Diodes ZXTP25060BFH User Manual

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Diodes Incorporated

ZXTP25060BFH

60V PNP MEDIUM POWER TRANSISTOR IN SOT23

Features and Benefits

Mechanical Data

• BV

• 100V forward blocking voltage

• I

• Low saturation voltage, V

• R

• 1.25W power dissipation using SuperSOT package

• Complementary part number ZXTN25060BFH

• Lead Free, RoHS Compliant (Note 1)

• Halogen and Antimony Free, Green Device (Note 2)

• Qualified to AEC-Q101 Standards for High Reliability

> -60V Breakdown Voltage

CEO

= -3A Continuous Collector Current,

C

= -9A Peak Pulse Current,

CM

< -85mV @ -1A

CE(sat)

= 58 mΩ for a low equivalent on-resistance

CE(sat)

SOT23

Top View

Applications

C

E

Device Symbol

• Case: SOT23

• Case material: molded Plastic. “Green” molding Compound.

• UL Flammability Rating 94V-0

• Moisture Sensitivity: Level 1 per J-STD-020

• Terminals: Matte Tin Finish

• Weight: 0.008 grams (Approximate)

• MOSFET drivers

• Power switches

• Motor control

C

B

E

Top View

Pin-Out

Ordering Information (Note 3)

Product Case Reel size (inches) Tape width (mm) Quantity per reel

ZXTP25060BFHTA SOT23 7 8mm 3000

Notes: 1. No purposefully added lead.

2. Diodes Inc.’s “Green” Policy can be found on our website at http://www.diodes.com

3. For packaging details, go to our website at http://www.diodes.com/

Marking Information

ZXTP25060BFH

Document number: DS33374 Rev. 4 - 2

028

www.diodes.com

028 = Product Type Marking Code

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ZXTP25060BFH

Maximum Ratings @T

= 25°C unless otherwise specified

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Characteristic Symbol Value Unit

V

Collector-Base Voltage Collector-Emitter Voltage (forward blocking) Collector-Emitter Voltage Emitter-Collector Voltage (reverse blocking) Emitter-Base Voltage Continuous Collector Current Peak pulse Current

CBO

V

CEX

V

CEO

V

ECO

V

EBO

I

C

I

CM

-100 V

-60 V

-7 V

-3 A

-9 A

Thermal Characteristics @T

= 25°C unless otherwise specified

A

Characteristic Symbol Value Unit

0.73

5.84

1.05

8.4

1.25

9.6

1.81

14.5 171

W

°C/W

Power Dissipation Linear derating factor

Thermal Resistance, Junction to Ambient

(Note 4)

(Note 5)

P

D

(Note 6)

(Note 7)

(Note 4) (Note 5) 119 (Note 6) 100

R

JA

θ

(Note 7) 69

R

T

J, TSTG

JL

θ

74.95 °C/W

-55 to +150 °C

Thermal Resistance, Junction to Lead (Note 8) Operating and Storage Temperature Range

Notes: 4. For a device surface mounted on 15mm x 15mm x 1.6mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions; the device is measured when operating in a steady-state condition.

5. Same as note (4), except the device is surface mounted on 25mm x 25mm with 2 oz copper.

6. Same as note (4), except the device is surface mounted on 50mm x 50mm with 2 oz copper.

7. Same as note (6), except the device is measured at t<5secs.

8. Thermal resistance from junction to solder-point (at the end of the collector lead).

ZXTP25060BFH

Document number: DS33374 Rev. 4 - 2

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Thermal Characteristics

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ZXTP25060BFH

1oz

ZXTP25060BFH

Document number: DS33374 Rev. 4 - 2

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