Diodes ZXMP2120G4 User Manual

200V P-CHANNEL ENHANCEMENT MODE MOSFET
SUMMARY V
(BR)DSS
This 200V enhancement mode P-channel MOSFET provides users with a competitive specification offering efficient power handling capability, high impedance and is free from thermal runaway and thermally induced secondary breakdown. Applications benefiting from this device include a variety of telecom and general high voltage circuits.
A SOT23-5 version is also available (ZXMP2120E5).
FEATURES
=-200V; R
High voltage
Low on-resistance
Fast switching speed
Low gate drive
Low threshold
DS(ON)
= 25 ; ID= 200mA
ZXMP2120G4
3
2
2
T
O
S
SOT223 package variant engineered to increase spacing between high voltage pins.
APPLICATIONS
Active clamping of primary side MOSFETs in 48 volt DC-DC converters
ORDERING INFORMATION
DEVICE REEL SIZE
(inches)
ZXMP2120G4TA 7 12mm embossed 1,000 units
ZXMP2120G4TC 13 12mm embossed 4,000 units
TAPE WIDTH (mm) QUANTITY
PER REEL
DEVICE MARKING
ZXMP 2120
ISSUE 2 - SEPTEMBER 2006
1
D
Pinout - top view
S
N/C
G
ZXMP2120G4
ABSOLUTE MAXIMUM RATINGS
PARAMETER SYMBOL VALUE UNIT
Drain-Source Voltage V
Gate Source Voltage V
Continuous Drain Current (V
Pulsed Drain Current
(b)
=10V; T
GS
Pulsed Source Current (Body Diode)
(a)
Power Dissipation at T
amb
=25°C
amb
(b)
=25°C)
(a)
I
I
I
P
DS
GS
D
DM
SM
tot
Linear derating factor
Operating and Storage Temperature Range T
j:Tstg
THERMAL RESISTANCE
PARAMETER SYMBOL VALUE UNIT
Junction to Ambient
NOTES:
(a) For a device surface mounted on 25mm x 25mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions (b) Repetitive rating - pulse width limited by maximum junction temperature. Refer to Transient Thermal Impedance graph.
(a)
R
θJA
-200 V
20
-200 mA
-1 A
-1 A
2.0
1.6
mW/°C
-55 to +150 °C
62.5 °C/W
V
W
ISSUE 2 - SEPTEMBER 2006
2
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