DIZIC DZZBG User Manual

DZ-ZB-G IEEE 802.15.4/ZigBee RF Module

Quickly add wireless communication with these high performances modules

The DiZiC DZ-ZB-G 802.15.4 module series allows

you to quickly add wireless networking capabilities to

your products. These ZigBee-compliant modules are

ready-to-use, simple to operate, and available in a

wide range of configurations. They are ideal for

industrial sensors, consumer remote controls, home appliances, and more.

Compact Form Factor – With 25 mm by 19 mm, this

module can be shielded for enhanced EMI protection.

DZ-ZB-G Module with Shield

Complete System-on-Module

• 2.4 GHz CSS transceiver

• 32-bit ARM® Cortex-M3 processor

• 128 kB flash, 8kB RAM memory

• AES128 encryption accelerator

• Flexible ADC, UART serial communication, and general purpose timers

• Highly configurable GPIO with Schmitt trigger inputs

Industry-leading ARM Cortex-M3 processor

• Leading 32-bit processing performance

• Highly efficient Thumb-2 instruction set

• Operation at 6, 12 or 24 MHz

• Flexible Nested Vectored Interrupt Controller

Innovative network and processor debug

• Serial Wire Debug interface

• Standard ARM debug capabilities:

Flash Patch &Breakpoint; Data Watch-point & Trace

RF Performances

• Rx sensitivity (- 105 dBm)

• Tx output power level (+20 dBm)

Low power consumption, advanced management

• RX Current (w/ CPU): 35 mA

• TX Current (w/ CPU, +20dBm) 130 mA

• Low deep sleep current, less than 6 μA

• Low-frequency internal RC oscillator for lowpower sleep timing

• High-frequency internal RC oscillator for fast (100 usec) processor start-up from sleep

Target Applications

• Smart Energy

• Building automation and control (HVAC)

• Home automation and control

• Security and monitoring

• AMR/AMI

• Medical

• General ZigBee wireless sensor

networking

• Wireless hand-held terminals

• Industry telemetry /automatic data

collection

• Temperature and humidity control systems

Table of Content

1. Product Approvals.......................................................................................................................................4

1.1. FCC Approvals .....................................................................................................................................4

1.2. IC (Industry Canada) Approvals...........................................................................................................4

1.3. Product Warranty..................................................................................................................................5

2. Configuration...............................................................................................................................................6

2.1. Power Level Option [G]........................................................................................................................6

2.2. RF Output Options: Codes [A], [U], [X] or [E]....................................................................................6

2.3. Protocol Stack Options: Codes [F], [X] or [Z]......................................................................................6

2.4. EMI Protection Options: Codes [M] or [ ]....................................................................................... .....6

3. Block Diagram.............................................................................................................................................7

4. Absolute Maximum Rating..........................................................................................................................8

4.1. Voltage Characteristics .........................................................................................................................8

4.2. Current Characteristics..........................................................................................................................8

4.3. Thermal Characteristics ........................................................................................................................8

5. Components.................................................................................................................................................9

5.1. STM32W108 –System-on-Chip Transceiver........................................................................................9

5.1.1. IEEE802.15.4 Compliant Transceiver...................................................................................................9

5.1.2. Operation Modes...................................................................................................................................9

5.1.3. Flash and RAM Memory ....................................................................................................................10

5.1.4. Integrated MAC Functions..................................................................................................................10

5.1.5. Power Management.............................................................................................................................10

5.1.6. Peripherals...........................................................................................................................................10

5.1.7. Interfaces.............................................................................................................................................10

5.2. Protocol Stacks....................................................................................................................................11

6. Electrical Characteristics ...........................................................................................................................12

6.1. Parameter conditions ...........................................................................................................................12

6.1.1. Minimum and Maximum Values........................................................................................................12

6.1.2. Typical values.....................................................................................................................................12

6.2. Operating Conditions..........................................................................................................................12

6.2.1. General Operating Conditions.............................................................................................................12

6.2.2. Electrostatic Discharge (ESD) ............................................................................................................13

6.2.3. DC Characteristics ..............................................................................................................................13

6.3. RF Characteristic.................................................................................................................................15

6.3.1. Receiver Characteristics......................................................................................................................15

6.3.2. Transmitter Characteristics........................................................................................................................15

7. Mechanical Characteristics........................................................................................................................16

7.1. Module Pad Diagram..........................................................................................................................16

7.2. Module Pads........................................................................................................................................16

7.3. Module Mechanical Dimensions.........................................................................................................22

8. Soldering....................................................................................................................................................23

8.1. Soldering (Reflow) Profile..................................................................................................................23

8.2. Profile Parameters...............................................................................................................................23

8.3. Recommended Footprint.....................................................................................................................24

9. References .................................................................................................................................................25

Document Information ..........................................................................................................................................26

Revision History....................................................................................................................................................26

About DiZiC..........................................................................................................................................................26

October 2012 Doc ID:DZ DS-ZBGx MOD rev1.5

Table of Figures

Fig. 1 Simplified Block Diagram of the Module.....................................................................................................7

Fig. 2 Block diagram of System-on-Chip STM32W108.........................................................................................9

