Diodes ZXTP19020DFF User Manual

ZXTP19020DFF
20V, SOT23F, PNP medium power transistor

Summary

BV
BV
I
V
R
P

CEO
ECO

C(cont)

CE(sat)
CE(sat)

= 1.5W

D

> -20V
> -4V
= 5.5A

< 44mV @ 1A
= 26mΩ

Complementary part number: ZXTN19020DFF
Description

Advanced process capability and package design have been used to
maximize the power handling and performance of this small outline
transistor. The compact size and ratings of this device make it ideally
suited to applications where space is at a premium

Features

• High power dissipation SOT2 3 pa ckage

• 15A peak current

• Guaranteed gain at a collector current of 10A

C

B

E

• Very low saturation voltage

Applications

• MOSFET and IGBT gate driving

• Power switches

• Motor control

Ordering information

Device Reel size

(inches)

ZXTP19020DFFTA 7 8 3000

Tape width Quantity per

reel

C

Device marking

1D8

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Pinout - top view

E

B

ZXTP19020DFF

Absolute maximum ratings

Parameter Symbol Limit Unit

Collector-base voltage V
Collector-emitter voltage V
Emitter-collector voltage (reverse blocking) V
Emitter-base voltage V

Continuous collector current

(c)

Peak pulse current I
Base current I

Power dissipation at T

amb

= 25°C

(a)

CBO
CEO
ECO
EBO

I

C

CM

B

P

D

Linear derating factor 6.72 mW/°C
Power dissipation at T

amb

= 25°C

(b)

P

D

Linear derating factor 10.72 mW/°C
Power dissipation at T

amb

= 25°C

(c)

P

D

Linear derating factor 12 mW/°C
Power dissipation at T

amb

= 25°C

(d)

P

D

linear derating factor 16 mW/°C
Operating and storage temperature range T

j

, T

stg

-25 V

-20 V

-4 V

-7 V

-5.5 A

-15 A

-1 A

0.84 W

1.34 W

1.5 W

2W

-55 to 150 °C

Thermal resistance

Parameter Symbol Value Unit

Junction to ambient
Junction to ambient
Junction to ambient
Junction to ambient
Junction to case

NOTES:

(a)For a device surface mounted on 15mm x 15mm x 1.6mm FR4 PCB with high coverage of single sided 1oz copper, in

still air conditions.
(b)Mounted on 25mm x 25mm x 1.6mm FR4 PCB with a high coverage of single sided 2 oz copper in still air conditions.
(c) Mounted on 50mm x 50mm x 1.6mm FR4 PCB with a high coverage of single sided 2 oz copper in still air conditions.
(d)As (c) above measured at t<5secs
(e)Junction to case from collector tab

(a)

(b)

(c)

(d)

(e)

R

R
R
R
R

JA

JA

JA

JA

JC

149.3 °C/W

93.4 °C/W

83.3 °C/W
60 °C/W
38 °C/W

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Characteristics

ZXTP19020DFF

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ZXTP19020DFF

Electrical characteristics (at T

= 25°C unless otherwise stated).

amb

Parameter Symbol Min. Typ. Max. Unit Conditions

Collector-base brea kd own

BV

CBO

-25 -55 V IC = -100A

voltage
Collector-emitter breakdown

voltage (base open)
Emitter-collector breakd own

voltage (reverse blocking)
Emitter-collector breakd own

BV

BV

BV

CEO

ECX

ECO

-20 -50 V

-4 -8.6 V

= -10mA

I

C

I

= -100A, RBC

E

0.25V > V

-4 -8.6 V IE = -100A

voltage (base open)
Emitter-base breakdown

BV

EBO

-7 -8.2 V IE = -100A

voltage
Collector-base cut-off current

Emitter-base cut-off current
Collector-emitter saturation

voltage

Base-emitter saturation

I

CBO

I

EBO

V

CE(sat)

V

BE(sat)

<-1 -50

-0.5

nAAV

CB

V

CB

= -25V
= -25V, T

<-1 -50 nA VEB = -5.6V

-37 -44 mV

-90 -125 mV

-105 -140 mV

-160 -210 mV

-145 -175 mV

-975 -1050 mV

= -1A, IB = -100mA

I

C

= -1A, IB = -10mA

I

C

= -2A, IB = -40mA

I

C

= -5A, IB = -250mA

I

C

IC = -5.5A, IB = -550mA
IC = -5.5A, IB = -550mA

voltage
Base-emitter turn-on voltage

Static forward current
transfer ratio

Transition frequency

Input capacitance
Output capacitance
Delay time

Rise time
Storage time
Fall time

V

BE(on)

h

C

C

FE

f

T

ibo

obo

t

d

t

r

t

s

t

f

-830 -900 mV
300 450 900
200 310

85 130
25 50

20

176 MHz IC = -50mA, VCE = -10V

400 pF
36 45 pF
23 ns IC = -1A, V

18.4 ns
266 ns

49.6 ns

= -5.5A, VCE = -2V

I

C

IC = -100mA, VCE = -2V

= -2A, VCE = -2V

I

C

= -5.5A, VCE = -2V

I

C

= -10A, VCE = -2V

I

C

= -15A, VCE = -2V

I

C

= 50MHz

f

= -0.5V, f = 1MHz

V

EB

= -10V, f = 1MHz

V

CB

I

= -IB2= -50mA.

