TSC-40/IC is an analog touch screen control IC that performs A/D conversion on analog signal for the
4-wire and 5-wire resistive analog touch screen, and transmits coordination data with 10bit resolution to
the host in a 9600bps serial (asynchronous).
The serial communication enables a connection with PC’s serial port via RS-232C I/F circuit or TTL level.
At the coordinate detection, internal filtering process provides a stabilized coordinate value. By using the
correction function, in addition to the losses that occur in the circuit, display deflection between touch
screen input point that occur in each element and indicator cursor can be corrected to adjust the display
position.
1-3. Features
§ Two coordinate output modes are provided and selected per application: “Coordinate data mode”
where coordinate information is sent with 10bit resolution as it is, and “correction data mode” where
read coordinate is converted to the indicator’s display coordinate and sent.
§ “Correction data mode“ is available after EEPROM is externally attached. It enables to set up to nine
correction points. Coordinate data can be corrected with the base of correction points. Using this
function allows the host driver to make the implementation of correction function unnecessary. In
addition, by placing correction points at the touch screen center and center points of four edges of
touch screen, resistance value deviation of transparent electrode film can be corrected.
§ Two external switch functions are always available in the coordinate (correction) data mode. Two
pieces of external switch information are, at the transmission of coordinate data, included in the
coordinate data as pen-down/pen-up information. Since in the pen-up mode, pen-up data can be
always output to the host, this switch is available as a function switch.
§ At the touch screen input, buzzer and LED outputs are available. Input confirmation via display and
sound is available.
§ When no touch screen input is performed, the state moves to “power-save mode“ so that such
application can be supported that requests a low power consumption.
§ Seven types of coordinate output rates are provided and either can be selected per application among
seven types: six types from 30 to 150p/s plus one type, a point mode that outputs the coordinate only
one time when pen-down is performed.
Transition select pin.
H = Auto transition*1 after reset. L = transition by command.
4
EEP-DO
I
EEPROM DO input pin; At using no EEPROM, Vcc or GND is connected.
5
VREF
I
A/D converter reference voltage input pin; Vcc is connected.
6
RST
I
Reset input pin (active L).
7
CNVSS
I
Operation mode control pin; Vss is connected.
8
VCC
I
Power supply input pin; Vcc is connected.
9
XIN
I
Clock input pin; When using external clock, clock is input to this pin.
10
XOUT
O
Clock output pin; When using external clock, this pin is opened.
11
VSS
I
Power supply input pin (GND); GND is connected.
12
P30
O
Opened*2.
13
LED1
O
LED output pin; ON = Lo, OFF = Hi.
14*3
SEL2/EEP-DI
I/O
EEPROM DI signal output pin; When usingEEPROM, EEPROM DI is connected.
Whether or not EEPROM is used, connect with GND via resistance.
15*3
SEL3/EEP-CLK
I/O
EEPROM SK signal output pin; When usingEEPROM, EEPROM SK is connected.
Touch screen mode setting pin. (L=4-wire, H=5-wire)
Whether or not EEPROM is used, connect with Vcc or GND via resistance.
16*3
SEL4/EEP-CS
I/O
EEPROM setting pin shared with EEPROM CS signal output pin.
EEPROM is set via resistance and Vcc or GND is connected. (L = Used, H = Not
used).
When using EEPROM, EEPROM CS is connected.
17 O
Unused pin; Opened.
18
SYD/LL
O
Touch screen LL control pin.
19
SYU/UL
O
Touch screen UL control pin.
20
SXL/UR
O
Touch screen UR control pin.
21
SXR/LR
O
Touch screen LR control pin.
22
THO
O
Pen down detection pin.
23
THI
I
In power-save mode, start signal input pin by pen down.
24
RxD_I
I
In power-save mode, start signal input pin by command reception.
Only used serial mode, RxD is connected.
25
SEL0
I
If power supply voltage is 4.0 to 5.5V, GND is connected. If power supply voltage is
3.3 to 4.0V, Vcc is connected.
26
RxD
I/O
Data receive pin.
27
TxD
I/O
Data send pin.
28
SW1
I
SW1 input pin *4; H = ON = 1, L = OFF = 0.
29
SW0
I
SW0 input pin *4; H = ON = 1, L = OFF = 0.
30
BEEP
O
BEEP output pin; Hi output; Output frequency =2.5kHz, Output time =50ms.
*1: Auto transition = Mode changes by a command are not performed. It becomes a “Coordinate Data
Mode (150pps)” immediately after reset.
*2: Always open. If connected with VCC, VSS, or other circuit, an error operation may occur.
*3: About pin number 14, 15 and 16, immediately after a power supply injection, it works as an input
terminal and becomes an output terminal after that. Do not open these terminals.
*4: If neither SW0 nor SW1 function is used, connect 28 and 29 pins to GND directly.
Depending on that calibration is performed in either TSC-40/IC or host, you can select whether EEPROM
is used or not to store the correction data. EEPROM selection can be set via pin number 16, where
hardware reset release enables the setting.
4-2. Touch screen mode setting
Touch screen mode setting for 4-wire/5-wire is performed by setting pin number 15 to “H” or “L”. When
power supply is turned on, or hardware reset is released, pin number 15 is read to turn on in either
4-wire/5-wire mode.
4-3. Power supply voltage setting
Power supply mode setting for 3.3V/5V is performed by setting pin number 25 to “H” or “L”. When power
supply is turned on, or hardware reset is released, pin number 25 is read to turn on in either 3.3V mode/5V
mode.
*When you operate it with 3.3V mode, the inside frequency of CPU works at 3MHz, and the sampling rate
is 80pps max in calibration data mode.
