Diodes ZXTP25040DZ User Manual
ZXTP25040DZ
C
E
B
40V PNP medium power transistor in SOT89
Summary
BV
BV
I
R
V
P
Complementary part number ZXTN25040DZ
CEO
ECO
C(cont)
CE(sat)
CE(sat)
= 2.4W
D
> -40V
> -3V
= -3.5A
= 55m⍀
< -90mV @ 1A
Description
Advanced process capability and package design have been used to
maximize the power handling and performance of this small outline
transistor. The compact size and ratings of this device make it ideally
suited to applications where space is at a premium.
Features
• High power dissipation SOT89 package
• High peak current
• Low saturation voltage
• 3V reverse blocking voltage
Applications
• MOSFET and IGBT gate driving
•DC - DC converters
• Motor drive
• High side driver
Ordering information
Device Reel size
(inches)
ZXTP25040DZTA 7 12 1000
Tape width
(mm)
Quantity
per reel
C
Pinout - top view
Device marking
•1L6
Issue 1 - December 2007 1 www.zetex.com
© Zetex Semiconductors plc 2007
E
C
B
ZXTP25040DZ
Absolute maximum ratings
Parameter Symbol Limit Unit
Collector-Base voltage V
Collector-Emitter voltage (forward blocking) V
Emitter-Collector voltage (reverse blocking) V
Emitter-Base voltage V
Continuous Collector current
(c)
Base current I
Peak pulse current I
Power dissipation at T
=25°C
A
(a)
Linear derating factor
Power dissipation at T
=25°C
A
(b)
Linear derating factor
Power dissipation at T
=25°C
A
(c)
Linear derating factor
Power dissipation at T
=25°C
A
(d)
Linear derating factor
Power dissipation at T
=25°C
C
(e)
Linear derating factor
Operating and storage temperature range T
CBO
CEO
ECO
EBO
CM
P
P
P
P
P
, T
j
I
C
B
D
D
D
D
D
stg
-45 V
-40 V
-3 V
-7 V
-3 A
-1 A
-9 A
1.1
8.8
1.8
14.4
2.4
19.2
4.46
35.7
15.7
126
-55 to 150
W
mW/°C
W
mW/°C
W
mW/°C
W
mW/°C
W
mW/°C
°C
Thermal resistance
Parameter Symbol Limit Unit
Junction to ambient
Junction to ambient
Junction to ambient
Junction to ambient
Junction to case
NOTES:
(a) For a device surface mounted on 15mm x 15mm x 0.6mm FR4 PCB with high coverage of single sided 1oz copper, in
still air conditions.
(b) Mounted on 25mm x 25mm x 0.6mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions.
(c) Mounted on 50mm x 50mm x 0.6mm FR4 PCB with high coverage of single sided 2oz copper, in still air conditions.
(d) As (c) above measured at t<5 seconds.
(e) Junction to case (collector tab). Typical
(a)
(b)
(c)
(d)
(e)
R
R
R
R
R
⍜JA
⍜JA
⍜JA
⍜JA
⍜JC
117 °C/W
68 °C/W
51 °C/W
28 °C/W
7.95 °C/W
Issue 1 - December 2007 2 www.zetex.com
© Zetex Semiconductors plc 2007
Thermal characteristics
ZXTP25040DZ
Issue 1 - December 2007 3 www.zetex.com
© Zetex Semiconductors plc 2007
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