Diodes ZXTP2027F User Manual

ZXTP2027F

C

E

B

60V, SOT23, PNP medium power transistor

Summary

V

(BR)CEV

I

C(cont)

R

CE(sat)

V

CE(sat)

P

D

Complementary part number ZXTN2018F

> -100V, V

= -4A

= 31 m⍀ typical

< -60 mV @ -1A

= 1.2W

(BR)CEO

> -60V

Description

Advanced process capability and package design have been used to
maximize the power handling and performance of this small outline
transistor. The compact size and ratings of this device make it ideally suited
to applications where space is at a premium.

Features

• Higher power dissipation SOT23 package

• High peak current

• Low saturation voltage

• 100V forward blocking voltage

Applications

E

• MOSFET and IGBT gate driving

• Motor drive

• Relay, lamp and solenoid drive

• High side switches

C

Pinout - top view

Ordering information

Device Reel size

(inches)

ZXTP2027FTA 7 8mm 3,000

Tape width Quantity per reel

Device marking

951

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B

ZXTP2027F

NOTES:

Absolute maximum ratings

Parameter Symbol Limit Unit

Collector-base voltage V

Collector-emitter voltage V

Collector-emitter voltage V

Emitter-base voltage V

Peak pulse current I

Continuous collector current

(b)

Base current I

Power dissipation @ T

A

=25oC

(a)

Linear derating factor

Power dissipation @ T

A

=25oC

(b)

Linear derating factor

Power dissipation @ T

A

=25oC

(c)

Linear derating factor

Operating and storage temperature T

CBO

(BR)CEV

CEO

EBO

CM

I

C

B

P

D

P

D

P

D

j:Tstg

-100 V

-100 V

-60 V

-7 V

-10 A

-4 A

-1 A

1.0

8.0

1.2

9.6

1.56

12.5

-55 to +150

mW/

mW/

mW/

W

W

W

o

o

C

o

C

o

C

C

Thermal resistance

Parameter Symbol Value Unit

Junction to ambient

Junction to ambient

Junction to ambient

(a) Mounted on 18mm x 18mm x 1.6mm FR4 PCB with a very high coverage of 2 oz weight copper in still air conditions.
(b) Mounted on 30mm x 30mm x 1.6mm FR4 PCB with a very high coverage of 2 oz weight copper in still air conditions.
(c) As (b) above measured at t<5secs.

(a)

(b)

(c)

Rθ
Rθ
Rθ

JA
JA
JA

125

104

80

o

C/W

o

C/W

o

C/W

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Characteristics

ZXTP2027F

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ZXTP2027F

NOTES:

Electrical characteristics (at T

= 25°C unless otherwise stated)

amb

Parameter Symbol Min. Typ. Max. Unit Conditions

Collector-base breakdown

V

(BR)CBO

-100 -120 V IC=-100μA

voltage

Collector-emitter breakdown

V

(BR)CEV

-100 -120 V

IC =−1μA, 1V> VBE>-0.3V

voltage

Collector-emitter breakdown
voltage

Emitter-base breakdown

V

(BR)CEO

V

(BR)EBO

-60 -75 V

=-10mA

I

C

-7.0 -8.2 V IE=-100μA

voltage

Collector-emitter cut-off
current

Collector-base cut-off current I

Emitter-base cut-off current I

Static forward current transfer
ratio

Collector-emitter saturation
voltage

Base-Emitter saturation
voltage

Base-Emitter turn-on voltage V

Transition frequency f

I

CEV

CBO

EBO

H

FE

V

CE(SAT)

V

BE(SAT)

BE(on)

T

100

100

80

20

-20 nA VCE=-80V,
= 1V

V

BE

-20 nA VCB=-80V

-10 nA VEB=-6V

250

200

300

145

40

-15

-45

-70

-155

-25

-60

-95

-240

-0.89 -1.0 V

-0.81 -0.95 V

I

=-10mA, VCE=-2V

C

IC=-2A, VCE=-2V

Ic=-4A, VCE=-2V

Ic=-10A, VCE=-2V

mV

IC=-100mA, IB=-10mA

mV

IC=-1A, IB=-100mA

mV

IC=-2A, IB=-200mA

mV

IC=-4A, IB=-200mA

=-4A, IB=-200mA

I

C

=-4A, VCE=-2V

I

C

165 MHz Ic=-100mA, VCE=-10V,

f=50MHz

Output capacitance C

Delay timetime t

Rise time t

Storage time t

Fall time t

obo

(d)

(r)

(stg)

(f)

44 pF VCB=-10V, f=1MHz

12.6 ns VCC=-10V, IC=-2A,

10.2 ns

I

B1=IB2

=-200mA

220 ns

21 ns

(a)

(a)

(a)

(a)

(a)

(a)

(a)

(a)

(a)

(a)

(a)

(a) Measured under pulsed conditions. Pulse width=300␮S. Duty cycle ⱕ2%.

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Typical characteristics

ZXTP2027F

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© Zetex Semiconductors plc 2007

ZXTP2027F

Intentionally left blank

Issue 3 - May 2007 6 www.zetex.com

© Zetex Semiconductors plc 2007

Package outline - SOT23

E

e

L

e1

D

A

c

E1

L1

A1

b

3 leads

ZXTP2027F

Dim. Millimeters Inches Dim. Millimeters Inches

Min. Max. Min. Max. Min. Max. Min. Max.

