header with several alternative functions:
- Analog input (12-bit, 350ksps Analog-to-Digital Converter)
- PWM output
- TWI (I2C up to 3.4MHz)
- SPI
- UART
- USB
- GPIO
- SWD programming interface
High precision 16 MHz crystal oscillator
datasheet Version 0.9 2017-09-13
deRFsamR21E-23S00/-23S20 datasheet
www.dresden-elektronik.de
Page 2 of 36
Table of contents
1. General description ......................................................................................................... 1
2. Features .......................................................................................................................... 1
1. Overview ......................................................................................................................... 6
2. Applications ..................................................................................................................... 6
3. Block diagram .................................................................................................................. 7
4. Pinout .............................................................................................................................. 9
5. Mechanical description .................................................................................................. 10
5.1. Module dimensions............................................................................................... 10
5.2. Recommended footprint ....................................................................................... 11
5.3. ECAD libraries ...................................................................................................... 12
5.4. STEP model library............................................................................................... 12
6. Electrical specification ................................................................................................... 13
6.1. Absolute Maximum Ratings ................................................................ .................. 13
6.2. Electrical Characteristics ...................................................................................... 13
6.3. TX Power register settings .................................................................................... 14
6.4. Fuse setting ................................ ................................................................ .......... 15
7. Onboard SPI Serial Flash .............................................................................................. 16
7.1. Commands ........................................................................................................... 16
7.2. Status register ...................................................................................................... 17
7.3. Flash Timings ....................................................................................................... 17
8. Recommended configuration ......................................................................................... 18
8.1. Signal description ................................................................................................. 19
8.2. UART ................................................................................................................... 19
8.3. I2C (TWI) .............................................................................................................. 20
8.4. USB ...................................................................................................................... 20
8.5. SPI ....................................................................................................................... 20
8.6. ADC ..................................................................................................................... 20
8.7. SWD ..................................................................................................................... 20
8.8. GPIO .................................................................................................................... 20
8.9. Reset .................................................................................................................... 20
9. Application Information .................................................................................................. 21
9.1. PCB Technology .................................................................................................. 21
9.2. Power supply ........................................................................................................ 21
9.3. Ground plane........................................................................................................ 21
9.4. Layers .................................................................................................................. 21
9.5. Traces below the module...................................................................................... 22
9.6. Placement on the PCB ......................................................................................... 22
9.7. Recommended layout for deRFsamR21E-23S00 ................................................. 23
9.8. RF Design for deRFsamR21E-23S20 ................................................................... 24
9.8.1. External front end and antenna diversity ................................................... 24
datasheet Version 0.9 2017-09-13
deRFsamR21E-23S00/-23S20 datasheet
www.dresden-elektronik.de
Page 3 of 36
10. Programming ................................................................................................................. 26
10.1. Software/Applications ........................................................................................... 26
10.2. Clocks .................................................................................................................. 26
10.3. Pre-flashed firmware ............................................................................................ 27
11. Radio certification .......................................................................................................... 28
11.1. United States (FCC) ............................................................................................. 28
11.2. European Union (ETSI) ........................................................................................ 29
11.3. Approved antennas .............................................................................................. 30
12. Ordering information ...................................................................................................... 31
13. Packaging dimension .................................................................................................... 32
14. Soldering profile............................................................................................................. 33
15. Revision notes ............................................................................................................... 34
16. References .................................................................................................................... 35
datasheet Version 0.9 2017-09-13
deRFsamR21E-23S00/-23S20 datasheet
www.dresden-elektronik.de
Page 4 of 36
Date
Version
Description
2017-09-13
0.9
Preliminary version
Document history
datasheet Version 0.9 2017-09-13
deRFsamR21E-23S00/-23S20 datasheet
www.dresden-elektronik.de
Page 5 of 36
Abbreviation
Description
IEEE 802.15.4
Communication standard, applicable to low-rate Wireless Personal Area Networks (WPAN)
6LoWPAN
IPv6 over Low Power Wireless Personal Area Networks
ADC
Analog to Digital Converter
ASF
Atmel Software Framework
EMI
Electromagnetic Interference
ETSI
European Telecommunications Standards Institute
FCC
Federal Communications Commission
GPIO
Generals Purpose Input Output
LNA
Low Noise Amplifier
MAC
Medium (Media) Access Control
MCU, µC
Microcontroller Unit
OTAU
Over the air update
PA
Power Amplifier
PCB
Printed Circuit Board
PWM
Pulse Width Modulation
RED
Radio Equipment Directive
RF
Radio Frequency
R&TTE
Radio and Telecommunications Terminal Equipment (Directive of the European Union)
SoC
System On Chip
SPI
Serial Peripheral Interface
SWD
Serial Wire Debug
TWI
Two-Wire Serial Interface
U[S]ART
Universal [Synchronous/]Asynchronous Receiver Transmitter
USB
Universal Serial Bus
ZigBee
Low-cost, low-power wireless mesh network standard. The ZigBee Alliance is a group of companies that maintain and publish the ZigBee standard.
