Diodes ZXT12P40DX User Manual

ZXT12P40DX

SuperSOT4™
DUAL 40V PNP SILICON LOW SATURATION SWITCHING TRANSISTOR

SUMMARY
V

=-40V; R

CEO

DESCRIPTION

This new 4th generation ultra low saturation transistor utilises the Zetex
matrix structure combined with advanced assembly techniques to give
extremely low on state losses. This makes it ideal for high efficiency, low
voltage switching applications.

FEATURES

Extremely Low Equivalent On Resistance

•

Extremely Low Saturation Voltage

•

characterised up to 5A

h

•

FE

I

=2A Continuous Collector Current

•

C

• MSOP8 package

APPLICATIONS

• DC - DC Converters

• Power Management Functions

• Power switches

• Motor control

ORDERING INFORMATION

DEVICE REEL SIZE

ZXT12P40DXTA 7

ZXT12P40DXTC 13

= 75m ;IC= -2A

SAT

(inches)

B1

TAPE WIDTH
(mm)

12mm embossed

12mm embossed

C1

E1

QUANTITY
PER REEL

1000 units

4000 units

B2

E1
B1
E2

B2

Top View

MSOP8

1
2

3

4

C2

8
7
6
5

E2

C1
C1
C2

C2

DEVICE MARKING

T12P40DX

ISSUE 2 - DECEMBER 2006

1

ZXT12P40DX

ABSOLUTE MAXIMUM RATINGS.

PARAMETER SYMBOL LIMIT UNIT

Collector-Base Voltage V

Collector-Emitter Voltage V

Emitter-Base Voltage V

Peak Pulse Current I

Continuous Collector Current I

Base Current I

Power Dissipation at TA=25°C (a)(d)
Linear Derating Factor

Power Dissipation at TA=25°C (a)(e)
Linear Derating Factor

Power Dissipation at TA=25°C (b)(d)
Linear Derating Factor

Operating and Storage Temperature Range T

CBO

CEO

EBO

CM

C

B

P

D

P

D

P

D

j:Tstg

-50 V

-40 V

-7.5 V

-5 A

-2 A

-500 mA

0.87

6.9

mW/°C

1.04

8.3

mW/°C

1.25
10

mW/°C

-55 to +150 °C

W

W

W

THERMAL RESISTANCE

PARAMETER SYMBOL VALUE UNIT

Junction to Ambient (a)(d) R

Junction to Ambient (b)(d) R

Junction to Ambient (a)(e) R

θJA

θJA

θJA

NOTES
(a) For a device surface mounted on 25mm x 25mm FR4 PCB with high coverage of single sided 1oz copper,

in still air conditions
(b) For a device surface mounted on FR4 PCB measured at t⭐5 secs.
(c) Repetitive rating - pulse width limited by maximum junction temperature. Refer to Transient Thermal

Impedance graph.
(d) For device with one active die.
(e) For device with two active die running at equal power.

ISSUE 2 - DECEMBER 2006

2

143 °C/W

100 °C/W

120 °C/W

CHARACTERISTICS

ZXT12P40DX

ISSUE 2 - DECEMBER 2006

3

ZXT12P40DX

ELECTRICAL CHARACTERISTICS (at T

= 25°C unless otherwise stated).

amb

PARAMETER SYMBOL MIN. TYP. MAX. UNIT CONDITIONS.