(Vcc=3.3 to 5.5V, Vss=0V, Ta=-20 to 85˚C, unless otherwise noted)
*1 Vcc = 4.0 to 5.5V
*2 The total output current is the sum of all the currents flowing through all the applicable ports. The total
average current is an average value measured over 100ms. The total peak current is the peak value of
all the currents.
*3 The peak output current is the peak current flowing in each port.
*4 The average output current IOL(avg), IOH(avg) in an average value measured over 100ms.
*5 When the oscillation frequency has a duty cycle of 50%.
With a basic packaging unit of 2000, TSC-40/IC is packaged for the number of 2000 and its multiple using
damp-proof aluminum laminate bags (Basic packaging). If the delivery quantity is less than 2000 or not
multiple of 2000, or the product can not be packaged with a unit of 2000, then damp-proof aluminum
laminate bags or no damp-proof packaging specification is applicable (Small group packaging).
If packaged with small group packaging, the products may be dampened. Before packaging, the product
shall take the baking process as specified in [Baking] defined in “TSC-40/IC Storage/Implementation
Specification”.
6-2. Notes on storage/handling
(1) Handle the packages with care and avoid throwing and dropping them. Or, a large impact may be
imposed, causing packaging material’s damage, broken package or bending lead.
(2) Cardboard box may be deteriorated in its strength and deformed due to storage site’s humidity,
stacking condition and storage duration. It is desirable to keep the storage under normal
temperature/humidity (5 to 35 C, 45 to 75%RH). For warehousing, follow the FIFO principle.
(3) After unpacking, be careful in handling the product to avoid electrostatic breakdown.
This tray is heat-proof type, allowing the heating with 125 C for 24 hours. During heating/cooling process,
however, bending may occur. In baking process, to minimize the bending, heat and cool the tray by placing
it on a flat plate.
6-6. Product name label specification
DMC P/N: Product number (TSC-40/IC)
QTY: Quantity
DAC: DMC Control Number
For storing the product until its implementation, it is recommended that the following storage conditions are
applied:
1. Before unpacking the damp-proof package (Aluminum laminate bag)
Temperature and humidity: 5 to 40 C, 20 - 80%RH
Duration: Two years or less
2. After unpacking the damp-proof package (Aluminum laminate bag)
For the storing duration after the damp-proof package is unpacked and before the implementation, it is
recommended that the following storage conditions is to be applied:
(1) Reflow method: One week or less under the ambient condition: 30 C, 70%RH or less
(2) Wave soldering method: One week or less under the ambient condition: 30 C, 70%RH or less
3. Temporary storage after damp-proof package is unpacked
To store again temporarily the once unpacked and unused damp-proof package, it is recommended to
pack it again into another damp-proof bag with desiccant within a shorter time after opened (Around 10
minutes) as far as possible, and fold the bag’s opening, followed by sealing with adhesive material
such as adhesive tape, then store it under the following conditions:
Temperature, humidity: 5 to 40 C, 20 - 80%RH
Duration: One month or less
7-2. Baking
If any condition among those 1 to 3 listed below is applicable, it is recommended to apply the baking as
described below to dry the moisture the package absorbs.
You may place the tray used for damp-proof packaging directly into the thermostatic chamber since the
tray is heat-proof type. When placing into the chamber or after removing from it, to avoid deformation, cool
the tray by placing it on the flat plate such as surface table.
1. Any condition among 1 to 3 in [7-1. Storage condition] is unsatisfied
2. Indicator’s 30% Humidity Check section changes the color to lavender or pink
3. Blue color indicator of desiccant (Silica gel) changes to pink or white
Baking method
Temperature: 125 C
Duration: 20 to 24 hours
Frequency: Four times or less (Upper limit: 96 accumulative hours)
Ver1.2 (July 2, 2008)
1-4. General specification Power supply voltage DC 2.4V to 5.5V → DC 3.3V to 5.5V
Ver1.3 (March 30, 2011)
5-3. External clock timing “Input cycle” (Minimum) 166ns → 165ns
6-1. Outline (Small group packaging) “damp-proof aluminum laminate bags or” was added. 6-3. Basic packaging “Packing sample” was added.
6-4. Small group packaging “Packing sample” was added.
6-4. Small group packaging“This is an example and may not be the same as supplies.” was added.
§ When using the product, do not place it close to, or make it contact with, the conductive materials such
as metal.
§ Do not touch the metal part in the product directly with your hands. Or, it may be destructed by the static
electricity. If you contact, or may contact, it directly with your hand, prepare in advance the measure
against static electricity.
§ To store the product, use an appropriate packing box and keep the storage temperature range with no
overload on it.
§ In using the product or storing it, avoid the following conditions:
- Conditions where water is, or may be, attached to the product.
- Conditions where condensation takes place, or may take place.
- In the ambience of organic solvent or acidity or contact, or where the product contacts them.
§ Do not alter or disassemble the product.
13-2. Others
§ This specification may be changed for improvement without prior notices.
§ No liabilities are taken by us for any damage caused by use of this product.
§ This product intends to be used for the standard applications (e.g. office equipment and OA devices,
industrial use, communication devices, household equipment). Avoid its use where failure or malfunction
directly may affect the human body or special applications where extremely high reliability is required
(e.g. airline and space industries, nuclear controls, medical use for life-sustaining).
§ Semi-conductor devices may fail in a certain possibility. Keep the safety design in your mind so that
possible failure in this product shall not cause physical accidents such as injury and death, fire and other
social damages.
TSC-40/IC Product Specification
Version 1.4: Issued at May 25, 2012