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Elektronik GmbH
LCD MODULE
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DEM 128064F1 FGH-PW
Product Specification
16.08.2021
GENERAL SPECIFICATION
MODULE NO. :
DEM 128064F1 FGH-PW
VERSION
NO.
0 Original Version 16.08.2021
CHANGE DESCRIPTION DATE
PREPARED BY: LM DATE: 16.08.2021
APPROVED BY: WH DATE: 16.08.2021
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DEM 128064F1 FGH-PW Product Specification
CONTENTS
1. FUNCTIONS & FEATURES…………………………………………………………..2
2. MECHANICAL SPECIFICATIONS ............................................................................ 3
3. EXTERNAL DIMENSIONS .......................................................................................... 4
4. BLOCK DIAGRAM ........................................................................................................ 5
5. PIN DESCRIPTION ........................................................................................................ 6
6. ABSOLUTE MAXIMUM RATINGS ............................................................................ 7
7. BACKLIGHT CHARACTERISTICS ........................................................................... 7
8. ELECTRICAL CHARACTERISTICS ......................................................................... 8
9. INSTRUCTION DESCRIPTION ................................................................................ 12
10. LCD ARTWORK ......................................................................................................... 13
11.PAD CONFIGURATION ............................................................................................. 14
12. LCD LABELING ......................................................................................................... 15
13. SEG LAYOUT .............................................................................................................. 16
14 COM LAYOUT ............................................................................................................. 16
15. PAD CONFIGURATION GRAPHIC DIMENSION ............................................... 17
16. IC LAYOUT ................................................................................................................. 17
17. QUALITY DESCRIPTION ........................................................................................ 18
18. MODULE ACCEPTS QUALITY LEVEL (AQL). .................................................. 19
19. RELIABILITY TEST.................................................................................................. 19
20. LCD MODULES HANDLING PRECAUTIONS .................................................... 20
21. OTHERS ....................................................................................................................... 20
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DEM 128064F1 FGH-PW Product Specification
1. FUNCTIONS & FEATURES
l DEM128064F1 Series LCD Type :
MODULE LCD TYPE REMARKS
DEM 128064F1 FGH-PW FSTN Transflective positive Mode
l Viewing Direction : 6 O’clock
l Driving Scheme : 1/65 Duty Cycle, 1/9 Bias
l Power Supply Voltage(Typ.) : 3.0 V
l LCD Operation Voltage : 9.8 V
l Display Contents :128x64 Dots
l Backlight Color : White
l Driver IC : IST3004-TX
l Operating Temperature :-20°C ～ +70°C
l Storage Temperature :-30°C ～ +80°C
l RoHS Compliant
2. MECHANICAL SPECIFICATIONS
l Module Size: : 68.80 x 49.20 x 8.50mm
l Viewing Area Size: : 60.60 x 33.10 mm
l Active Area Size : 55.01 x 27.49mm
l Dot Pitch: : 0.43 x 0.43mm
l Dot Size: : 0.40 x 0.40mm
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DEM 128064F1 FGH-PW Product Specification
3. EXTERNAL DIMENSIONS
DEM 128064F1 FGH-PW /V
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DEM 128064F1 FGH-PW Product Specification
K
4. BLOCK DIAGRAM
/CS1
RESB
A0
RW_WRB
E_RDB
DB0
DB1
DB2
DB3
DB4
DB5
DB6(SCL)
DB7(SI)
VDD
VSS
VOUT
C3+
C1C1+
C2+
C2V4
V3
V2
V1
V0
C68
P/S
IST3004-TX
COM32~COM63
SEG0~SEG127
COM0~COM31
LCD PANEL
128*64
A
BACKLIGHT
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DEM 128064F1 FGH-PW Product Specification
5. PIN DESCRIPTION
Pin No.
Name I/O Description
1 CS1B I
2 RESB I
3 A0 I
4 RW_WRB
5 E_RDB I
6~13 DB0~DB7
14 VDD Supply
I
I/O
Chip select input pins
Data / instruction I/O is enabled only when CS1B is “L” and CS2 is “H”. when chip
select is non-active, DB0 to DB7 may be high impedance
Hardware Reset input pin
When RESB is “L”, initialization is executed.
Register select input pin
- A0 = “H” : DB0 to DB7 are display data
- A0 = “L” : DB0 to DB7 are control data
Read / Write execution control pin
C86 MPU Type RW_WRB Description
H 6800-series WR
L 8080-series /WRB
Read / Write execution control pin
C86 MPU Type E_RDB Description
H 6800-series E
L 8080-series /RDB
8-bit bi-directional data bus that is connected to the standard 8-bit microprocessor data
bus. When the serial interface selected (PS = “L”);
- DB0 to DB5 : high impedance
- DB6 : serial input clock (SCL)
- DB7 : serial input data (SDI)
When chip select is not active, DB0 to DB7 may be high impedance.
