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Diodes Incorporated
ZXTP25060BFH
60V PNP MEDIUM POWER TRANSISTOR IN SOT23
Features and Benefits
Mechanical Data
• BV
• 100V forward blocking voltage
• I
• I
• Low saturation voltage, V
• R
• 1.25W power dissipation using SuperSOT package
• Complementary part number ZXTN25060BFH
• Lead Free, RoHS Compliant (Note 1)
• Halogen and Antimony Free, Green Device (Note 2)
• Qualified to AEC-Q101 Standards for High Reliability
> -60V Breakdown Voltage
CEO
= -3A Continuous Collector Current,
C
= -9A Peak Pulse Current,
CM
< -85mV @ -1A
CE(sat)
= 58 mΩ for a low equivalent on-resistance
CE(sat)
SOT23
Top View
Applications
C
E
Device Symbol
• Case: SOT23
• Case material: molded Plastic. “Green” molding Compound.
• UL Flammability Rating 94V-0
• Moisture Sensitivity: Level 1 per J-STD-020
• Terminals: Matte Tin Finish
• Weight: 0.008 grams (Approximate)
• MOSFET drivers
• Power switches
• Motor control
C
B
E
Top View
Pin-Out
Ordering Information (Note 3)
Product Case Reel size (inches) Tape width (mm) Quantity per reel
ZXTP25060BFHTA SOT23 7 8mm 3000
Notes: 1. No purposefully added lead.
2. Diodes Inc.’s “Green” Policy can be found on our website at http://www.diodes.com
3. For packaging details, go to our website at http://www.diodes.com/
Marking Information
ZXTP25060BFH
Document number: DS33374 Rev. 4 - 2
028
www.diodes.com
028 = Product Type Marking Code
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ZXTP25060BFH
Maximum Ratings @T
= 25°C unless otherwise specified
A
Characteristic Symbol Value Unit
V
Collector-Base Voltage
Collector-Emitter Voltage (forward blocking)
Collector-Emitter Voltage
Emitter-Collector Voltage (reverse blocking)
Emitter-Base Voltage
Continuous Collector Current
Peak pulse Current
CBO
V
CEX
V
CEO
V
ECO
V
EBO
I
C
I
CM
-100 V
-100 V
-60 V
-7 V
-7 V
-3 A
-9 A
Thermal Characteristics @T
= 25°C unless otherwise specified
A
Characteristic Symbol Value Unit
0.73
5.84
1.05
8.4
1.25
9.6
1.81
14.5
171
W
°C/W
Power Dissipation
Linear derating factor
Thermal Resistance, Junction to Ambient
(Note 4)
(Note 5)
P
D
(Note 6)
(Note 7)
(Note 4)
(Note 5) 119
(Note 6) 100
R
JA
θ
(Note 7) 69
R
T
J, TSTG
JL
θ
74.95 °C/W
-55 to +150 °C
Thermal Resistance, Junction to Lead (Note 8)
Operating and Storage Temperature Range
Notes: 4. For a device surface mounted on 15mm x 15mm x 1.6mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions; the device is
measured when operating in a steady-state condition.