Fig. 3 Available protocol stacks. ...........................................................................................................................11

Fig. 4 Pad connection diagram for modules (top view).........................................................................................16

Fig. 5 Standard module dimensions without metal shielding................................................................................22

Fig. 6 Standard module dimensions with metal shielding.....................................................................................22

Fig. 7 Recommended Temperature Profile for Soldering (Reflow)......................................................................23

Fig. 8 Recommended Footprint for Module..........................................................................................................24

List of Tables

Table 1: Power level option.....................................................................................................................................6

Table 2: Output options...........................................................................................................................................6

Table 3: Protocol stack options................................................................................................................................6

Table 4: EMI protection options..............................................................................................................................6

Table 5: Functional description on Front End Module signals................................................................................7

Table 6: Voltage characteristics...............................................................................................................................8

Table 7: Current characteristics...............................................................................................................................8

Table 8: Thermal characteristics..............................................................................................................................8

Table 9: General operating conditions...................................................................................................................12

Table 10: ESD absolute maximum........................................................................................................................13

Table 11: DC electrical characteristics..................................................................................................................14

Table 12: Receiver characteristics.........................................................................................................................15

Table 13: Transmitter characteristics.....................................................................................................................15

Table 14: Pad description. .....................................................................................................................................21

Table 15: Solder Reflow Parameters.....................................................................................................................23

October 2012 Doc ID:DZ DS-ZBGx MOD rev1.5

1. Product Approvals

The DZ-ZB-G has been designed to meet all national regulations for world-wide use. The transmitter module may not be co-located with any other transmitter or antenna. Please be advised that DiZiC Co., Ltd. declares that the DZ-ZB-G module will be used exclusively by OEM’s or ODM’s and will therefore not be directly accessible by end users. The radio must be installed in a host that will have at least 20cm distance between radio’s antenna and human body.

1.1. FCC Approvals

The DZ-ZB-G with PCB Antenna has been tested to comply with FCC CFR Part 15 (USA) The devices meet the requirements for modular transmitter approval as detailed in the FCC public notice DA00.1407.transmitter.

FCC statement:

This device complies with Part 15 of the FCC rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.

FCC ID: YCMDZZBG

The FCC requires the user to be notified that any changes or modifications made to this device that are not expressly approved by the manufacturer may void the user's authority to operate the equipment.

FCC Labeling Requirements

When integrating the DZ-ZB-G into a product it must be ensured that the FCC labeling requirements are met. This includes a clearly visible label on the outside of the finished product specifying the DiZiC FCC identifier (FCC ID: YCMDZZBG) as well as the FCC notice shown on the previous page. This exterior label can use wording such as "Contains Transmitter Module FCC ID: YCMDZZBG “ or "Contains FCC ID: YCMDZZBG " although any similar wording that expresses the same meaning may be used.

1.2. IC (Industry Canada) Approvals

The DZ-ZB-SP with integrated Antenna has been tested to comply with IC.

IC-ID: 9022A- DZZBG

The labeling requirements for Industry Canada are similar to those of the FCC. Again, a clearly visibly label must be placed on the outside of the finished product stating something like "Contains Transmitter Module, IC: 9022A- DZZBG ", although any similar wording that expresses the same meaning may be used.

IC (Industry Canada) statement:

This module complies with Industry Canada RF radiation exposure limits set forth for general population/uncontrolled environment. This device complies with Industry Canada licence-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. The integrator is responsible for the final product to comply to IC ICES-003 and FCC Part 15, Sub. B Unintentional Radiators.

October 2012 Doc ID:DZ DS-ZBGx MOD rev1.5

Notice for channel 25:

Special care needs to be taken on channel 25 in order to not generate out of band signals. At maximum duty cycle (100%) the setting shall be 7.56dBm (power setting -11) to pass the FCC certification, however in more common cases where the duty cycle is lower than 100% the power level can be increased according to FCC rules.

A simple method can be used to determine the maximum output level to be applied.

Duty cycle correction factor (dB) = 20 log (duty cycle)

Use of External Antenna:

The module has been approved with an external quarter wave dipole antenna of 2dBi gain. Any use of an antenna with a gain > 2 dBi is strictly forbidden, unless the output power is reduced accordingly.

1.3. Product Warranty

DiZiC warrants this product against defects in materials and workmanship for a period of 1 year. If a defect is discovered, DiZiC will at its option, repair or replace the product at no charge provided it is returned during the warranty period, with transportation charges prepaid, to the authorized DiZiC dealer from whom you purchased the product. Proof of purchase may be required.

This warranty does not apply if the product has been damaged by accident, abuse, misuse, or misapplication; if the product has been modified without the written permission of DiZiC; or if any DiZiC serial number has been removed or defaced.

THE WARRANTY AND REMEDIES SET FORTH ABOVE ARE EXCLUSIVE IN LIEU OF ALL OTHERS, WHETHER ORAL OR WRITTEN, EXPRESSED OR IMPLIED. DiZiC SPECIFICALLY DISCLAIMS ANY AND ALL IMPLIED WARRANTIES, INCLUDING, WITHOUT LIMITATION, WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE.

