The ZXMS6006DG is a self protected low side MOSFET with logic
level input. It integrates over-temperature, over-current, over-voltage
(active clamp) and ESD protected logic level functionality. The
ZXMS6006DG is ideal as a general purpose switch driven from 3.3V
or 5V microcontrollers in harsh environments where standard
MOSFETs are not rugged enough.
ADVANCE INFORMATION
• Lamp Driver
• Motor Driver
• Relay Driver
• Solenoid Driver
SOT-223
Top View
IN
Features and Benefits
• Compact high power dissipation package
• Low input current
• Logic Level Input (3.3V and 5V)
• Short circuit protection with auto restart
• Over voltage protection (active clamp)
• Thermal shutdown with auto restart
• Over-current protection
• Input Protection (ESD)
• High continuous current rating
• Green, RoHS Compliant (Note 1)
• Halogen and Antimony Free. (Note 2)
• Qualified to AEC-Q101 Standards for High Reliability
Mechanical Data
• Case: SOT-223
• Case Material: Molded Plastic, “Green” Molding Compound.
Continuous Drain-Source Voltage
Drain-Source Voltage for Short Circuit Protection
Continuous Input Voltage
Continuous Input Current @-0.2V ≤ VIN ≤ 6V
Continuous Input Current @V
< -0.2V or VIN > 6V
IN
V
DS(SC
V
DS
V
IN
I
IN
Pulsed Drain Current @VIN = 3.3V IDM
Pulsed Drain Current @VIN = 5V IDM
Continuous Source Current (Body Diode) (Note 4)
Pulsed Source Current (Body Diode)
Unclamped Single Pulse Inductive Energy,
= 25°C, ID = 0.5A, VDD = 24V
T
J
Electrostatic Discharge (Human Body Model)
Charged Device Model
ADVANCE INFORMATION
V
V
I
E
ESD
CDM
I
SM
S
AS
Thermal Characteristics@T
= 25°C unless otherwise specified
A
Characteristic Symbol Value Units
Power Dissipation at TA = 25°C (Note 4)
Linear Derating Factor
Power Dissipation at TA = 25°C (Note 5)
Linear Derating Factor
Thermal Resistance, Junction to Ambient (Note 4)
Thermal Resistance, Junction to Ambient (Note 5)
Thermal Resistance, Junction to Case (Note 6)
Operating Temperature Range
Storage Temperature Range
Notes: 4. For a device surface mounted on 15mm x 15mm single sided 1oz weight copper on 1.6mm FR4 board, in still air conditions.
5. For a device surface mounted on 50mm x 50mm single sided 2oz weight copper on 1.6mm FR4 board, in still air conditions.
6. Thermal resistance between junction and the mounting surfaces of drain and source pins.
P
D
P
D
R
θJA
R
θJA
R
θJC
T
J
T
STG
-40 to +150
-55 to +150
60 V
16 V
-0.5 ... +6 V
No limit
│≤2
│I
IN
mA
11 A
13 A
2 A
12 A
490 mJ
4000 V
1000 V
1.3
10.4
3.0
24
96
42
12
W
mW/°C
W
mW/°C
°C/W
°C/W
°C/W
°C
°C
IntelliFET® is a trademark of Diodes Incorporated, registered in the United States and other jurisdictions worldwide.
The ZXMS6006DG is optimized for use with µC operating from 3.3V and 5V supplies.
Characteristic Symbol Min Max Unit
Input Voltage Range
Ambient Temperature Range
High Level Input Voltage for MOSFET to be on
Low level input voltage for MOSFET to be off
Peripheral Supply Voltage (voltage to which load is referred)
Thermal Characteristics
ADVANCE INFORMATION
A Product Line o
Diodes Incorporated
ZXMS6006DG
V
IN
T
A
V
IH
V
IL
V
P
0 5.5 V
-40 125 °C
3 5.5 V
0 0.7 V
0 16 V
Limited by Over-Current Protection
DC
1s
100ms
10ms
Limit of s/c protection
110
10
100m
Drain Current (A)
D
10m
I
Limited
by R
DS(on)
1
Single Pulse
T
=25°C
amb
15X15X1.6 mm
Single 1oz FR4
VDS Drain-Source Voltage (V)
Safe Operating Area
100
Thermal Resistance (°C/W)
15X15X1.6 mm
90
Single 1oz FR4
80
70
60
50
40
30
20
10
T
=25°C
amb
D=0.5
D=0.2
0
100µ 1m10m 100m1101001k
D=0.1
Single Pulse
D=0.05
Pulse Width (s)
Transient Thermal Impedance
1ms
3.0
2.5
2.0
1.5
1.0
0.5
0.0
Max Power Dissipation (W)
15X15X1.6 mm
Single 1oz FR4
0255075100125150
50X50X1.6 mm
Single 2oz FR4
Temperature (°C)
Derating Curve
100
10
Maximum Power (W)
1
100µ 1m10m 100m1101001k
Pulse Width (s )
15X15X1.6 mm
Single 1oz FR4
Single Pulse
T
=25°C
amb
Pulse Power Dissipation
IntelliFET® is a trademark of Diodes Incorporated, registered in the United States and other jurisdictions worldwide.
Notes: 7. The drain current is restricted only when the device is in saturation (see graph ‘typical output characteristic’). This allows the device to be used in the fully
on state without interference from the current limit. The device is fully protected at all drain currents, as the low power dissipation generated outside
saturation makes current limit unnecessary.
8. Over-temperature protection is designed to prevent device destruction under fault conditions. Fault conditions are considered as “outside” normal
operating range, so this part is not designed to withstand over-temperature for extended periods..
T
JT
f
f
150 175 -
- 10 -
°C
°C
-
-
IntelliFET® is a trademark of Diodes Incorporated, registered in the United States and other jurisdictions worldwide.
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ADVANCE INFORMATION
noted herein may also be covered by one or more United States, international or foreign trademarks.
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