- RW = “H” : When E is “H”, DB0 to DB7 are in an
- RW = “L” : The data on DB0 to DB7 are latched
When / RDB is “L”, DB0 to DB7 are in an output
Read / Write control input pin
- RW = “H” : read
- RW = “L” : write
The data on DB0 to DB7 are latched at the rising
Write enable clock input pin
edge of the /WRB signal.
Read / Write control input pin
output status.
at the falling edge the E signal.
Read enable clock input pin
status.
Power supply for logic.
15 VSS Supply
16 Vout Supply
17 C3+ O
18 C1- O
19 C1+ O
20 C2+ O
21 C2- O
22 V4
23 V3
24 V2
Supply
25 V1
26 V0
27 C68 I
28 P/S I
Ground.
DC/DC voltage converter
LCD driver supply voltages
The voltage determined by LCD pixel is impedance-converted by an operational
amplifier for application.
Voltages should have the following relationship;
V0 ≥ V1 ≥ V2 ≥ V3 ≥ V4 ≥ VSS
When the internal power circuit is active, these voltages are generated as following as
following table according to the state of LCD bias.
LCD bias V1 V2 V3 V4
1/9bias (8/9) xV0 (7/9) xV0 (2/9) xV0 (1/9) xV0
Microprocessor Interface Select input pin in parallel mode
- C68 = “H” : 6800-series MPU interface
- C68 = “L” : 8080-series MPU interface
Parallel / serial data input select input
<NOTE> In serial mode, it is impossible to read data from the on-chip RAM. And DB0 to DB5 and E_RDB and
RW_WRB must be fixed to either “H” or “L”.
Interface
PS
Mode
“H” Parallel CS1B A0 DB0 to DB7 E_RDB RW_WRB -“L” Serial CS1B A0 SDI (DB7) Write only SCL (DB6)
Chip Select
Data /
instruction
Data Read / Write Serial clock
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DEM 128064F1 FGH-PW Product Specification
A
K
6. ABSOLUTE MAXIMUM RATINGS
Power Supply Voltage VDD -0.3 ~ 7.0 V
Power supply voltage (VDD standard) V0, VOUT -0.3 ~ 15.0 V
Power supply voltage (VDD standard) V1, V2, V3, V4 -0.3 to V0 V
Operating temperature TOPR –20 to +70 °C
Storage temperature TSTR –30 to +80 °C
7. BACKLIGHT CHARACTERISTICS
Supply voltage for backlight LED+
Supply voltage for backlight LED-
Parameter Symbol Conditions Unit
单位 测定条件最小值 典型值符号 最大值项目
正向电压
消耗功率
均匀度
亮度
色度坐标
峰值波长
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DEM 128064F1 FGH-PW Product Specification
8. ELECTRICAL CHARACTERISTICS
8.1. DC CHARACTERISTICS
Item Symbol Condition
Operating Voltage VDD Relative to VSS 2.7 3.0 3.3
LCD Driving Voltage VLCD Relative to VSS 9.6 9.8 10
Consumption Current IDD - - TBD - mA
8.2. AC CHARACTERISTICS
STANDARD VALUE
Min. Typ. Max.
units
V
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DEM 128064F1 FGH-PW Product Specification
9. INSTRUCTION DESCRIPTION
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DEM 128064F1 FGH-PW Product Specification
10. LCD ARTWORK
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DEM 128064F1 FGH-PW Product Specification
11.PAD CONFIGURATION
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DEM 128064F1 FGH-PW Product Specification
12. LCD LABELING
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DEM 128064F1 FGH-PW Product Specification
13. SEG LAYOUT
14 COM LAYOUT
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DEM 128064F1 FGH-PW Product Specification
15. PAD CONFIGURATION GRAPHIC DIMENSION
16. IC LAYOUT
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DEM 128064F1 FGH-PW Product Specification
W
L
17. QUALITY DESCRIPTION
DEFECT SPECIFICATION:
Specific type-related items are covered in this sheet.
a: Table for Cosmetic defects
(Note: nc = not counted).
Sizes and number of defects
(Max. Qty)
Defect Type
Black or White Spots
Black or White Lines
Max. defect size [µm]
d or L W
d ≤ 150
150< d ≤ 300
-- W ≤ 10
Max.