No DiZiC dealer, agent, or employee is authorized to make any modification, extension, or addition to this warranty.

DiZiC IS NOT RESPONSIBLE FOR SPECIAL, INCIDENTAL, OR CONSEQUENTIAL DAMAGES RESULTING FROM ANY BREACH OF WARRANTY, OR UNDER ANY OTHER LEGAL THEORY, INCLUDING BUT NOT LIMITED TO LOST PROFITS, DOWNTIME, GOODWILL, DAMAGE TO OR REPROGRAMMING, OR REPRODUCING ANY PROGRAM OR DATA STORED IN OR USED WITH DiZiC PRODUCTS.

Some states do not allow the exclusion or limitation of incidental or consequential damages or exclusions of implied warranties, so the above limitations of exclusions may not apply to you. This warranty gives you specific legal rights, and you may also have other rights that vary from state to state.

October 2012 Doc ID:DZ DS-ZBGx MOD rev1.5

2. Configuration

The module comes with different configuration options. RF Output Options, Protocol Stack Options, and EMI Protection Options.

2.1. Power Level Option [G]

The module DZ-ZB has the power option G preselected.

Selector Options Description

STM32W chip: System on Chip - where radio, microcon-

[G] Standard + 20dBm

Table 1: Power level option

2.2. RF Output Options: Codes [A], [U], [X] or [E]

Three RF output options are available, including an onboard antenna and an U.FL connector.

troller, program/user memory, RAM, ZigBee protocols stack are integrated in one chi

Selector Options Description

[A] Embedded SMD Antenna

[U]

[X]

[E]

Table 2: Output options

U.FL 50 　 coaxial connector

Embedded SMD Antenna and U.FL 50 　 coaxial connector

With +2dBi external Dipole antenna

2.3. Protocol Stack Options: Codes [F], [X] or [Z]

Three protocol stack options are available, including an RF4CE stack, a Zigbee Pro stack from Ember, and a proprietary MAC/Phy stack

Selector Options Description

[F] RF4CE stack

[X] Proprietary stack

[Z] EmberZnet PRO stack

Table 3: Protocol stack options

2.4. EMI Protection Options: Codes [M] or [ ]

A metal shield cap can be added to the module for EMI protection.

Selector Options Description

[M] Metal shield cap

Enables enhanced level of electromagnetic immunity (EMI) protection.

[ ] Standard module RF Module without metal shielding

Table 4: EMI protection options

October 2012 Doc ID:DZ DS-ZBGx MOD rev1.5

3. Block Diagram

The DZ-ZB Module is low-power, highly sensitivity IEEE 802.15.4 / ZigBee-compliant module. This multi-functional device is based on the STMicroelectronics STM32W108 fully integrated System-onChip [1] (STM32W108CBU6x version).

This STM32W108 SoC integrates a 2.4 GHz IEEE 802.15.4-compliant transceiver, a 32-bit ARM® Cortex™- M3 microprocessor, Flash and RAM memory, as well as peripherals for use by designers of ZigBee-based systems [2]

Fig. 1 Simplified Block Diagram of the Module

FEM Signal name Direction Description

TxRx Digital input to FEM

ANT_SEL Digital input to FEM

CSD Digital input to FEM

CPS Digital input to FEM

Table 5: Functional description on Front End Module signals.

TxRx = 1: Transmit Mode TxRx = 0: Receive Mode

Antenna Switch: ANT_SEL = 0: Select UF.L connector. ANT_SEL = 1: Select SMD antenna.

Sleep mode CPS = 0: All OFF low power mode CPS = 1: Power ON

LNA Control CPS = 0: LNA OFF bypass mode CPS = 1: LNA ON

October 2012 Doc ID:DZ DS-ZBGx MOD rev1.5

STM32W108

Port name

PC5, TX_ACTIVE

PB5

PB6

PB7

4. Absolute Maximum Rating

Stresses above the absolute maximum ratings listed in this section may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these conditions is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability

4.1. Voltage Characteristics

Ratings Min. Max. Unit

VCC input voltage (VDD_PADS) -0.3 +3.6 V

RF Input Power (for max level for correct packet reception Receive characteristics) RX signal input

Voltage on any GPIO (PA[7:0], PB[7:0], PC[7:0]), SWCLK, nRESET

Table 6: Voltage characteristics

15 dBm

-0.3

VDD_PADS

+0.3

4.2. Current Characteristics

Symbol Ratings Max. Unit

IVDD Total current into VDD/VDDA power lines (source) 150 mA

IVSS Total current out of VSS ground lines (sink) 150 mA

IIO Output current sunk by any I/O and control pin 25 mA

Table 7: Current characteristics

4.3. Thermal Characteristics

Symbol Ratings Value Unit

TSTG Storage temperature range -40 to +85 °C

TJ Maximum junction temperature 150 °C

Table 8: Thermal characteristics

October 2012 Doc ID:DZ DS-ZBGx MOD rev1.5

+ 18 hidden pages

DIZIC DZZBG User Manual

Specifications and Main Features

Frequently Asked Questions

User Manual