Collector-Base Breakdown
Voltage

Collector-Emitter Breakdown
Voltage

Emitter-Base Breakdown Voltage V

Collector Cut-Off Current I

Emitter Cut-Off Current I

Collector Emitter Cut-Off Current I

Collector-Emitter Saturation
Voltage

Base-Emitter Saturation Voltage V

Base-Emitter Turn-On Voltage V

Static Forward Current Transfer
Ratio

Transition Frequency f

Output Capacitance C

Turn-On Time t

Turn-Off Time t

V

(BR)CBO

V

(BR)CEO

(BR)EBO

CBO

EBO

CES

V

CE(sat)

BE(sat)

BE(on)

h

FE

T

obo

(on)

(off)

-50 -95 V IC=-100␮A

-40 -80 V IC=-10mA*

-7.5 -8.5 V IE=-100␮A

-100 nA VCB=-40V

-100 nA VEB=-6V

-18

-155

-190

-150

-100 nA V

-22

-215

-260

-190

mV
mV
mV
mV

=-40V

CES

=-0.1A, IB=-10mA*

I

C

=-1A, IB=-20mA*

I

C

=-2A, IB=-100mA*

I

C

=-2A, IB=-200mA*

I

C

-0.92 -1.0 V IC=-2A, IB=-100mA*

-0.80 -0.85 V IC=-2A, VCE=-2V*

300
300
150

10

450
450
300

25

900

=-10mA, VCE=-2V*

I

C

=-1A, VCE=-2V*

I

C

=-2A, VCE=-2V*

I

C

=-5A, VCE=-2V*

I

C

130 MHz IC=-30mA, VCE=-10V

f=-50MHz

35 pF VCB=-10V, f=1MHz

97 ns VCC=-10V, IC=-1A

=-20mA

I

640 ns

B1=IB2

*Measured under pulsed conditions. Pulse width=300µs. Duty cycle ≤ 2%

ISSUE 2 - DECEMBER 2006

4

TYPICAL CHARACTERISTICS

ZXT12P40DX

ISSUE 2 - DECEMBER 2006

5

Europe

Zetex GmbH
Kustermann-park
Balanstraße 59
D-81541 München
Germany
Telefon: [phone]
Fax: [phone]
[e-mail]

Americas

Zetex Inc
700 Veterans Memorial Highway
Hauppauge, NY 11788
USA

Telephone: [phone]
Fax: [phone]
[e-mail]

Asia Pacific

Zetex (Asia L td)
3701-04 Metroplaza Tower 1
Hing Fong Road, Kwai Fong
Hong Kong

Telephone: [phone]
Fax: [phone]
[e-mail]

Corporate Headquarters

Zetex Semiconductors plc
Zetex Technology Park, Chadderton
Oldham, OL9 9LL
United Kingdom

Telephone [phone]
Fax: [phone]
[e-mail]

© 2006 Published by Zetex Semiconductors plc.

ZXT12P40DX

PACKAGE DIMENSIONS

D

5678

E

234

1

eX6

A1

B

C

Conforms to JEDEC MO-187 Iss A

DIM Millimetres Inches

MIN MAX MIN MAX

A 1.10 0.043

A1 0.05 0.15 0.002 0.006

B 0.25 0.40 0.010 0.016

C 0.13 0.23 0.005 0.009

D 2.90 3.10 0.114 0.122

e 0.65 BSC 0.0256 BSC

E 2.90 3.10 0.114 0.122

H 4.90 BSC 0.193 BSC

L 0.40 0.70 0.016 0.028

q° 0° 6° 0° 6°

PAD LAYOUT DETAILS

H

θ°

L

Zetex Semiconductors plc,

Zetex GmbH ZetexInc. Zetex (Asia)Ltd. These aresupported by
Balanstraße59 47 Mall Drive, Unit 4 3510 Metroplaza,Tower 2 agents and distributors in
D-81673 München Commack NY11725 HingFong Road, major countriesworld-wide
Germany USA Kwai Fong, Hong Kong © Zetex Semiconductors plc 2006
Telefon: [phone] Telephone: [phone] Telephone:[phone]
Fax: [phone] Fax: [phone] Fax: [phone] www.zetex.com

This publication is issued to provide outline information only which (unless agreed by the Company in writing) may not be used, applied or reproduced for
any purpose or form part of any order or contract or be regarded as a representation relating to the products or services concerned. The Company reserves
the right to alter without notice the specification, design, price or conditions of supply of any product or service.

