ZXMN6A25K
60V DPAK N-channel enhancement mode MOSFET
Summary
V
(BR)DSS
60
R
DS(on)
0.050 @ V
0.070 @ V
(⍀) I
= 10V 10.7
GS
= 4.5V 9
GS
D
(A)
Description
This new generation trench MOSFET from Zetex features a unique
structure combining the benefits of low on-resistance and fast
switching, making it ideal for high efficiency power management
applications.
Features
• Low on-resistance
• Fast switching speed
• Low gate drive
• DPAK package
Applications
• DC-DC converters
• Power management functions
• Disconnect switches
D
G
S
D
• Motor control
Ordering information
Device Reel size
(inches)
ZXMN6A25KTC 13 16 2,500
Tape width
(mm)
Quantity
per reel
Pinout - top view
D
GS
Device marking
ZXMN
6A25
Issue 3 - Novmber 2006 1 www.zetex.com
© Zetex Semiconductors plc 2006
ZXMN6A25K
Absolute maximum ratings
Parameter Symbol Limit Unit
Drain-source voltage V
Gate-source voltage V
Continuous drain current @ V
@ V
@ V
Pulsed drain current
(c)
= 10V; T
GS
= 10V; T
GS
= 10V; T
GS
Continuous source current (body diode)
(c)
(a)
Pulsed source current (body diode)
Power dissipation at T
amb
=25°C
amb
amb
amb
(b)
=25°C
=70°C
=25°C
(b)
(b)
(a)
DSS
I
I
DM
I
I
SM
P
GS
D
S
D
60 V
±20 V
10.7 A
8.6 A
7A
36 A
11.8 A
36 A
4.25 W
Linear derating factor 34 mW/°C
Power dissipation at T
amb
=25°C
(b)
P
D
9.85 W
Linear derating factor 78.7 mW/°C
Power dissipation at T
amb
=25°C
(d)
P
D
2.11 W
Linear derating factor 16.8 mW/°C
Operating and storage temperature range T
j
, T
stg
-55 to +150 °C
Thermal resistance
Parameter Symbol Limit Unit
Junction to ambient
Junction to ambient
Junction to ambient
NOTES:
(a) For a device surface mounted on 50mm x 50mm x 1.6mm FR4 PCB with high coverage of single sided 2oz copper, in
still air conditions.
(b) For a device surface mounted on FR4 PCB measured at t ⱕ10 sec.
(c) Repetitive rating 50mm x 50mm x 1.6mm FR4 PCB, D=0.02 pulse width=300s - pulse width limited by maximum
junction temperature.
(d) For a device surface mounted on 25mm x 25mm x 1.6mm FR4 PCB with high coverage of single sided 1oz. copper, in
still air conditions.
(a)
(b)
(d)
R
R
R
⍜JA
⍜JA
⍜JA
29.4 °C/W
12.7 °C/W
59.1 °C/W
Issue 3 - Novmber 2006 2 www.zetex.com
© Zetex Semiconductors plc 2006
Thermal characteristics
ZXMN6A25K
Issue 3 - Novmber 2006 3 www.zetex.com
© Zetex Semiconductors plc 2006