A - 1.12 - 0.044 e1 1.90 NOM 0.075 NOM

A1 0.01 0.10 0.0004 0.004 E 2.10 2.64 0.083 0.104

b 0.30 0.50 0.012 0.020 E1 1.20 1.40 0.047 0.055

c 0.085 0.20 0.003 0.008 L 0.25 0.60 0.0098 0.0236

D 2.80 3.04 0.110 0.120 L1 0.45 0.62 0.018 0.024

e0.95 NOM0.037 NOM-----

Note: Controlling dimensions are in millimeters. Approximate dimensions are provided in inches

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ZXTP2027F

Definitions
Product change

Zetex Semiconductors reserves the right to alter, without notice, specifications, design, price or conditions of supply of any product or
service. Customers are solely responsible for obtaining the latest relevant information before placing orders.

Applications disclaimer

The circuits in this design/application note are offered as design ideas. It is the responsibility of the user to ensure that the circuit is fit for
the user’s application and meets with the user’s requirements. No representation or warranty is given and no liability whatsoever is
assumed by Zetex with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights
arising from such use or otherwise. Zetex does not assume any legal responsibility or will not be held legally liable (whether in contract,
tort (including negligence), breach of statutory duty, restriction or otherwise) for any damages, loss of profit, business, contract,
opportunity or consequential loss in the use of these circuit applications, under any circumstances.

Life support

Zetex products are specifically not authorized for use as critical components in life support devices or systems without the express written
approval of the Chief Executive Officer of Zetex Semiconductors plc. As used herein:
A. Life support devices or systems are devices or systems which:

1. are intended to implant into the body

or

2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.

B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to

cause the failure of the life support device or to affect its safety or effectiveness.

Reproduction

The product specifications contained in this publication are issued to provide outline information only which (unless agreed by the
company in writing) may not be used, applied or reproduced for any purpose or form part of any order or contract or be regarded as a
representation relating to the products or services concerned.

Terms and Conditions

All products are sold subjects to Zetex’ terms and conditions of sale, and this disclaimer (save in the event of a conflict between the two
when the terms of the contract shall prevail) according to region, supplied at the time of order acknowledgement.
For the latest information on technology, delivery terms and conditions and prices, please contact your nearest Zetex sales office.

Quality of product

Zetex is an ISO 9001 and TS16949 certified semiconductor manufacturer.
To ensure quality of service and products we strongly advise the purchase of parts directly from Zetex Semiconductors or one of our
regionally authorized distributors. For a complete listing of authorized distributors please visit: www.zetex.com/salesnetwork
Zetex Semiconductors does not warrant or accept any liability whatsoever in respect of any parts purchased through unauthorized sales channels.
ESD (Electrostatic discharge)
Semiconductor devices are susceptible to damage by ESD. Suitable precautions should be taken when handling and transporting devices.
The possible damage to devices depends on the circumstances of the handling and transporting, and the nature of the device. The extent
of damage can vary from immediate functional or parametric malfunction to degradation of function or performance in use over time.
Devices suspected of being affected should be replaced.

Green compliance

Zetex Semiconductors is committed to environmental excellence in all aspects of its operations which includes meeting or exceeding reg­ulatory requirements with respect to the use of hazardous substances. Numerous successful programs have been implemented to reduce
the use of hazardous substances and/or emissions.
All Zetex components are compliant with the RoHS directive, and through this it is supporting its customers in their compliance with
WEEE and ELV directives.

Product status key:

“Preview” Future device intended for production at some point. Samples may be available
“Active” Product status recommended for new designs
“Last time buy (LTB)” Device will be discontinued and last time buy period and delivery is in effect
“Not recommended for new designs”
“Obsolete” Production has been discontinued

Datasheet status key:

“Draft version” This term denotes a very early datasheet version and contains highly provisional information, which

“Provisional version” This term denotes a pre-release datasheet. It provides a clear indication of anticipated performance.

“Issue” This term denotes an issued datasheet containing finalized specifications. However, changes to

Zetex sales offices

Europe

Zetex GmbH
Kustermann-park
Balanstraße 59
D-81541 München
Germany
Telefon: [phone]
Fax: [phone]
[e-mail]

© 2007 Published by Zetex Semiconductors plc

Device is still in production to support existing designs and production

may change in any manner without notice.

However, changes to the test conditions and specifications may occur, at any time and without notice.

specifications may occur, at any time and without notice.

Americas

Zetex Inc
700 Veterans Memorial Highway
Hauppauge, NY 11788
USA

Telephone: [phone]
Fax: [phone]
[e-mail]

Asia Pacific

Zetex (Asia Ltd)
3701-04 Metroplaza Tower 1
Hing Fong Road, Kwai Fong
Hong Kong

Telephone: [phone]
Fax: [phone]
[e-mail]

Corporate Headquarters

Zetex Semiconductors plc
Zetex Technology Park, Chadderton
Oldham, OL9 9LL
United Kingdom

Telephone: [phone]
Fax: [phone]
[e-mail]

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