Diodes ZXTP2041F User Manual

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40V PNP MEDIUM POWER TRANSISTOR IN SOT23

Features

Mechanical Data

Diodes Incorporated

ZXTP2041F

 BV

 I

 Low Saturation Voltage V

 R

 Complementary NPN type: ZXTN2040F

 Totally Lead-Free & Fully RoHS compliant (Notes 1 & 2)

 Halogen and Antimony Free. “Green” Device (Note 3)

 Qualified to AEC-Q101 Standards for High Reliability

> -40V

CEO

= -1A High Continuous Current

C

= -2A Peak Pulse Current

CM

< -500mV @ -1A

CE(sat)

= 350mΩ for a Low Equivalent On-resistance

SAT

SOT23

Top View

 Case: SOT23

 Case Material: Molded Plastic, “Green” Molding Compound

UL Flammability Classification Rating 94V-0

 Moisture Sensitivity: Level 1 per J-STD-020

 Terminals: Finish – Matte Tin Plated Leads, Solderable per

MIL-STD-202, Method 208

 Weight: 0.008 grams (approximate)

Application

 Power MOSFET gate driving

 Low loss power switching

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Device symbol Top View

C

Pin-Out

Ordering Information (Note 4)

Product Marking Reel size (inches) Tape width (mm) Quantity per reel

ZXTP2041FTA P41 7 8 3,000

Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.

2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free.

3. Halogen and Antimony free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds.

4. For packaging details, go to our website at http://www.diodes.com/products/packages.html

Marking Information

P41

P41 = Product Type Marking Code

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ZXTP2041F

Absolute Maximum Ratings (@T

= +25°C, unless otherwise specified.)

A

Characteristic Symbol Value Unit

Collector-Base Voltage Collector-Emitter Voltage Emitter-Base Voltage Continuous Collector Current Peak Pulse Current Base Current Peak Base Current

Thermal Characteristics (@T

= +25°C, unless otherwise specified.)

A

Characteristic Symbol Value Unit

Power Dissipation

Thermal Resistance, Junction to Ambient

(Note 5) (Note 6) 350 (Note 5)

(Note 6) 357 Thermal Resistance, Junction to Leads (Note 7) Operating and Storage Temperature Range

ESD Ratings (Note 8)

V V V

I

R

T

J,TSTG

CBO

CEO

EBO

I

C

CM

I

B

BM

P

D

θJA

θJL

-40 V

-7 V

-1 A

-2 A

-200 mA

-1 A

310

403

350

-55 to +150

mW

C/W

C

Electrostatic Discharge - Human Body Model ESD HBM 4,000 V 3A

Characteristic Symbol Value Unit JEDEC Class

Electrostatic Discharge - Machine Model ESD MM 400 V C

Notes: 5. For a device mounted on minimum recommended pad layout 1oz copper that is on a single-sided FR4 PCB; device is measured under still air

conditions whilst operating in a steady-state.

6. Same as note (5), except the device is mounted on 15 mm x 15mm 1oz copper.

7. Thermal resistance from junction to solder-point (at the end of the leads).

8. Refer to JEDEC specification JESD22-A114 and JESD22-A115.

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Thermal Characteristics and Derating Information

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ZXTP2041F

0.4

0.3

0.2

0.1

0.0 0 25 50 75 100 125 150

Max Power Dissipation (W)

Temperature (°C)

Derating Curve

10

Single Pulse. T

1

amb

=25°C

400

350

300

250

D=0.5

200

150

D=0.2

100

50

0

100µ 1m 10m 100m 1 10 100 1k

Thermal Resistance (°C/W)

D=0.1

Single Pulse

D=0.05

Pulse Width (s)

Transient Thermal Impedance

0.1

10m 100m 1 10 100 1k

Max Power Dissipation (W)

Pulse Width (s)

Pulse Power Dissipation

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(d)

(r

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(s)

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Electrical Characteristics (@T

= +25°C, unless otherwise specified.)

A

Characteristic Symbol Min Typ. Max Unit Test Condition

Collector-Base Breakdown Voltage Collector-Emitter Breakdown Voltage (Note 9) Emitter-Base Breakdown Voltage Collector Cutoff Current Emitter Cutoff Current Emitter Cutoff Current

BV BV BV

I

CBO

I

EBO

I

CES

CBO

CEO

EBO

-40 - - V

-7 - - V

- - -100 nA

- - -100 nA 300 - 300 - 800

DC current transfer Static ratio (Note 9)

h

FE

250 - 160 - -

30 - -

- - -200

Collector-Emitter Saturation Voltage (Note 9)

V

CE(sat)

- - -350

- - -500

Base-Emitter Saturation Voltage (Note 9) Base-Emitter Turn-on Voltage (Note 9)

Transitional Frequency

Output capacitance

Delay Time

Switching Time

Rise Time Storage Time Fall Time

Notes: 9. Measured under pulsed conditions. Pulse width ≤ 300μs. Duty cycle ≤2%.

V

BE(sat

BE(on

f

T

C

obo

t

t t t

- - -1.1 V

- - -1.0 V

150 300 - MHz

- - 10 pF

- 34.9 -

- 19.2 -

- 249 -

- 62 -

-

mV

ns

IC = -100µA IC = -10mA IE = -100µA V

= -30V

CB

V

= -5.6V

EB

V

= -30V

CE

I

= -1mA, V

C

I

= -100mA, V

C

I

= -500mA, V

C

I

= -1A, V

C

I

= -2A, V

C

= -100mA, IB = -1mA

I

C

I

= -500mA, IB = -20mA

C

I

= -1A, IB = -100mA

C

CE

= -5V

CE

= -5V = -5V

IC = -1A, IB= -100mA IC = -1A, V

= -50mA, V

I

C

CE

= -5V

= -10V,

CE

f = 100MHz V

= -10V, f = 1MHz,

CB

= -10V, I

V

CC

= -IB2 =-25mA

I

B1

= -500mA,

C

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Typical Electrical Characteristics (@T

= +25°C, unless otherwise specified.)

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Package Outline Dimensions

Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version.

All 7

H

°

K

1

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C

B

D

J

M

L

a

L

1

Suggested Pad Layout

Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.

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Z

X

E

Dimensions Value (in mm)

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Dim Min Max Typ

A 0.37 0.51 0.40 B 1.20 1.40 1.30 C 2.30 2.50 2.40 D 0.89 1.03 0.915 F 0.45 0.60 0.535

G 1.78 2.05 1.83

H 2.80 3.00 2.90 J 0.013 0.10 0.05 K 0.890 1.00 0.975

K1 0.903 1.10 1.025

L 0.45 0.61 0.55

L1 0.25 0.55 0.40

M 0.085 0.150 0.110

a

Z 2.9 X 0.8 Y 0.9 C 2.0 E 1.35

SOT23

8°

All Dimensions in mm

ZXTP2041F

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IMPORTANT NOTICE

DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).

Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated website, harmless against all damages.

Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel. Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.

Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings noted herein may also be covered by one or more United States, international or foreign trademarks.

This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the final and determinative format released by Diodes Incorporated.

LIFE SUPPORT

Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:

A. Life support devices or systems are devices or systems which:

1. are intended to implant into the body, or

2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the

labeling can be reasonably expected to result in significant injury to the user.

B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness.

Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.

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Diodes Incorporated

ZXTP2041F

ZXTP2041F Da

tasheet Number: DS33721 Rev. 7 - 2

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December 2013