On-state resistance 500 mΩ
Nominal load current (V
Clamping Energy 210 mJ
DESCRIPTION
The ZXMS6004DT8 is a dual self protected low side MOSFET
with logic level input. It integrates over-temperature, overcurrent, over-voltage (active clamp) and ESD protected logic level
functionality independently per channel. The ZXMS6004DT8 is
ideal as a general purpose switch driven from 3.3V or 5V
microcontrollers in harsh environments where standard
MOSFETs are not rugged enough.
• Especially suited for loads with a high in-rush current such as lamps and motors.
• All types of resistive, inductive and capacitive loads in switching applications.
• μC compatible power switch for 12V and 24V DC applications.
• Automotive rated.
• Replaces electromechanical relays and discrete circuits.
• Linear Mode capability - the current-limiting protection circuitry is designed to de-activate
at low V
therefore determined by the thermal capability of the package/board combination, rather
than by the protection circuitry. This does not compromise the product’s ability to selfprotect at low V
to minimise on state power dissipation. The maximum DC operating current is
PARAMETER SYMBOL LIMIT UNIT
Continuous Drain-Source Voltage VDS 60 V
Drain-Source Voltage for short circuit protection V
36 V
DS(SC
Continuous Input Voltage VIN -0.5 ... +6 V
Continuous Input Current
-0.2V≤V
V
IN
≤6V
IN
<-0.2V or VIN>6V
Operating Temperature Range Tj, -40 to +150
Storage Temperature Range T
Power Dissipation at TA =25°C (a)(d)
Linear Derating Factor
Power Dissipation at TA =25°C (a)(e)
Linear Derating Factor
Power Dissipation at TA =25°C (b)(d)
Linear Derating Factor
I
IN
No limit
│I
│≤2
IN
-55 to +150
stg
P
1.16
D
9.28
P
1.67
D
13.3
P
2.13
D
17
mW/°C
mW/°C
mW/°C
mA
°C
°C
W
W
W
Pulsed Drain Current @ VIN=3.3V (c) IDM 2 A
Pulsed Drain Current @ VIN=5V (c) IDM 2.5 A
Continuous Source Current (Body Diode) (a) IS 1 A
Pulsed Source Current (Body Diode) (c) ISM 5 A
E
Unclamped single pulse inductive energy, Tj=25°C,
=0.5A, VDD=24V
I
D
Electrostatic Discharge (Human Body Model) V
Charged Device Model V
210 mJ
AS
4000 V
ESD
1000 V
CDM
THERMAL RESISTANCE
PARAMETER SYMBOL VALUE UNIT
Junction to Ambient (a)(d) R
Junction to Ambient (a)(e) R
Junction to Ambient (b)(d) R
Junction to Case (f) R
108
θJA
75
θJA
58.7
θJA
26.5
θJC
°C/W
°C/W
°C/W
°C/W
NOTES
(a) For a dual device surface mounted on a 25mm x 25mm FR4 PCB single sided 1oz weight copper split
down the middle on 1.6mm FR4 board, in still air conditions.
(b) For a dual device surface mounted on FR4 PCB measured at t ≤ 10sec
(c) Repetitive rating 25mm x 25mm FR4 PCB, D=0.02 pulse width=300µs – pulse width limited by junction
temperature. Refer to transient Thermal Impedance Graph.
(d) For a dual device with one active die.
(e) For dual device with 2 active die running at equal power.
(f) Thermal resistance from junction to solder-point (at the end of the drain lead)
The ZXMS6004DT8 is optimised for use with µC operating from 3.3V and 5V supplies.
Symbol Description Min Max Units
VIN Input voltage range 0 5.5 V
TA Ambient temperature range -40 125 °C
VIH High level input voltage for MOSFET to be on 3 5.5 V
VIL Low level input voltage for MOSFET to be off 0 0.7 V
VP Peripheral supply voltage (voltage to which load is referred) 0 36 V
Drain-Source Clamp Voltage V
Off state Drain Current I
Off state Drain Current I
Input Threshold Voltage V
Input Current IIN 60 100
Input Current IIN 120 200
Input Current while over
60 65 70 V ID=10mA
DS(AZ)
500 nA VDS=12V, VIN=0V
DSS
1 uA VDS=36V, VIN=0V
DSS
0.7 1 1.5 V VDS=VGS, ID=1mA
IN(th
VIN=+3V
VIN=+5V
VIN=+5V
220
μA
μA
μA
temperature active
Static Drain-Source On-State
Resistance
Static Drain-Source On-State
Resistance
Continuous Drain Current (a)(e) ID 0.9 A
R
400 600
DS(on)
R
350 500
DS(on)
mΩ
mΩ
VIN=+3V, ID=0.5A
VIN=+5V, ID=0.5A
=3V; TA=25°C
V
IN
Continuous Drain Current (a)(e) ID 1.0 A
Continuous Drain Current (a)(d) ID 1.1 A
Continuous Drain Current (a)(d) ID 1.2 A
Current Limit (g) I
Current Limit (g) I
Dynamic Characteristics
Turn On Delay Time t
Rise time tr 10
0.7 1.7 A VIN=+3V,
D(LIM
1 2.2 A VIN=+5V
D(LIM
5
d(on)
μs
μs
=5V; TA=25°C
V
IN
=3V; TA=25°C
V
IN
=5V; TA=25°C
V
IN
VDD=12V, ID=0.5A,
=5V
V
GS
Turn Off Delay Time t
Fall Time ff 15
45
d(off)
μs
μs
Notes:
(g) The drain current is restricted only when the device is in saturation (see graph ‘typical output
characteristic’). This allows the device to be used in the fully on state without interference from
the current limit. The device is fully protected at all drain currents, as the low power dissipation
generated outside saturation makes current limit unnecessary.
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