DIZIC DZZBSP User Manual

DZ-ZB-SP IEEE 802.15.4/ZigBee RF Module

Quickly add wireless communication with these high performances modules

The DiZiC DZ-ZB-SP 802.15.4 Module allows you to

quickly add wireless networking capabilities to your

products. These ZigBee-compliant modules are ready-

to-use, simple to operate, and available in a wide

range of configurations. They are ideal for industrial

sensors, consumer remote controls, home appliances, and more.

Compact Form Factor – With 30 mm by 19 mm, this

module can be shielded for enhanced EMI protection.

DZ-ZB-SP Module with Shield

Complete System-on-Module

• 2.4 GHz CSS transceiver

• 32-bit ARM® Cortex-M3 processor

• 128 kB flash, 8kB RAM memory

• AES128 encryption accelerator

• Flexible ADC, UART serial communication, and general purpose timers

• Highly configurable GPIO with Schmitt trigger inputs

Industry-leading ARM Cortex-M3 processor

• Leading 32-bit processing performance

• Highly efficient Thumb-2 instruction set

• Operation at 6, 12 or 24 MHz

• Flexible Nested Vectored Interrupt Controller

Innovative network and processor debug

• Serial Wire Debug interface

• Standard ARM debug capabilities:

Flash Patch &Breakpoint; Data Watch-point & Trace

RF Performances

• Rx sensitivity (- 100 dBm)

• Tx output power level (+8 dBm)

Low power consumption, advanced management

• RX Current (w/ CPU): 27 mA

• TX Current (w/ CPU, +3dBm) 31 mA

• Low deep sleep current, less than 400nA

• Low-frequency internal RC oscillator for lowpower sleep timing

• High-frequency internal RC oscillator for fast (100 usec) processor start-up from sleep

Target Applications

• Smart Energy

• Building automation and control (HVAC)

• Home automation and control

• Security and monitoring

• AMR/AMI

• Medical

• General ZigBee wireless sensor networking

• Wireless hand-held terminals

• Industry telemetry /automatic data

collection

• Temperature and humidity control systems

Table of Content

1. Product Approvals....................................................................................................................................... 4

1.1. FCC Approvals...................................................................................................................................... 4

1.2. IC (Industry Canada) Approvals............................................................................................................ 4

1.3. European Certification (ETSI)............................................................................................................... 5

2. Configuration.............................................................................................................................................. 6

2.1. Power Level Option [S]......................................................................................................................... 6

2.2. RF Output Options: Codes [P], [I] or [E] .............................................................................................. 6

2.3. Protocol Stack Options: Codes [F], [X] or [Z] ...................................................................................... 6

2.4. EMI Protection Options: Codes [M] or [].............................................................................................. 6

3. Block Diagram............................................................................................................................................ 7

4. Absolute Maximum Rating......................................................................................................................... 8

4.1. Voltage Characteristics.......................................................................................................................... 8

4.2. Current Characteristics.......................................................................................................................... 8

4.3. Thermal Characteristics......................................................................................................................... 8

5. Components ................................................................................................................................................ 9

5.1. STM32W108 –System-on-Chip Transceiver ........................................................................................ 9

5.1.1. IEEE802.15.4 Compliant Transceiver............................................................................................... 9

5.1.2. Operation Modes............................................................................................................................... 9

5.1.3. Flash and RAM Memory................................................................................................................. 10

5.1.4. Integrated MAC Functions.............................................................................................................. 10

5.1.5. Power Management......................................................................................................................... 10

5.1.6. Peripherals....................................................................................................................................... 10

5.1.7. Interfaces......................................................................................................................................... 10

5.2. Protocol Stacks.................................................................................................................................... 11

6. Electrical Characteristics........................................................................................................................... 12

6.1. Parameter conditions........................................................................................................................... 12

6.1.1. Minimum and Maximum Values.................................................................................................... 12

6.1.2. Typical values ................................................................................................................................. 12

6.2. Operating Conditions........................................................................................................................... 12

6.2.1. General Operating Conditions......................................................................................................... 12

6.2.2. Electrostatic Discharge (ESD)......................................................................................................... 13

6.2.3. DC Characteristics .......................................................................................................................... 13

6.3. RF Characteristic................................................................................................................................. 15

6.3.1. Receiver Characteristics.................................................................................................................. 15

6.3.2. Transmitter Characteristics ....................................................................................................................... 15

7. Mechanical Characteristics ....................................................................................................................... 16

7.1. Module Pad Diagram........................................................................................................................... 16

7.2. Module Pads........................................................................................................................................ 16

7.3. Module Mechanical Dimensions......................................................................................................... 23

8. Soldering................................................................................................................................................... 24

8.1. Soldering (Reflow) Profile .................................................................................................................. 24

8.2. Profile Parameters................................................................................................................................ 24

