This new generation of TRENCH MOSFETs from Zetex utilizes a unique
structure that combines the benefits of low on-resistance with fast switching
speed. This makes them ideal for high efficiency, low voltage, power
management applications.
(BR)DSS
= 30V; R
= 0.035;ID= 6.2A
DS(ON)
FEATURES
Low on-resistance
•
Fast switching speed
•
Low threshold
•
Low gate drive
•
Low profile SOIC package
•
APPLICATIONS
•
DC - DC Converters
•
Power Management Functions
•
Disconnect switches
•
Motor control
ORDERING INFORMATION
DEVICEREELTAPE
ZXMN3A06DN8TA7
ZXMN3A06DN8TC13’‘12mm
WIDTH
’‘12mm500 units
DEVICE MARKING
ZXMN
3A06D
QUANTITY
PER REEL
2500 units
SO8
PINOUT
ISSUE 2 - OCTOBER 2002
Top view
1
Page 2
ZXMN3A06DN8
ABSOLUTE MAXIMUM RATINGS.
PARAMETERSYMBOLLIMITUNIT
Drain-Source VoltageV
Gate Source VoltageV
Continuous Drain Current (V
=10V; TA=25°C)(b)(d)
GS
(V
=10V; TA=70°C)(b)(d)
GS
(V
=10V; TA=25°C)(a)(d)
GS
Pulsed Drain Current (c)I
Continuous Source Current (Body Diode) (b)I
Pulsed Source Current (Body Diode)(c)I
Power Dissipation at T
Linear Derating Factor
Power Dissipation at T
Linear Derating Factor
Power Dissipation at T
Linear Derating Factor
=25°C (a)(d)
A
=25°C (a)(e)
A
=25°C (b)(d)
A
Operating and Storage Temperature RangeT
DSS
GS
I
D
DM
S
SM
P
D
P
D
P
D
j:Tstg
THERMAL RESISTANCE
PARAMETERSYMBOLVALUEUNIT
Junction to Ambient (a)(d)R
Junction to Ambient (a)(e)R
Junction to Ambient (b)(d)R
θJA
θJA
θJA
30V
⫾20V
6.2
5.0
4.9
30A
3.7A
30A
1.25
10
mW/°C
1.80
14.5
mW/°C
2.1
17.3
mW/°C
-55 to +150°C
100°C/W
69°C/W
58°C/W
A
W
W
W
NOTES
(a) For a device surface mounted on 25mm x 25mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions
(b) For a device surface mounted on FR4 PCB measured at t⭐10 secs.
(c) Repetitive rating 25mm x 25mm FR4 PCB, D=0.02 pulse width=300µs - pulse width limited by maximum junction temperature. Refer to
Transient Thermal Impedance graph.
(d) For device with one active die
(e) For device with two active die running at equal power.
ISSUE 2 - OCTOBER 2002
2
Page 3
TYPICAL CHARACTERISTICS
ZXMN3A06DN8
ISSUE 2 - OCTOBER 2002
3
Page 4
ZXMN3A06DN8
ELECTRICAL CHARACTERISTICS (at T
= 25°C unless otherwise stated).
amb
PARAMETERSYMBOLMIN.TYP.MAX. UNIT CONDITIONS.
STATIC
Drain-Source Breakdown VoltageV
Zero Gate Voltage Drain CurrentI
Gate-Body LeakageI
Gate-Source Threshold VoltageV
Static Drain-Source On-State Resistance
(1)
Forward Transconductance (1)(3)g
(BR)DSS
DSS
GSS
GS(th)
R
DS(on)
fs
30V
I
=250µA, VGS=0V
D
0.5AVDS=30V, VGS=0V
100nA
1VI
0.035
0.050
V
GS
=250A, VDS=V
D
VGS=10V, ID=9A
⍀
V
⍀
=4.5V, ID=7.4A
GS
=±20V, VDS=0V
13.5SVDS=15V,ID=9A
DYNAMIC (3)
Input CapacitanceC
Output CapacitanceC
Reverse Transfer CapacitanceC
Total Gate ChargeQ
Gate-Source ChargeQ
Gate-Drain ChargeQ
d(on)
r
d(off)
f
g
g
gs
gd
3.0ns
6.4ns
21.6ns
=15V, ID=3.5A
V
DD
R
=6.0⍀,VGS=10V
G
9.4ns
9.2nCVDS=15V,VGS=5V,
I
=3.5A
D
17.5nC
V
=15V,VGS=10V,
2.3nC
3.1nC
DS
I
=3.5A
D
SOURCE-DRAIN DIODE
Diode Forward Voltage (1)V
Reverse Recovery Time (3)t
Reverse Recovery Charge (3)Q
NOTES
(1) Measured under pulsed conditions. Width ≤300µs. Duty cycle ≤ 2% .
(2) Switching characteristics are independent of operating junction temperature.
(3) For design aid only, not subject to production testing.
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