Diodes ZXMN6A07Z User Manual

ZXMN6A07Z

D
Top view
S
D
G

60V SOT89 N-channel enhancement mode mosfet

Summary

V
(BR)DSS
60
R
0.250 @ V
0.350 @ V
() I
DS(on)
= 10V 2.5
GS
= 4.5V 2.1
GS
D
(A)

Description

This new generation trench MOSFET from Zetex utilizes a unique structure combining the benefits of low on-state resistance with fast switching speed.

Features

Low on-resistance
Fast switching speed
Low threshold
SOT89 package
D
G
S

Applications

DC-DC converters
Power management functions
Relay and solenoid driving
Motor control

Ordering information

Device Reel size
(inches)
ZXMN6A07ZTA 7 12 1,000
Tape width
(mm)
Quantity per
reel

Device marking

7N6
Issue 8 - January 2007 1 www.zetex.com
© Zetex Semiconductors plc 2007
ZXMN6A07Z

Absolute maximum ratings

Parameter Symbol Limit Unit
Drain-source voltage V
Gate-source voltage V
Continuous drain current @ V
@ V
@ V
Pulsed drain current
(c)
= 10V; T
GS
= 10V; T
GS
= 10V; T
GS
Continuous source current (body diode)
(a)
(c)
Pulsed source current (body diode)
Power dissipation at T
amb
=25°C
amb
amb
amb
(b)
=25°C
=70°C
=25°C
(b)
(b)
(a)
DSS
I
I
DM
I
I
SM
P
GS
D
S
D
Linear derating factor 12 mW/°C
Power dissipation at T
amb
=25°C
(b)
P
D
Linear derating factor 21 mW/°C
60 V
± 20 V
2.5 A
2.0
1.9
6.8 A
3.3 A
6.8 A
1.5 W
2.6 W

Thermal resistance

Parameter Symbol Limit Unit
Junction to ambient R
Junction to ambient R
NOTES:
(a) For a device surface mounted on 25mm x 25mm FR4 PCB with high coverage of single sided 1oz copper, in still air
conditions. (b) For a device surface mounted on FR4 PCB measured at t 10 sec. (c) Repetitive rating - 25mm x 25mm FR4 PCB, D=0.02, pulse width 300s - pulse width limited by maximum junction
temperature.
JA
JA
83.3 °C/W
47.4 °C/W
Issue 8 - January 2007 2 www.zetex.com
© Zetex Semiconductors plc 2007

Thermal characteristics

ZXMN6A07Z
Issue 8 - January 2007 3 www.zetex.com
© Zetex Semiconductors plc 2007
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