Diodes ZXTP25020DFH User Manual

ZXTP25020DFH
20V, SOT23, PNP medium power transistor

Summary

BV

BV

I

V

R

P

Complementary part number ZXTN25020DFH

CEO

ECO

C(cont)

CE(sat)

CE(sat)

= 1.25W

D

> -20V

> -4V

= 4A

< 60 mV @ 1A

= 39 m⍀

Description

Advanced process capability and package design have been used to
maximize the power handling and performance of this small outline
transistor. The compact size and ratings of this device make it ideally
suited to applications where space is at a premium.

Features

• High power dissipation SOT23 package

• High peak current

•High gain

• Low saturation voltage

Applications

• MOSFET gate drivers

C

B

E

E

C

• Power switches

• Motor control

Pinout - top view

B

Ordering information

Device Reel size

(inches)

ZXTP25020DFHTA 7 8 3000

Tape width

(mm)

Quantity per reel

Device marking

1A3

Issue 1 - July 2006 1 www.zetex.com

© Zetex Semiconductors plc 2006

ZXTP25020DFH

Absolute maximum ratings

Parameter Symbol Limit Unit

Collector-base voltage V

Collector-emitter voltage (forward blocking) V

Emitter-collector voltage (reverse blocking) V

Emitter-base voltage V

Continuous collector current

(c)

Base current I

Peak pulse current I

Power dissipation at T

amb

=25°C

(a)

CBO

CEO

ECO

EBO

I

C

B

CM

P

D

-25 V

-20 V

-4 V

-7 V

-4 A

-1 A

-10 A

0.73 W

Linear derating factor 5.84 mW/°C

Power dissipation at T

amb

=25°C

(b)

P

D

1.05 W

Linear derating factor 8.4 mW/°C

Power dissipation at T

amb

=25°C

(c)

P

D

1.25 W

Linear derating factor 9.6 mW/°C

Power dissipation at T

amb

=25°C

(d)

P

D

1.81 W

Linear derating factor 14.5 mW/°C

Operating and storage temperature range T

j

, T

stg

-55 to 150 °C

Thermal resistance

Parameter Symbol Limit Unit

Junction to ambient

Junction to ambient

Junction to ambient

Junction to ambient

NOTES:

(a) For a device surface mounted on 15mm x 15mm x 0.6mm FR4 PCB with high coverage of single sided 1oz copper, in

still air conditions.

(b) For a device surface mounted on 25mm x 25mm x 0.6mm FR4 PCB with high coverage of single sided 1oz copper, in

still air conditions.

(c) For a device surface mounted on 50mm x 50mm x 0.6mm FR4 PCB with high coverage of single sided 2oz copper, in

still air conditions.

(d) As (c) above measured at t<5 seconds.

(a)

(b)

(c)

(d)

R

R

R

R

⍜JA

⍜JA

⍜JA

⍜JA

171 °C/W

119 °C/W

100 °C/W

69 °C/W

Issue 1 - July 2006 2 www.zetex.com

© Zetex Semiconductors plc 2006