Diodes ZXTP2009Z User Manual

ZXTP2009Z
40V PNP HIGH GAIN LOW SATURATION MEDIUM POWER TRANSISTOR IN SOT89
SUMMARY
= -40V : R
BV
CEO
DESCRIPTION
Packaged in the SOT89 outline this new low saturation 40V PNP transistor offers low on state losses making it ideal for use in DC-DC circuits, line switching and various driving and power management functions.
FEATURES
Extremely low equivalent on-resistance
5.5 amps continuous current
Up to 15 amps peak current
Very low saturation voltages < -60mV @ -1A
APPLICATIONS
DC - DC converters
= 29m ; IC= -5.5A
SAT
9
8
T
O
S
MOSFET gate drivers
Charging circuits
Power switches
Motor control
ORDERING INFORMATION
DEVICE REEL
SIZE
ZXTP2009ZTA 7” 12mm 1,000 units
TAPE
WIDTH
QUANTITY PER
REEL
DEVICE MARKING
53Z
ISSUE 1 - JUNE 2005
PINOUT
TOP VIEW
1
SEMICONDUCTORS
ZXTP2009Z
ABSOLUTE MAXIMUM RATINGS
PARAMETER SYMBOL LIMIT UNIT
Collector-base voltage BV Collector-base voltage BV Collector-emitter voltage BV Emitter-base voltage BV Continuous collector current
(b)
Peak pulse current I
(a)
Power dissipation at T
=25°C
A
CBO CBS CEO EBO
I
C CM
P
D
Linear derating factor Power dissipation at T
=25°C
A
(b)
P
D
Linear derating factor Power dissipation at T
=25°C
A
(c)
P
D
Linear derating factor Power dissipation at T
=25°C
A
(d)
P
D
Linear derating factor Operating and storage temperature range T
j,Tstg
THERMAL RESISTANCE
PARAMETER SYMBOL VALUE UNIT
Junction to ambient Junction to ambient Junction to ambient Junction to ambient
(a)
(b)
(c)
(d)
R R R R
JA
JA
JA
JA
-50 V
-50 V
-40 V
-7.5 V
-5.5 A
-15 A
0.9
7.2
mW/°C
1.5 12
mW/°C
2.1
16.8
mW/°C
3
24
mW/°C
-55 to 150 °C
139 °C/W
83 °C/W 60 °C/W 42 °C/W
W
W
W
W
NOTES
(a) For a device surface mounted on 15mm x 15mm x 1.6mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions. (b) For a device surface mounted on 25mm x 25mm x 1.6mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions. (c) For a device surface mounted on 50mm x 50mm x 1.6mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions. (d) For a device surface mounted on 25mm x 25mm x 1.6mm FR4 PCB measured at t5 secs.
ISSUE 1 - JUNE 2005
SEMICONDUCTORS
2
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