ZXMP2120FF
200V SOT23F P-channel enhancement mode MOSFET
Summary
V
(BR)DSS
-200 28 @ V
R
(⍀)I
DS
(on)
= -10V -137
GS
(mA)
D
Description
This 200V enhancement mode P-channel MOSFET provides users with
a competitive specification offering efficient power handling capability,
high impedance and freedom from thermal runaway and thermally
induced secondary breakdown.
Applications benefiting from this device include a variety of telecom
and general high voltage circuits.
Features
• High voltage
• Low on-resistance
• Fast switching speed
• Low gate drive
• Low threshold
• SOT23 FLAT package
D
G
S
Applications
• Active clamping of primary side MOSFETs in 48 volt DC-DC
converters
Ordering information
Device Reel size
(inches)
ZXMP2120FFTA 7 8 3,000
Tape width
(mm)
Quantity
per reel
Device marking
1C4
Issue 1 - January 2007 1 www.zetex.com
© Zetex Semiconductors plc 2007
ZXMP2120FF
Absolute maximum ratings
Parameter Symbol Limit Unit
Drain-source voltage V
Gate-source voltage V
Continuous drain current @ V
Pulsed drain current
(c)
= 10V; T
GS
Pulsed source current (body diode)
Power dissipation at T
amb
=25°C
(a)
amb
(c)
=25°C
(a)
DSS
I
I
DM
I
SM
P
GS
D
D
Linear derating factor 8 mW/°C
Power dissapation at T
amb
=25°C
(b)
P
D
Linear derating factor 12.3 mW/°C
Operating and storage temperature range T
j
, T
stg
Thermal resistance
Parameter Symbol Limit Unit
Junction to ambient
Junction to ambient
(a)
(b)
R
R
⍜JA
⍜JA
-200 V
± 20 V
-137 mA
-0.8 A
-0.8 A
1W
1.5 W
-55 to +150 °C
125 °C/W
81 °C/W
NOTES:
(a) For a device surface mounted on 25mm x 25mm FR4 PCB with high coverage of single sided 1oz copper, in still air
conditions.
(b) For a device surface mounted on FR4 pcb measured at t ⱕ5 sec.
(c) Repetitive rating - 25mm x 25mm FR4 PCB, D=0.02, pulse width 300s - pulse width limited by maximum junction
temperature.
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© Zetex Semiconductors plc 2007
Thermal characteristics
ZXMP2120FF
Issue 1 - January 2007 3 www.zetex.com
© Zetex Semiconductors plc 2007