Diodes ZXTP25015DFH User Manual

ZXTP25015DFH

C

E

B

15V, SOT23, PNP medium power transistor

Summary

BV

BV

I

R

V

P

Complementary part number ZXTN25015DFH

CEO

ECO

C(cont)

CE(sat)

CE(sat)

= 1.25W

D

> -15V

> -3V

= -4A

= 33m⍀

< -55mV @ 1A

Description

Advanced process capability and package design have been used to
maximize the power handling and performance of this small outline
transistor. The compact size and ratings of this device make it ideally
suited to applications where space is at a premium.

Features

• High power dissipation SOT23 package

• High peak current

• Low saturation voltage

• 15V forward blocking voltage

• 3V reverse blocking voltage

Applications

• MOSFET and IGBT gate driving

•DC - DC converters

• Motor drive

• High side driver

• Load disconnect switch

C

Pinout - top view

Ordering information

Device Reel size

(inches)

ZXTP25015DFHTA 7 8 3,000

Tape width

(mm)

Quantity per reel

Device marking

1A7

Issue 2 - March 2008 1 www.zetex.com

© Zetex Semiconductors plc 2008

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ZXTP25015DFH

Absolute maximum ratings

Parameter Symbol Limit Unit

Collector-base voltage V

Collector-emitter voltage V

Emitter-collector voltage (reverse blocking) V

Emitter-base voltage V

Continuous collector current

(b)

Base current I

Peak pulse current I

Power dissipation at T

amb

=25°C

(a)

CBO

CEO

ECO

EBO

I

C

B

CM

P

D

-15 V

-15 V

-3 V

-7 V

-4 A

-1 A

-10 A

0.73 W

Linear derating factor 5.84 mW/°C

Power dissipation at T

amb

=25°C

(b)

P

D

1.05 W

Linear derating factor 8.4 mW/°C

Power dissipation at T

amb

=25°C

(c)

P

D

1.25 W

Linear derating factor 9.6 mW/°C

Power dissipation at T

amb

=25°C

(d)

P

D

1.81 W

Linear derating factor 14.5 mW/°C

Operating and storage temperature range T

j

, T

stg

-55 to 150 °C

Thermal resistance

Parameter Symbol Limit Unit

Junction to ambient

Junction to ambient

Junction to ambient

Junction to ambient

NOTES:

(a) For a device surface mounted on 15mm x 15mm x 1.6mm FR4 PCB with high coverage of single sided 1oz copper, in

still air conditions.
(b) Mounted on 25mm x 25mm x 1.6mm FR4 PCB with a high coverage of single sided 2 oz copper in still air conditions.
(c) Mounted on 50mm x 50mm x 1.6mm FR4 PCB with a high coverage of single sided 2 oz copper in still air conditions.
(d) As (c) above measured at t<5secs.

(a)

(b)

(c)

(d)

Issue 2 - March 2008 2 www.zetex.com

© Zetex Semiconductors plc 2008

R

R

R

R

⍜JA

⍜JA

⍜JA

⍜JA

171 °C/W

119 °C/W

100 °C/W

69 °C/W