ZXMN6A07Z
60V SOT89 N-channel enhancement mode mosfet
Summary
V
(BR)DSS
60
R
0.250 @ V
0.350 @ V
(⍀) I
DS(on)
= 10V 2.5
GS
= 4.5V 2.1
GS
D
(A)
Description
This new generation trench MOSFET from Zetex utilizes a unique
structure combining the benefits of low on-state resistance with fast
switching speed.
Features
• Low on-resistance
• Fast switching speed
• Low threshold
• SOT89 package
D
G
S
Applications
• DC-DC converters
• Power management functions
• Relay and solenoid driving
• Motor control
Ordering information
Device Reel size
(inches)
ZXMN6A07ZTA 7 12 1,000
Tape width
(mm)
Quantity per
reel
Device marking
7N6
Issue 8 - January 2007 1 www.zetex.com
© Zetex Semiconductors plc 2007
ZXMN6A07Z
Absolute maximum ratings
Parameter Symbol Limit Unit
Drain-source voltage V
Gate-source voltage V
Continuous drain current @ V
@ V
@ V
Pulsed drain current
(c)
= 10V; T
GS
= 10V; T
GS
= 10V; T
GS
Continuous source current (body diode)
(a)
(c)
Pulsed source current (body diode)
Power dissipation at T
amb
=25°C
amb
amb
amb
(b)
=25°C
=70°C
=25°C
(b)
(b)
(a)
DSS
I
I
DM
I
I
SM
P
GS
D
S
D
Linear derating factor 12 mW/°C
Power dissipation at T
amb
=25°C
(b)
P
D
Linear derating factor 21 mW/°C
60 V
± 20 V
2.5 A
2.0
1.9
6.8 A
3.3 A
6.8 A
1.5 W
2.6 W
Thermal resistance
Parameter Symbol Limit Unit
Junction to ambient R
Junction to ambient R
NOTES:
(a) For a device surface mounted on 25mm x 25mm FR4 PCB with high coverage of single sided 1oz copper, in still air
conditions.
(b) For a device surface mounted on FR4 PCB measured at t ⱕ10 sec.
(c) Repetitive rating - 25mm x 25mm FR4 PCB, D=0.02, pulse width 300s - pulse width limited by maximum junction
temperature.
⍜JA
⍜JA
83.3 °C/W
47.4 °C/W
Issue 8 - January 2007 2 www.zetex.com
© Zetex Semiconductors plc 2007
Thermal characteristics
ZXMN6A07Z
Issue 8 - January 2007 3 www.zetex.com
© Zetex Semiconductors plc 2007