B1

(*)

> -0.25V

BC

CC

< 1kΩ

= 100°C

amb

= -10V

or

(*)
(*)
(*)

(*)

(*)
(*)

(*)

(*)

(*)

(*)
(*)
(*)

(*)

(*)

NOTES:

(*)Measured under pulsed conditions. Pulse width 300s; duty cycle 2%.

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Typical characteristics

ZXTP19020DFF

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SOT23F Package outline

ZXTP19020DFF

D

bb

L1

E1

b

R

A

Dim. Millimeters Inches Dim. Millimeters Inches

Min. Max. Min. Max. Min. Max. Min. Max.

A 0.80 1.00 0.0315 0.0394 E 2.30 2.50 0.0906 0.0984

A1 0.00 0.10 0.00 0.0043 E1 1.50 1.70 0.0590 0.0669

b 0.35 0.45 0.0153 0.0161 L 0.48 0.68 0.0189 0.0268

c 0.10 0.20 0.0043 0.0079 L1 0.30 0.50 0.0153 0.0161

D 2.80 3.00 0.1102 0.1181 R 0.05 0.15 0.0019 0.0059

e 0.95 ref 0.0374 ref O 0° 12° 0° 12°

e1 1.80 2.00 0.0709 0.0787 - - - - -

Note: Controlling dimensions are in millimeters. Approximate dimensions are provided in inches

c

L

E

A1

e1

e

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ZXTP19020DFF

Intentionally left blank

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© Zetex Semiconductors plc 2007

ZXTP19020DFF

Definitions
Product change

Zetex Semiconductors reserves the right to alter, without notice, specifications, design, price or conditions of supply of any product or
service. Customers are solely responsible for obtaining the latest relevant information before placing orders.

Applications disclaimer

The circuits in this design/application note are offered as design ideas. It is the responsibility of the user to ensure that the circuit is fit for
the user’s application and meets with the user’s requirements. No representation or warranty is given and no liability whatsoever is
assumed by Zetex with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights
arising from such use or otherwise. Zetex does not assume any legal responsibility or will not be held legally liable (whether in contract,
tort (including negligence), breach of statutory duty, restriction or otherwise) for any damages, loss of profit, business, contract,
opportunity or consequential loss in the use of these circuit applications, under any circumstances.

Life support

Zetex products are specifically not authorized for use as critical components in life support devices or systems without the express written
approval of the Chief Executive Officer of Zetex Semiconductors plc. As used herein:
A. Life support devices or systems are devices or systems which:

1. are intended to implant into the body

or

2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.

B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to

cause the failure of the life support device or to affect its safety or effectiveness.

Reproduction

The product specifications contained in this publication are issued to provide outline information only which (unless agreed by the
company in writing) may not be used, applied or reproduced for any purpose or form part of any order or contract or be regarded as a
representation relating to the products or services concerned.

Terms and Conditions

All products are sold subjects to Zetex’ terms and conditions of sale, and this disclaimer (save in the event of a conflict between the two
when the terms of the contract shall prevail) according to region, supplied at the time of order acknowledgement.
For the latest information on technology, delivery terms and conditions and prices, please contact your nearest Zetex sales office.

Quality of product

Zetex is an ISO 9001 and TS16949 certified semiconductor manufacturer.
To ensure quality of service and products we strongly advise the purchase of parts directly from Zetex Semiconductors or one of our
regionally authorized distributors. For a complete listing of authorized distributors please visit: www.zetex.com/salesnetwork
Zetex Semiconductors does not warrant or accept any liability whatsoever in respect of any parts purchased through unauthorized sales channels.
ESD (Electrostatic discharge)
Semiconductor devices are susceptible to damage by ESD. Suitable precautions should be taken when handling and transporting devices.
The possible damage to devices depends on the circumstances of the handling and transporting, and the nature of the device. The extent
of damage can vary from immediate functional or parametric malfunction to degradation of function or performance in use over time.
Devices suspected of being affected should be replaced.

Green compliance

Zetex Semiconductors is committed to environmental excellence in all aspects of its operations which includes meeting or exceeding reg­ulatory requirements with respect to the use of hazardous substances. Numerous successful programs have been implemented to reduce
the use of hazardous substances and/or emissions.
All Zetex components are compliant with the RoHS directive, and through this it is supporting its customers in their compliance with
WEEE and ELV directives.

Product status key:

“Preview” Future device intended for production at some point. Samples may be available
“Active” Product status recommended for new designs
“Last time buy (LTB)” Device will be discontinued and last time buy period and delivery is in effect
“Not recommended for new designs”
“Obsolete” Production has been discontinued

Datasheet status key:

“Draft version” This term denotes a very early datasheet version and contains highly provisional information, which
“Provisional version” This term denotes a pre-release datasheet. It provides a clear indication of anticipated performance.
“Issue” This term denotes an issued datasheet containing finalized specifications. However, changes to

Zetex sales offices
Europe

Zetex GmbH
Kustermann-park
Balanstraße 59
D-81541 München
Germany
Telefon: [phone]
Fax: [phone]
[e-mail]

© 2007 Published by Zetex Semiconductors plc

Device is still in production to support existing designs and production

may change in any manner without notice.
However, changes to the test conditions and specifications may occur, at any time and without notice.
specifications may occur, at any time and without notice.

Americas

Zetex Inc
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Hauppauge, NY 11788
USA

Telephone: [phone]
Fax: [phone]
[e-mail]

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Hong Kong

Telephone: [phone]
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[e-mail]

Corporate Headquarters

Zetex Semiconductors plc
Zetex Technology Park, Chadderton
Oldham, OL9 9LL
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Telephone: [phone]
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[e-mail]

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