ZXMS6001N3
60V N-channel self protected enhancement mode
INTELLIFETTM MOSFET
Summary
Continuous drain source voltage VDS = 60V
On-state resistance 675mΩ
Max nominal load current (a) 1.1A (V
Min nominal load current (c) 0.7A (V
Clamping Energy 550mJ
= 5V)
IN
= 5V)
IN
Description
Low input current self protected low side MOSFET intended for Vin=5V
applications. Monolithic over temperature, over current, over voltage
(active clamp) and ESD protected logic level functionality. Intended as
a general purpose switch.
Note:
The tab is connected to the source pin and must be electrically isolated
from the drain pin. Connection of significant copper to the drain pin is
recommended for best thermal performance.
Features
• Short circuit protection with auto restart
• Over voltage protection (active clamp)
• Thermal shutdown with auto restart
• Over-current protection
• Input protection (ESD)
• Load dump protection (actively protects load)
• Low input current
S
S
D
IN
SOT223
Ordering information
Device Package Part mark Reel size
(inches)
ZXMS6001N3TA SOT223 ZXMS6001 7 12 embossed 1,000
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© Zetex Semiconductors plc 2008
Tape width
(mm)
Quantity
per reel
Functional block diagram
ZXMS6001N3
Over Voltage
Protection
IN
Human body
ESD
protection
Over current
protection
Logic
Over temperature
protection
dV/dt
limitation
Applications and information
• Especially suited for loads with a high in-rush current such as lamps and motors.
• All types of resistive, inductive and capacitive loads in switching applications.
D
S
• µC compatible power switch for 12V and 24V DC applications.
• Automotive rated.
• Replaces electromechanical relays and discrete circuits.
Linear Mode capability - the current-limiting protection circuitry is designed to de-activate at low
Vds, in order not to compromise the load current during normal operation. The design max DC
operating current is therefore determined by the thermal capability of the package/board
combination, rather than by the protection circuitry. This does not compromise the products
ability to self protect itself at low V
DS
.
Issue 1 - January 2008 2 www.zetex.com
© Zetex Semiconductors plc 2008
ZXMS6001N3
Absolute maximum ratings
Parameter Symbol Limit Unit
Continuous Drain-Source Voltage V
Drain-Source Voltage for short circuit protection V
= 5V V
IN
Continuous Input Voltage V
Peak Input Voltage V
Continuous Input Current
DS
DS(SC)
IN
IN
I
IN
-0.2V=VIN=10V
V
<-0.2V or VIN>10V
IN
Operating Temperature Range T
Storage Temperature Range T
Power Dissipation at T
Power Dissipation at T
=25°C
A
=25°C
A
Continuous Drain Current @ V
Continuous Drain Current @ V
Continuous Source Current (Body Diode)
Pulsed Source Current (Body Diode)
(a)
(c)
=5V; TA=25°C
IN
=5V; TA=25°C
IN
(b)
(a)
(c)
(a)
Unclamped single pulse inductive energy E
Load dump protection V
Electrostatic Discharge (Human Body Model) V
,
j
stg
P
D
P
D
I
D
I
D
I
S
I
S
AS
LoadDump
ESD
DIN humidity category, DIN 40 040 E
IEC climatic category, DIN IEC 68-1 40/150/56
60 V
36 V
-0.2 ... +10 V
-0.2 ... +20 V
mA
No limit
| I
| ≤2
IN
-40 to +150
-55 to +150
1.5 W
0.6 W
1.1 A
0.7 A
2.0 A
3.3 A
550 mJ
80 V
4000 V
°C
°C
Thermal resistance
Parameter Symbol Value Unit
Junction to ambient
Junction to ambient
Junction to ambient
NOTES:
(a) For a device surface mounted on 25mm x 25mm x 1.6mm FR4 board with a high coverage of single sided 2oz weight
copper. Allocation of 6cm
isolated.
(b) For a device surface mounted on FR4 board as (a) and measured at t<=10s.
(c) For a device surface mounted on FR4 board with the minimum copper required for electrical connections.
(a)
(b)
(c)
2
copper 33% to source tab and 66% to drain pin with source tab and drain pin electrically
Issue 1 - January 2008 3 www.zetex.com
© Zetex Semiconductors plc 2008
R
R
R
⍜JA
⍜JA
⍜JA
83 °C/W
45 °C/W
208 °C/W