Diodes ZXMP3A16N8 User Manual

30V P-CHANNEL ENHANCEMENT MODE MOSFET
ZXMP3A16N8
SUMMARY V
(BR)DSS
= -30V; R
DS(ON)
= 0.040 ID= -6.7A
This new generation of trench MOSFETs from Zetex utilizes a unique structure that combinesthe benefits of low on-resistance with fast switching speed. This makes them ideal for high efficiency, low voltage, power management applications.
FEATURES
Low on-resistance
Fast switching speed
Low threshold
Low gate drive
Low profile SOIC package
APPLICATIONS
Disconnect switches
Motor control
ORDERING INFORMATION
SO8
DEVICE REEL
SIZE
ZXMP3A 16N 8TA 7” 12mm 500 units
ZXMP3A 16N 8TC 13” 12mm 2500 units
TAPE
WIDTH
QUANTITY
PER REEL
DEVICE MARKING
ZXMP 3A16
ISSUE 2 - MAY 2007
PINOUT
Top View
1
ZXMP3A16N8
ABSOLUTE MAXIMUM RATINGS
PARAMETER SYMBOL LIMIT UNIT
Drain-Source Voltage V
Gate Source Voltage V
Continuous Drain Current V
=-10V; TA=25°C (b)
GS
V
=-10V; TA=70°C (b)
GS
V
=-10V; TA=25°C (a)
GS
Pulsed Drain Current (c) I
Continuous Source Current (Body Diode) (b) I
Pulsed Source Current (Body Diode) (c) I
Power Dissipation at T Linear Derating Factor
Power Dissipation at T Linear Derating Factor
=25°C (a)
A
=25°C (b)
A
Operating and Storage Temperature Range T
I
P
P
D
DM
S
SM
DSS
GS
D
D
j:Tstg
THERMAL RESISTANCE
PARAMETER SYMBOL VALUE UNIT
Junction to Ambient (a) R
Junction to Ambient (b) R
θJA
θJA
-30 V
20 V
-6.7
-5.4
-5.6
-26 A
-3.2 A
-26 A
1.9
15.2
mW/°C
2.8
22.4
mW/°C
-55 to +150 °C
65 °C/W
45 °C/W
A
W
W
NOTES
(a) For a device surface mounted on 25mm x 25mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions (b) For a device surface mounted on FR4 PCB measured at t5 secs. (c) Repetitive rating 25mm x 25mm FR4 PCB, D = 0.05, pulse width 10s - pulse width limited by maximum junction temperature. Refer to
Transient Thermal Impedance graph.
ISSUE 2 - MAY 2007
2
110
10m
100m
1
10
SinglePulse
T
amb
=25°C
R
DS(on )
Limit ed
100µs
1ms
10ms
100ms
1s
DC
Safe Operating Area
-I
D
Drain Current (A)
-VDSDrai n-Source Voltage (V)
0 20 40 60 80 100 120 140 160
0.0
0.4
0.8
1.2
1.6
2.0
Derating Curve
Temperature (°C)
Max Power Dissipation (W)
100µ 1m 10m 100m 1 10 100 1k
0
10
20
30
40
50
60
70
T
amb
=25°C
Transient Thermal Impedance
D=0. 5
D=0. 2
D=0. 1
Singl e Pulse
D=0. 05
Thermal Resistance (°C/W)
Pulse Wi dth (s)
100µ 1m 10m 100m 1 10 100 1k
1
10
100
Singl e Pulse
T
amb
=25°C
Pulse Power Dissipation
Pulse Wi dth (s)
Max i mu m Pow er (W)
CHARACTERISTICS
ZXMP3A16N8
ISSUE 2 - MAY 2007
3
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