Diodes ZXMS6004DT8 User Manual

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ZXMS6004DT8 60V N-CHANNEL SELF PROTECTED ENHANCEMENT MODE
INTELLIFET
MOSFET
SUMMARY
Continuous drain source voltage 60 V
On-state resistance 500 mΩ Nominal load current (V Clamping Energy 210 mJ
DESCRIPTION
The ZXMS6004DT8 is a dual self protected low side MOSFET with logic level input. It integrates over-temperature, over­current, over-voltage (active clamp) and ESD protected logic level functionality independently per channel. The ZXMS6004DT8 is ideal as a general purpose switch driven from 3.3V or 5V microcontrollers in harsh environments where standard MOSFETs are not rugged enough.
FEATURES
Compact dual package
Low input current
Logic Level Input (3.3V and 5V)
Short circuit protection with auto restart
Over voltage protection (active clamp)
Thermal shutdown with auto restart
Over-current protection
Input Protection (ESD)
High continuous current rating
ORDERING INFORMATION
DEVICE
ZXMS6004DT8TA
= 5V) 1.2 A
IN
PART
MARK
ZXMS 6004D
REEL SIZE
(inches)
7
TAPE WIDTH
(mm)
12 embossed
SM8 Package
QUANTITY PER
REEL
1,000 units
ZXMS6004DT8
Document Number DS32245 Rev. 1 - 2
1 of 9
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June 2010
© Diodes Incorporated
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FUNCTIONAL BLOCK DIAGRAM
IN1/2
Human body ESD protection
Over temperature protection
Over current protection
Over Voltage Pr
n
Logic
dV/dt limitati
n
D1/2
S1/2
APPLICATIONS AND INFORMATION
Two completely isolated independent channels
Especially suited for loads with a high in-rush current such as lamps and motors.
All types of resistive, inductive and capacitive loads in switching applications.
• μC compatible power switch for 12V and 24V DC applications.
Automotive rated.
Replaces electromechanical relays and discrete circuits.
Linear Mode capability - the current-limiting protection circuitry is designed to de-activate
at low V therefore determined by the thermal capability of the package/board combination, rather than by the protection circuitry. This does not compromise the product’s ability to self­protect at low V
to minimise on state power dissipation. The maximum DC operating current is
DS
.
DS
ZXMS6004DT8
Document Number DS32245 Rev. 1 - 2
2 of 9
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ABSOLUTE MAXIMUM RATINGS
PARAMETER SYMBOL LIMIT UNIT Continuous Drain-Source Voltage VDS 60 V Drain-Source Voltage for short circuit protection V
36 V
DS(SC
Continuous Input Voltage VIN -0.5 ... +6 V Continuous Input Current
-0.2V≤V V
IN
6V
IN
<-0.2V or VIN>6V Operating Temperature Range Tj, -40 to +150 Storage Temperature Range T
Power Dissipation at TA =25°C (a)(d) Linear Derating Factor
Power Dissipation at TA =25°C (a)(e) Linear Derating Factor
Power Dissipation at TA =25°C (b)(d) Linear Derating Factor
I
IN
No limit
I
│≤2
IN
-55 to +150
stg
P
1.16
D
9.28
P
1.67
D
13.3
P
2.13
D
17
mW/°C
mW/°C
mW/°C
mA
°C °C
W
W
W
Pulsed Drain Current @ VIN=3.3V (c) IDM 2 A Pulsed Drain Current @ VIN=5V (c) IDM 2.5 A Continuous Source Current (Body Diode) (a) IS 1 A Pulsed Source Current (Body Diode) (c) ISM 5 A
E
Unclamped single pulse inductive energy, Tj=25°C,
=0.5A, VDD=24V
I
D
Electrostatic Discharge (Human Body Model) V Charged Device Model V
210 mJ
AS
4000 V
ESD
1000 V
CDM
THERMAL RESISTANCE
PARAMETER SYMBOL VALUE UNIT Junction to Ambient (a)(d) R
Junction to Ambient (a)(e) R Junction to Ambient (b)(d) R Junction to Case (f) R
108
θJA
75
θJA
58.7
θJA
26.5
θJC
°C/W °C/W °C/W °C/W
NOTES
(a) For a dual device surface mounted on a 25mm x 25mm FR4 PCB single sided 1oz weight copper split
down the middle on 1.6mm FR4 board, in still air conditions. (b) For a dual device surface mounted on FR4 PCB measured at t 10sec (c) Repetitive rating 25mm x 25mm FR4 PCB, D=0.02 pulse width=300µs – pulse width limited by junction
temperature. Refer to transient Thermal Impedance Graph. (d) For a dual device with one active die. (e) For dual device with 2 active die running at equal power. (f) Thermal resistance from junction to solder-point (at the end of the drain lead)
ZXMS6004DT8
Document Number DS32245 Rev. 1 - 2
3 of 9
www.diodes.com
June 2010
© Diodes Incorporated
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