ISSUE 2 - DECEMBER 2006

ZetexTechnology Park, Chadderton, Oldham,OL9 9LL, United Kingdom.
Telephone:[phone]
Fax: [phone]

6

Part no.

Definitions

Product change

Zetex Semiconductors reserves the right to alter, without notice, specifications, design, price or conditions of supply of any product or
service. Customers are solely responsible for obtaining the latest relevant information before placing orders.

Applications disclaimer

The circuits in this design/application note are offered as design ideas. It is the responsibility of the user to ensure that the circuit is fit for
the user’s application and meets with the user’s requirements. No representation or warranty is given and no liability whatsoever is
assumed by Zetex with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights
arising from such use or otherwise. Zetex does not assume any legal responsibility or will not be held legally liable (whether in contract,
tort (including negligence), breach of statutory duty, restriction or otherwise) for any damages, loss of profit, business, contract,
opportunity or consequential loss in the use of these circuit applications, under any circumstances.

Life support

Zetex products are specifically not authorized for use as critical components in life support devices or systems without the express written
approval of the Chief Executive Officer of Zetex Semiconductors plc. As used herein:
A. Life support devices or systems are devices or systems which:

or

B. A critical component is any component in a life support device or system whose failure to perform can be reasonably

Reproduction

The product specifications contained in this publication are issued to provide outline information only which (unless agreed by the
company in writing) may not be used, applied or reproduced for any purpose or form part of any order or contract or be regarded as a
representation relating to the products or services concerned.

Terms and Conditions

All products are sold subjects to Zetex’ terms and conditions of sale, and this disclaimer (save in the event of a conflict between the two
when the terms of the contract shall prevail) according to region, supplied at the time of order acknowledgement.
For the latest information on technology, delivery terms and conditions and prices, please contact your nearest Zetex sales office.

Quality of product

Zetex is an ISO 9001 and TS16949 certified semiconductor manufacturer.
To ensure quality of service and products we strongly advise the purchase of parts directly from Zetex Semiconductors or one of our
regionally authorized distributors. For a complete listing of authorized distributors please visit: www.zetex.com/salesnetwork
Zetex Semiconductors does not warrant or accept any liability whatsoever in respect of any parts purchased through unauthorized sales
channels.

ESD (Electrostatic discharge)

Semiconductor devices are susceptible to damage by ESD. Suitable precautions should be taken when handling and transporting
devices. The possible damage to devices depends on the circumstances of the handling and transporting, and the nature of the device.
The extent of damage can vary from immediate functional or parametric malfunction to degradation of function or performance in use
over time. Devices suspected of being affected should be replaced.

Green compliance

Zetex Semiconductors is committed to environmental excellence in all aspects of its operations which includes meeting or exceeding
regulatory requirements with respect to the use of hazardous substances. Numerous successful programs have been implemented to
reduce the use of hazardous substances and/or emissions.
All Zetex components are compliant with the RoHS directive, and through this it is supporting its customers in their compliance with
WEEE and ELV directives.

Product status key:

“Preview” Future device intended for production at some point. Samples may be available
“Active” Product status recommended for new designs
“Last time buy (LTB)” Device will be discontinued and last time buy period and delivery is in effect
“Not recommended for new designs” Device is still in production to support existing designs and production
“Obsolete” Production has been discontinued

Datasheet status key:

“Draft version” This term denotes a very early datasheet version and contains highly provisional
“Provisional version” This term denotes a pre-release datasheet. It provides a clear indication of anticipated

“Issue” This term denotes an issued datasheet containing finalized specifications. However, changes to

1. are intended to implant into the body

2. support or sustain life and whose failure to perform when properly used in accordance with instructions
for use provided in the labeling can be reasonably expected to result in significant injury to the user.

expected to cause the failure of the life support device or to affect its safety or effectiveness.

information, which may change in any manner without notice.
performance. However, changes to the test conditions and specifications may occur, at any time

and without notice.
specifications may occur, at any time and without notice.