Abbreviations
datasheet Version 0.9 2017-09-13
deRFsamR21E-23S00/-23S20 datasheet
www.dresden-elektronik.de
Page 6 of 36
1. Overview
The deRFsamR21E series is the second generation of small, ready-to-use radio modules that provides a fully integrated solution for wireless applications, using the IEEE802.15.4 standard in the 2.45 GHz ISM frequency band. All required RF components are already integrated on the module, therefore no expensive RF design is needed. Features can be added by simply connect­ing sensors and output stages to the module. The deRFsamR21E module series reduces time to market, effort and cost significantly for wireless applications.
The deRFsamR21E series is based on the SoC ATSAMR21E18 from Microchip/ Atmel which features an ARM Cortex-M0+ core and a 2.4 GHz ZigBee transceiver. It enables use of ZigBee
3.0 for smart devices in a wide field of applications. For this tiny series, dresden elektronik is us­ing a footprint, which offers SMD solderable side contacts in a 50 mil / 1.27 mm grid for easy assembly and inspection. The module offers 256 KB internal flash as program memory as well as 4 Mbit data flash for firmware updates over the air and data storage.
Two radio module variants are available:
deRFsamR21E-23S00: integrated RF-design with chip antenna for easy and fast
integration with no need for custom RF design and low BOM cost since all necessary components are integrated on the module
deRFsamR21E-23S20: coaxial u.FL-connector for external antenna applications as
well as a RF-pad which enables custom RF-design e.g. use of external frontend with power amplifier/ low noise amplifier or antenna diversity
Both modules are full compliant to all EU and FCC regulatory requirements.
2. Applications
The main applications for the radio modules are:
ZigBee 3.0 Smart Home Lighting Application Home Automation Wireless Sensor Networks Industrial Controlling Smart Metering 6LoWPAN
datasheet Version 0.9 2017-09-13
deRFsamR21E-23S00/-23S20 datasheet
www.dresden-elektronik.de
Page 7 of 36
ATSAMR21E18
4Mbit Serial Flash
Balun &
Harmonic
Filter
Chip
Antenna
SPI
12 GPIO
SPI
VCC
ATSAMR21E18
Balun &
Harmonic
Filter
12 GPIO
U.FL
4Mbit Serial Flash
SPI
SPI
VCC
3. Block diagram
Figure 5-15 shows the block diagram of the radio module deRFsamR21E-23S00.
Figure 3-1: Block diagram deRFsamR21E-23S00
Figure 5-2 shows the block diagram of the radio module deRFsamR21E-23S20 with u.FL
connector.
Figure 5-2: Block diagram deRFsamR21E-23S20
datasheet Version 0.9 2017-09-13
deRFsamR21E-23S00/-23S20 datasheet
www.dresden-elektronik.de
Page 8 of 36
ATSAMR21E18
Balun &
Harmonic
Filter
12 GPIO
4Mbit Serial Flash
SPI
SPI
VCC
RF-out
Figure 5-3 shows the block diagram of the radio module deRFsamR21E-23S20 with RF-out pad.
Figure 5-3: Block diagram deRFsamR21E-23S20 with RF-out pad used
datasheet Version 0.9 2017-09-13
deRFsamR21E-23S00/-23S20 datasheet
www.dresden-elektronik.de
Page 9 of 36
Top-View
1
GND
2
NC/RF-OUT1
3
GND
4
GND
27
GND
5
PA14
26
PA09
6
PA15
25
PA08
7
PA16/MISO
2
24
PA06
8
PA17/CLK
2
23
PA07
9
PA18/SS
2
22
GND
10
PA19/MOSI
2
21
RESET
11
PA24
20
PA31
12
PA25
19
PA30
13
VCC
18
PA28
14
VCC
17
PA27
15
GND
16
GND
4. Pinout
In this chapter the pinout is described. The following figure shows the pinout of the radio module. The pinout applies to both variants 23S00 and 23S20.
1. RF-OUT only for deRFsamR21E-23S20, do not connect for deRFsamR21E-23S00
2. The onboard data flash is connected to the controller at these pins. The SPI chip-
For a recommended configuration of the module pins with all common interfaces see
Section 10. A more detailed description on port to function assignment can be found in [1] Table 5-1.
and if unused. select (SS signal) is not available for use other than internal data flash control.
datasheet Version 0.9 2017-09-13
deRFsamR21E-23S00/-23S20 datasheet
www.dresden-elektronik.de
Page 10 of 36
5. Mechanical description
5.1. Module dimensions
The mechanical dimensions are described in this chapter. The modules size is
21.0 x 13.0 x 2.5 mm (0,827 x 0,512 x 0,098 inch). Figure 7-1 shows additional dimensions.
Figure 7-1: mechanical dimensions of the module
datasheet Version 0.9 2017-09-13
deRFsamR21E-23S00/-23S20 datasheet
www.dresden-elektronik.de
Page 11 of 36
5.2. Recommended footprint
Both radio module types share the same footprint, only the area which it is not allowed to place copper on is different.
Figure 7-2: Recommended Footprint for deRFsamR21E-23S00
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