Diodes ZXTP5401FL User Manual

150V PNP SILICON PLANAR HIGH VOLTAGE TRANSISTOR IN SOT23
Features and Benefits
BV
Maximum Continuous Collector Current I
Excellent h
Low Saturation Voltages
Complementary part number ZXTN5551FL
Totally Lead-Free & Fully RoHS compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
Qualified to AEC-Q101 Standards for High Reliability
CEO
> -150V
Characteristics up to I
FE
Top View
SOT23
= -600mA
C
= -50mA
C
B
Device Symbol
A Product Line o
Diodes Incorporated
ZXTP5401FL
Mechanical Data
Case: SOT23
UL Flammability Rating 94V-0
Case material: molded Plastic.
Moisture Sensitivity: Level 1 per J-STD-020
Terminals: Matte Tin Finish; Solderable per MIL-STD-202,
Method 208
Weight: 0.008 grams (Approximate)
C
E
Top View
Pin-Out
Ordering Information (Note 4)
Product Marking Reel size (inches) Tape width (mm) Quantity per reel
ZXTP5401FLTA P01 7 8 3,000
Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
3. Halogen and Antimony free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
4. For packaging details, go to our website at http://www.diodes.com
2. See http://www.diodes.com for more information about Diodes Incorporated’s definitions of Halogen and Antimony free,"Green" and Lead-Free. <1000ppm antimony compounds.
Marking Information
ZXTP5401FL
Document Number: DS33724 Rev. 2 - 2
P01
www.diodes.com
P01 = Product Type Marking Code
1 of 6
June 2012
© Diodes Incorporated
A Product Line o
Diodes Incorporated
ZXTP5401FL
Maximum Ratings @T
Collector-Base Voltage Collector-Emitter Voltage Emitter-Base Voltage Continuous Collector Current Peak Pulse Current
Thermal Characteristics @T
Collector Power Dissipation
Thermal Resistance, Junction to Ambient Thermal Resistance, Junction to Leads (Note 7)
Operating and Storage Temperature Range
Notes: 5. For the device mounted on minimum recommended pad layout FR4 PCB with high coverage of single sided 1oz copper in still air condition ;
6. Same as Note 5, expect the device is mounted on 15mm X 15mm X 1.6mm FR4 PCB
7. Thermal resistance from junction to solder-point (at the end of the collector lead).
0.4
= 25°C unless otherwise specified
A
Characteristic Symbol Value Unit
V
CBO
V
CEO
V
EBO
I
C
I
CM
= 25°C unless otherwise specified
A
Characteristic Symbol Value Unit
(Note 5) (Note 6) 350 (Note 5) (Note 6) 357
P
R R
T
J,TSTG
θJA
θJL
D
-160 V
-150 V
-5 V
-600 mA
-1 A
310
403
350
-55 to +150
mW
°C/W °C/W
°C
400 350
0.3
300 250
0.2
0.1
0.0 0 255075100125150
Max Pow e r Dissipat ion (W)
Temperature (°C)
Derating Curve
Therma l R esistance (°C/W)
D=0.5
200 150
D=0.2
100
50
0
100µ 1m 10m 100m 1 10 100 1k
D=0.1
Single Pulse
D=0.05
Puls e Width (s)
Transient Thermal Impedance
10
Single Pulse. T
amb
=25°C
1
0.1
10m 100m 1 10 100 1k
Max Power Dissipat i on (W)
Puls e Width (s)
Pulse Power Dissipation
ZXTP5401FL
Document Number: DS33724 Rev. 2 - 2
2 of 6
www.diodes.com
June 2012
© Diodes Incorporated
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