5. Same as note (4), except the device is surface mounted on 25mm x 25mm with 2 oz copper.
6. Same as note (4), except the device is surface mounted on 50mm x 50mm with 2 oz copper.
7. Same as note (6), except the device is measured at t<5secs.
8. Thermal resistance from junction to solder-point (at the end of the collector lead).
ZXTP25060BFH
Document number: DS33374 Rev. 4 - 2
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Thermal Characteristics
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ZXTP25060BFH
1oz
ZXTP25060BFH
Document number: DS33374 Rev. 4 - 2
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ZXTP25060BFH
Electrical Characteristics @T
= 25°C unless otherwise specified
A
Characteristic Symbol Min Typ Max Unit Test Condition
BV
BV
BV
BV
BV
I
CBO
I
CEX
I
EBO
CBO
CEX
CEO
ECO
EBO
-100 -120 - V
-100 -120 - V
-60 -80 - V
Collector-Base Breakdown Voltage
Collector-Emitter Breakdown Voltage (forward blocking)
Collector-Emitter Breakdown Voltage (base open) (Note 9)
Emitter- Collector Breakdown Voltage
(Reverse blocking) (Note 9)
Emitter-Base Breakdown Voltage
Collector Cutoff Current
Collector emitter Cutoff Current
Emitter Cutoff Current
100
h
V
BE(sat)
V
BE(on)
V
CE(sat)
C
t
t
FE
f
T
OBO
(on)
(off)
Static Forward Current Transfer Ratio (Note 9)
Base-Emitter Saturation Voltage (Note 9)
Base-Emitter turn-on Voltage (Note 9)
Collector-Emitter Saturation Voltage (Note 9)
Transition Frequency
Collector Output Capacitance (Note 9)
Turn-on time
Turn-off time
Notes: 9. Measured under pulsed conditions. Pulse width ≤ 300 µs. Duty cycle ≤ 2%
-7 -8.6 - V
-7 -8.1 - V
< -1 - -50
-
-20
-
- - -100 nA
- < -1 -50 nA
75
30
200
150
60
300
-
-
- -940 -1040 mV
- -830 -930 mV
-45
-
-100
-
-70
-
-175
-
-55
-135
-85
-235
- 250 - MHz
- 17.6 30 pF
- 26.5 - ns
- 291 - ns
IC = -100 µA
= -100 µA,
I
C
R
< 1kΩ or -0.25V < VBE < 1V
BE
IC = -10mA
IE = -100µA
IE = -100µA
V
nA
µA
-
= -80V
CB
V
= -80V, TA = 100°C
CB
= -80V,
V
CE
< 1kΩ or -0.25V < VBE < 1V
R
BE
V
= -6V
EB
= -10mA, VCE = -2V
I
C
= -1A, VCE = -2V
I
C
= -3A, VCE = -2V
I
C
IC = -3A, IB = -300mA
IC = -3A, VCE = -2V
= -0.5A, IB = -50mA
I
C
= -0.5A, IB = -10mA
I
C
mV
= -1A, IB = -100mA
I
C
I
= -3A, IB = -300mA
C
= -100mA, VCE = -5V,
I
C
f = 100MHz
VCB = -10V, f = 1MHz
= -10V, IC = -500mA,
V
CC
I
= I
B1
= -50mA
B2
ZXTP25060BFH
Document number: DS33374 Rev. 4 - 2
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Typical Characteristics
Product Line o
Diodes Incorporated
ZXTP25060BFH
1
Tamb=25°C
IC/IB=100
100m
(V)
CE(SAT)
- V
10m
1m 10m 100m 1 10
IC/IB=10
- IC Collector Current ( A)
V
1.6
1.4
1.2
1.0
0.8
0.6
0.4
Normalised Gain
0.2
0.0
1m 10m 100m 1 10
150°C
100°C
25°C
-55°C
CE(SAT)
v I
C
VCE=2V
- IC Collector C urren t ( A)
hFE v I
C
IC/IB=50
IC/IB=20
360
320
280
240
200
160
120
80
40
0
0.4
IC/IB=10
0.3
(V)
0.2
CE(SAT)
0.1
- V
0.0
10m 100m 1
150°C
100°C
25°C
-55°C
- IC Collector Current (A)
V
IC/IB=10
1.0
)
FE
0.8
-55°C
CE(SAT)
25°C
v I
C
(V)
0.6
BE(SAT)
- V
Typical Gain (h
0.4
1m 10m 100m 1
100°C
150°C
- IC Collector Current (A)
V
BE(SAT)
v I
C
1.2
VCE=2V
1.0
-55°C
0.8
(V)
BE(ON)
0.6
- V
0.4
1m 10m 100m 1 10
25°C
150°C
100°C
- IC Collector Current (A)
V
ZXTP25060BFH
Document number: DS33374 Rev. 4 - 2
BE(ON)
v I
C
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ZXTP25060BFH
Package Outline Dimensions
K
J
A
Dim Min Max Typ
A 0.37 0.51 0.40
C
B
H
K1
F
D
G
L
M
B 1.20 1.40 1.30
C 2.30 2.50 2.40
D 0.89 1.03 0.915
F 0.45 0.60 0.535
G 1.78 2.05 1.83
H 2.80 3.00 2.90
J 0.013 0.10 0.05
K 0.903 1.10 1.00
K1 - - 0.400
L 0.45 0.61 0.55
M 0.085 0.18 0.11
α
SOT23
0° 8° -
All Dimensions in mm
Suggested Pad Layout
ZXTP25060BFH
Document number: DS33374 Rev. 4 - 2
Y
Z
C
X
E
www.diodes.com
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Dimensions Value (in mm)
Z 2.9
X 0.8
Y 0.9
C
E
2.0
1.35
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IMPORTANT NOTICE
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document o r products described herein in such applica tions shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorize d application, Customers shall indemnify and
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings
noted herein may also be covered by one or more United States, international or foreign trademarks.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2012, Diodes Incorporated
www.diodes.com
Diodes Incorporated
ZXTP25060BFH
ZXTP25060BFH
Document number: DS33374 Rev. 4 - 2
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