8.3. Recommended Footprint ..................................................................................................................... 25

9. References................................................................................................................................................. 26

Document Information.......................................................................................................................................... 27

Revision History ................................................................................................................................................... 27

About DiZiC ......................................................................................................................................................... 27

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Table of Figures

Fig. 1 Simplified Block Diagram of the Module..................................................................................................... 7

Fig. 2 Block diagram of System-on-Chip STM32W108.........................................................................................9

Fig. 3 Available protocol stacks............................................................................................................................ 11

Fig. 4 Pad connection diagram for modules (top view)........................................................................... ............. 16

Fig. 5 Standard module dimensions with metal shielding..................................................................................... 23

Fig. 6 Recommended Temperature Profile for Soldering (Reflow)...................................................................... 24

Fig. 7 Recommended Footprint for Module.......................................................................................................... 25

Fig. 8 Recommended Footprint for Module.......................................................................................................... 25

List of Tables

Table 1: Power level option .................................................................................................................................... 6

Table 2: Output options........................................................................................................................................... 6

Table 3: Protocol stack options............................................................................................................................... 6

Table 4: EMI protection options............................................................................................................................. 6

Table 5: Voltage characteristics.............................................................................................................................. 8

Table 6: Current characteristics .............................................................................................................................. 8

Table 7: Thermal characteristics............................................................................................................................. 8

Table 8: General operating conditions.................................................................................................................. 12

Table 9: ESD absolute maximum ......................................................................................................................... 13

Table 10: DC electrical characteristics.................................................................................................................. 14

Table 11: Receiver characteristics......................................................................................................................... 15

Table 12: Transmitter characteristics.................................................................................................................... 15

Table 13: Pad description...................................................................................................................................... 22

Table 14: Solder Reflow Parameters..................................................................................................................... 24

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1. Product Approvals

The DZ-ZB-SP has been designed to meet all national regulations for world-wide use. The transmitter module may not be co-located with any other transmitter or antenna. Please be advised that DiZiC Co., Ltd. declares that the DZ-ZB-G module will be used exclusively by OEM’s or ODM’s and will therefore not be directly accessible by end users.

1.1. FCC Approvals

The DZ-ZB-SP with PCB Antenna has been tested to comply with FCC CFR Part 15 (USA) The devices meet the requirements for modular transmitter approval as detailed in the FCC public notice DA00.1407.transmitter.

FCC statement:

This device complies with Part 15 of the FCC rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.

FCC ID: YCMDZZBSP

The FCC requires the user to be notified that any changes or modifications made to this device that are not expressly approved by the manufacturer may void the user's authority to operate the equipment.

FCC Labeling Requirements

When integrating the DZ-ZB-SP into a product it must be ensured that the FCC labeling requirements are met. This includes a clearly visible label on the outside of the finished product specifying the DiZiC FCC identifier (FCC ID: YCMDZZBSP) as well as the FCC notice shown on the previous page. This exterior label can use wording such as "Contains Transmitter Module FCC ID: YCMDZZBSP “ or "Contains FCC ID: YCMDZZBSP " although any similar wording that expresses the same meaning may be used.

1.2. IC (Industry Canada) Approvals

The DZ-ZB-SP with integrated Antenna has been tested to comply with IC.

IC-ID: 9022A- DZZBSP

The labeling requirements for Industry Canada are similar to those of the FCC. Again, a clearly visibly label must be placed on the outside of the finished product stating something like "Contains Transmitter Module, IC: 9022A- DZZBSP ", although any similar wording that expresses the same meaning may be used.

IC (Industry Canada) statement:

This module complies with Industry Canada RF radiation exposure limits set forth for general population/uncontrolled environment. This device complies with Industry Canada licence-exempt RSS standard(s).Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device.

The integrator is responsible for the final product to comply to IC ICES-003 and FCC Part 15, Sub. B Unintentional Radiators.

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1.3. European Certification (ETSI)

The DZ-ZB-SP has been certified to the following standards:

 Radio: EN 300 328:V1.7.1

 EMC: EN 301 489-17:V2.1.1

 Safety: EN 60950-1:2005 (Ed. 2.0)

If the DZ-ZB-SP module is incorporated into an OEM product, the OEM product manufacturer must ensure compliance of the final product to the European Harmonized EMC, and low voltage/ safety standards. A Declaration of Conformity must be issued for each of these standards and kept on file as described in Annex II of the R&TTE Directive. The final product must not exceed the specified power ratings, antenna specifications and installation requirements as specified in this user manual. If any of these specifications are exceeded in the final product then a submission must be made to a notified body for compliance testing to all of the required standards.

The 'CE' marking must be applied to a visible location on any OEM product. For more information please refer to http://ec.europa.eu/enterprise/faq/ce-mark.htm. Customers assume full responsibility for learning and meeting the required guidelines for each country in their distribution market.

