
2N7002
Document number: DS11303 Rev. 37 - 2
October 2019
© Diodes Incorporated
Description and Applications
This MOSFET has been designed to minimize the on-state resistance
(R
DS(ON)
) and yet maintain superior switching performance, making it
ideal for high efficiency power management applications.
Motor Control
Power Management Functions
Features and Benefits
Low On-Resistance
Low Gate Threshold Voltage
Low Input Capacitance
Fast Switching Speed
Small Surface Mount Package
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Notes 3)
The 2N7002Q is suitable for automotive applications
requiring specific change control; it is AEC-Q101 qualified,
PPAP capable, and manufactured in IATF 16949 certified
facilities.
https://www.diodes.com/quality/product-definitions/
Mechanical Data
Case: SOT23
Case Material: Molded Plastic, “Green” Molding Compound.
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminals: Finish Matte Tin Plated Leads. Solderable per MIL-
STD-202, Method 208
Terminal Connections: See Diagram
Weight: 0.009 grams (Approximate)
K72 = Product Type Marking Code
YM = Date Code Marking
Y or = Year (ex: G = 2019)
M = Month (ex: 9 = September)
N-CHANNEL ENHANCEMENT MODE FIELD EFFECT TRANSISTOR
Ordering Information (Note 4)
Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS), 2011/65/EU (RoHS 2) & 2015/863/EU (RoHS 3) compliant.
2. See https://www.diodes.com/quality/lead-free/ for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. For packaging details, go to our website at https://www.diodes.com/design/support/packaging/diodes-packaging/.
Lead-free.
Marking Information
Date Code Key

2N7002
Document number: DS11303 Rev. 37 - 2
October 2019
© Diodes Incorporated
Drain-Gate Voltage R
GS
1.0M
Gate-Source Voltage Continuous
Pulsed
Continuous Drain Current (Note 5) VGS = 10V
TA = +25°C
TA = +85°C
TA = +100°C
Continuous Drain Current (Note 6) VGS = 10V
TA = +25°C
TA = +85°C
TA = +100°C
Maximum Continuous Body Diode Forward Current (Note 6) Pulsed
Continuous
Pulsed Drain Current (10µs Pulse, Duty Cycle = 1%)
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Case
Operating and Storage Temperature Range
OFF CHARACTERISTICS (Note 7)
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current @ TC = +25°C
@ TC = +125°C
ON CHARACTERISTICS (Note 7)
Static Drain-Source On-Resistance @ T
J
= +25°C
@ T
J
= +25°C
@ TJ = +125°C
V
GS
= 10V, ID = 0.5A
V
GS
= 10V, ID = 0.5A
DYNAMIC CHARACTERISTICS (Note 8)
VDS = 25V, VGS = 0V
f = 1.0MHz
Reverse Transfer Capacitance
VDS = 0V, VGS = 0V,
f = 1.0MHz
Total Gate Charge (VGS = 4.5V)
VDS = 10V, ID = 250mA
Gate-Source Charge
SWITCHING CHARACTERISTICS (Note 8)
V
DD
= 30V, ID = 0.2A,
RL = 150, V
GEN
= 10V,
R
GEN
= 25
Maximum Ratings (@T
= +25°C, unless otherwise specified.)
A
Thermal Characteristics (@T
= +25°C, unless otherwise specified.)
A
Electrical Characteristics (@T
= +25°C, unless otherwise specified.)
A
Notes: 5. Device mounted on FR-4 PCB, with minimum recommended pad layout.
6. Device mounted on 1” x 1” FR-4 PCB with high coverage 2oz. Copper, single sided.
7. Short duration pulse test used to minimize self-heating effect.
8. Guaranteed by design. Not subject to product testing.

2N7002
Document number: DS11303 Rev. 37 - 2
October 2019
© Diodes Incorporated
0
0.2
0.4
0.6
0.8
1.0
0 1 2
3
4
5
V , DRAIN-SOURCE VOLTAGE (V)
Fig. 1 On-Region Characteristics
DS
I , DRAIN-SOURCE CURRENT (A)
D
0
1
2
3
4
5
0 0.2
I , DRAIN CURRENT (A)
Fig. 2 On-Resistance vs. Drain Current
D
6
7
0.4 0.6 0.8 1.0
R , NORMALIZED DRAIN-SOURCE
ON-RESISTANCE ( )
DS(ON)
1.0
1.5
2.0
2.5
3.0
-55 -30 -5 20 45 70 95 120 145
T, JUNCTION TEMPERATURE ( C)
Fig. 3 On-Resistance vs. Junction Temperature
j
°
V = 10V,
I = 200mA
GS
D
R , STATIC DRAIN-SOURCE
ON-RESISTANCE ( )
DS(ON)
0
V , GATE TO SOURCE VOLTAGE (V)
Fig. 4 On-Resistance vs. Gate-Source Voltage
GS
I = 50mA
D
I = 500mA
D
1
2
3
4
5
6
0 2 4 6 8 10 12 14 16 18
R , NORMALIZED DRAIN-SOURCE
ON-RESISTANCE ( )
DS(ON)
0
2
1
4
3
0 0.2
0.4
0.6 0.8
1
V GATE SOURCE CURRENT (V)
GS,
I , DRAIN CURRENT (A)
Fig. 5 Typical Transfer Characteristics
D
6
5
8
7
10
9
0
50
100
150
200
250
300
350
0 25
50 75
100
125 150 175
200
P , POWER DISSIPATION (mW)
d
T , AMBIENT TEMPERATURE ( C)
Fig. 6 Max Power Dissipation vs. Ambient Temperature
A
°
400

2N7002
Document number: DS11303 Rev. 37 - 2
October 2019
© Diodes Incorporated
J
K1
K
L1
GAUGE PLANE
0.25
H
L
M
All 7°
A
C
B
D
G
F
a
Package Outline Dimensions
Please see http://www.diodes.com/package-outlines.html for the latest version.
SOT23
Suggested Pad Layout
Please see http://www.diodes.com/package-outlines.html for the latest version.
SOT23

2N7002
Document number: DS11303 Rev. 37 - 2
October 2019
© Diodes Incorporated
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