Quantity
.
nc
5
nc
:
Spot
Pinhole
W
d = (L+W)/2
L
W
L
Segment
Deformation
Line
(Notched
segments
L
W
W
L
L
Pinhole
Line shape
W
L
Efffective visible dot/segment areas: Min 80%
W
L
L
W
Spot shape
Examples/ Shapes
b: Glass defects
b1:Glass defects at contact ledge
b2:Glass chipping in other areas shall not be in conflict with the
product's function.
Pinhole
(Total defects) (5)
Segment Deformation
Bubble (e.g. under pola)
Glass defect,
if Y > 1/3 L
L
L ≤ 5000 W ≤ 30
L ≤ 2000 W ≤ 50
d ≤ 150
150< d ≤ 300
W ≤ 100
d ≤ 150
200< d ≤ 400
400< d ≤ 600
3
2
nc
1/segm
ent
nc
nc
3
1
Y
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DEM 128064F1 FGH-PW Product Specification
18. MODULE ACCEPTS QUALITY LEVEL (AQL).
18.1. AQL standard value: Fatal defect =0.1, Major defect=0.65; Minor defect =2.5.
18.2. Curtailed inspection scheme
Type Batch Qty inspection Qty AQL value pass Reject
0.1 0 1
0.65 2 3
2.5 7 8
0.1 0 1
0.65 1 2
2.5 5 6
0.1 0 1
0.65 0 1
2.5 4 5
The sample will be reject
/ /
when the fateful defect>2pcs
or main defect>5pcs.
module
product
Module
sample
350PCS＜
1000PCS
200PCS＜
350PCS
＜200PCS 32pcs
＜200PCS
＞200PCS 125pcs
125pcs
80pcs
All
inspected
Notes: 1). Batch QTY is the production amount that production department ship to QA department.
2). All of productions will be inspected if the batch QTY less than inspected QTY.
3). Each batch fixed to be 500pcs.
19. RELIABILITY TEST
Operating life time: Longer than 50000 hours (at room temperature without direct irradiation of sunlight)
Reliability characteristics shall meet following requirements.
TEMPERATURE TESTS NORMAL GRADE
High Temperature Storage +80°C * 96HR
Low Temperature Storage -30°C * 96HR
High Temperature Operation +70°C * 96HR
Low Temperature Operation -20°C * 96HR
High Temperature, High humidity +60°C 90%RH 96HR
-20°C * 30 min
Thermal Shock
Vibration Test
Drop Test
10s 5Cycles
70°C * 30 min
Frequency * Swing * Time
40Hz * 4mm * 4hrs
Drop height * Times
1.0m * 6 times
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DEM 128064F1 FGH-PW Product Specification
20. LCD MODULES HANDLING PRECAUTIONS
n The display panel is made of glass. Do not subject it to a mechanical shock by dropping it from a high place, etc.
n If the display panel is damaged and the liquid crystal substance inside it leaks out, do not get any in your mouth. If the
substance come into contact with your skin or clothes promptly wash it off using soap and water.
n Do not apply excessive force to the display surface or the adjoining areas since this may cause the color tone to vary.
n The polarizer covering the display surface of the LCD module is soft and easily scratched. Handle this polarize
carefully.
n To prevent destruction of the elements by static electricity, be careful to maintain an optimum work environment.
-Be sure to ground the body when handling the LCD module.
-Tools required for assembly, such as soldering irons, must be properly grounded.
-To reduce the amount of static electricity generated, do not conduct assembly and other work under dry conditions.
-The LCD module is coated with a film to protect the display surface. Exercise care when peeling off this protective
film since static electricity may be generated.
n Storage precautions
When storing the LCD modules, avoid exposure to direct sunlight or to the light of fluorescent lamps. Keep the
modules in bags designed to prevent static electricity charging under low temperature / normal humidity conditions
(avoid high temperature / high humidity and low temperatures below -20℃). Whenever possible, the LCD modules
should be stored in the same conditions in which they were shipped from our company.
21. OTHERS
n Liquid crystals solidify at low temperature (below the storage temperature range) leading to defective orientation of
liquid crystal or the generation of air bubbles (black or white). Air bubbles may also be generated if the module is
subjected to a strong shock at a low temperature.
n If the LCD modules have been operating for a long time showing the same display patterns may remain on the screen
as ghost images and a slight contrast irregularity may also appear. Abnormal operating status can be resumed to be
normal condition by suspending use for some time. It should be noted that this phenomena does not adversely affect
performance reliability.
n To minimize the performance degradation of the LCD modules resulting from caused by static electricity, etc.
exercise care to avoid holding the following sections when handling the modules:
- Exposed area of the printed circuit board
- Terminal electrode sections
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