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2. Configuration

The module comes with different configuration options. RF Output Options, Protocol Stack Options, and EMI Protection Options.

2.1. Power Level Option [S]

The module DZ-ZB-S has the power option S preselected.

Selector Options Description

STM32W chip: System on Chip - where radio, microcon-

[S] Standard +8dBm

Table 1: Power level option

2.2. RF Output Options: Codes [P], [I] or [E]

Three RF output options are available, including an onboard PCB antenna or a U.FL connector.

Selector Options Description

[P] Embedded PCB Antenna

[I] I-PEX / U.FL connector

[E] External +2dBi dipole Antenna

Table 2: Output options

troller, program/user memory, RAM, ZigBee protocols stack are integrated in one chi

2.3. Protocol Stack Options: Codes [F], [X] or [Z]

Three protocol stack options are available, including an RF4CE stack, a Zigbee Pro stack from Ember, and a proprietary MAC/Phy stack

Selector Options Description

[F] RF4CE stack

[X] Proprietary stack

[Z] EmberZnet PRO stack

Table 3: Protocol stack options

2.4. EMI Protection Options: Codes [M] or []

A metal shield cap can be added to the module for EMI protection.

Selector Options Description

[M] Metal shield cap

[ ] Standard module RF Module without metal shielding

Table 4: EMI protection options

Enables enhanced level of electromagnetic immunity (EMI) protection.

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3. Block Diagram

The DZ-ZB Module is low-power, highly sensitivity IEEE 802.15.4 / ZigBee-compliant module. This multi-functional device is based on the STMicroelectronics STM32W108 fully integrated System-onChip [1] (STM32W108CBU6x version).

This STM32W108 SoC integrates a 2.4 GHz IEEE 802.15.4-compliant transceiver, a 32-bit ARM® Cortex™- M3 microprocessor, Flash and RAM memory, as well as peripherals for use by designers of ZigBee-based systems [2]

nRESETVSS VCC

Output Options:

Embedded PCB Antenna

Power

Manager

Decoupling

Power On

Reset

MAC and

Baseband

GPIO / ADC

Timers

other periph.

Transceiver

Crystal

Oscillator

Impedance

Matching

Network

50 Ohm U.FL Coax Connector

STM32W108

DZ-ZB-P-O-S-E

GPIO

Fig. 1 Simplified Block Diagram of the Module

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4. Absolute Maximum Rating

Stresses above the absolute maximum ratings listed in this section may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these conditions is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability

4.1. Voltage Characteristics

Ratings Min. Max. Unit

VCC input voltage (VDD_PADS) -0.3 +3.6 V

RF Input Power (for max level for correct packet reception Receive characteristics) RX signal input

Voltage on any GPIO (PA[7:0], PB[7:0], PC[7:0]), SWCLK, nRESET

Table 5: Voltage characteristics

15 dBm

-0.3

VDD_PADS

+0.3

4.2. Current Characteristics

Symbol Ratings Max. Unit

IVDD Total current into VDD/VDDA power lines (source) 150 mA

IVSS Total current out of VSS ground lines (sink) 150 mA

IIO Output current sunk by any I/O and control pin 25 mA

Table 6: Current characteristics

4.3. Thermal Characteristics

Symbol Ratings Value Unit

TSTG Storage temperature range -40 to +85 °C

TJ Maximum junction temperature 150 °C

Table 7: Thermal characteristics

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5. Components

This section describes the key components of the DZ-ZB Module including the STM32W108 SoC, the

RF Front End, and the protocol stacks.

5.1. STM32W108 –System-on-Chip Transceiver

The STM32W108 is a fully integrated System-on-Chip that includes:

 2.4 GHz, IEEE 802.15.4 compliant transceiver

 32-bit ARM® Cortex™ -M3 microprocessor

 Flash and RAM memory

 Peripherals for use of designers of ZigBee-based systems

Fig. 2 Block diagram of System-on-Chip STM32W108

5.1.1. IEEE802.15.4 Compliant Transceiver

This SoC transceiver utilizes an efficient architecture that exceeds the dynamic range requirements imposed by the IEEE 802.15.4-2003 standard by over 15 dB. The integrated receive channel filtering allows for robust co-existence with other communication standards in the 2.4 GHz spectrum such as IEEE 802.11 and Bluetooth. The integrated regulator, VCO, loop filter, and power amplifier keep the external component count low. An optional high performance radio mode (boost mode) is softwareselectable to boost dynamic range.

5.1.2. Operation Modes

The integrated 32-bit ARM® Cortex™-M3 microprocessor is highly optimized for high performance, low power consumption, and efficient memory utilization. With its integrated MPU, the STM32W108 supports two different modes of operation: System mode and Application mode.

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