Diodes ZXTP722MA User Manual

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Product Line o

Features and Benefits

• BV

• I

• Low Saturation Voltage (-220mV max @ -1A)

• R

• h

• Low profile 0.6mm high package for thin applications

• R

• 4mm

• Lead-Free, RoHS Compliant (Note 1)

• Halogen and Antimony Free. "Green" Device (Note 2)

• Qualified to AEC-Q101 Standards for High Reliability

> -70V

CEO

= -2.5A Continuous Collector Current

C

= 117 mΩ for a low equivalent On-Resistance

SAT

specified up to -3A for high current gain hold up

FE

efficient, 60% lower than SOT23

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2

footprint, 50% smaller than SOT23

DFN2020B-3

Top View

Bottom View

Mechanical Data

• Case: DFN2020B-3

• Case material: Molded Plastic. “Green” Molding Compound.

• Terminals: Pre-Plated NiPdAu leadframe.

• Nominal package height: 0.6mm

• UL Flammability Rating 94V-0

• Moisture Sensitivity: Level 1 per J-STD-020

• Weight: 0.01 grams (approximate)

Applications

• MOSFET Gate Driving

• DC-DC Converters

• Charging Circuits

• Power switches

• Motor control

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Device Symbol

Diodes Incorporated

ZXTP722MA

70V PNP LOW SATURATION TRANSISTOR

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Bottom View

Pin-Out

Ordering Information

Product Marking Reel size (inches) Tape width (mm) Quantity per reel

ZXTP722MATA S4 7 8 3000

Notes: 1. No purposefully added lead.

2. Diodes Inc's "Green" policy can be found on our website at http://www.diodes.com

Marking Information

To

S4

View

ZXTP722MA

Document Number DS31885 Rev. 5 - 2

S4 = Product Type Marking code

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ZXTP722MA

Maximum Ratings @T

= 25°C unless otherwise specified

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Characteristic Symbol Value Unit

Collector-Base Voltage
Collector-Emitter Voltage
Emitter-Base Voltage
Peak Pulse Current

Continuous Collector Current
Base Current

V

CBO

V

CEO

V

EBO

I
(Note 3)
(Note 4) -2.7

CM

I

I

C

B

-70

-70

-7

-3

-2.5

-1

V

A

Thermal Characteristics @T

= 25°C unless otherwise specified

A

Characteristic Symbol Value Unit

Power Dissipation
Linear Derating Factor

Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Lead (Note 5)

Operating and Storage Temperature Range

Notes: 3. For a device surface mounted on 31mm x 31mm (10cm2) FR4 PCB with high coverage of single sided 1oz copper, in still air conditions; the device is

measured when operating in a steady-state condition. The entire exposed collector pad is attached to the heatsink.

4. Same as note (3), except the device is measured at t ≤ 5 sec.

5. For a single device, thermal resistance from junction to solder-point (at the end of the drain lead).

(Note 3)

P

D

(Note 4)
(Note 3)

(Note 4) 51

R
R

T

J, TSTG

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JL

1.5
12

2.45

19.6
83

16.8

-55 to +150

W

mW/°C

°C/W

°C

ZXTP722MA

Document Number DS31885 Rev. 5 - 2

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Thermal Characteristics

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Diodes Incorporated

ZXTP722MA

V

CE(SAT)

Limited

1

DC

1s

0.1

Collector Current (A)

-I

Single Pulse, T

C

0.01

0.1 1 10 100

100ms

amb

10ms

=25°C

1ms

100us

-VCE Collector-Emitter Voltage (V)

Safe Operating Area

10 sqcm

80

Single
1oz Cu
T

=25°C

amb

60

D=0.5

40

D=0.2

20

Thermal Resistance (°C/W)

0

100µ 1m 10m 100m 1 10 100 1k

Single Pulse

D=0.05

D=0.1

Pulse Width (s)

Transient Thermal Impedance

2.0

10 sqcm

1.5

1.0

0.5

0.0
0 25 50 75 100 125 150

Max Powe r Di ssipation (W )

Temperature (°C)

Single
1oz Cu
T

=25°C

amb

Derating Curv e

225
200
175
150
125
100

75
50
25

Thermal Resistance (°C/W)

0

0.1 1 10 100

1oz copper

2oz copper

Board Cu Area (sqcm)

Thermal Resistance v Board Area

3.5

T

=25°C

amb

3.0

T

=150°C

j max

2.5

Continuous

2.0

1.5

1.0

Dissipatio n (W )

D

0.5

P

0.0

0.1 1 10 100

2oz copper

1oz copper

Board Cu Area (sqcm)

Power Dissipation v Board Area

ZXTP722MA

Document Number DS31885 Rev. 5 - 2

3 of 7

www.diodes.com

January 2011

© Diodes Incorporated