Diodes ZXMN10A25K User Manual

A
f
D
Product Summary
Max I
D
TA = +25°C
6.4A
5.8A
V
R
(BR)DSS
100V
125mΩ @ V
150mΩ @ VGS= 6V
Package
DS(ON)
= 10V
GS
TO252
(DPAK)
Description
This MOSFET has been designed to minimize the on-state resistance
) and yet maintain superior switching performance, making it
(R
DS(on)
ideal for high efficiency power management applications.
Applications
DC-DC Converters
Power Management Functions
Disconnect Switches
Motor Control
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Green
ZXMN10A25K
100V N-CHANNEL ENHANCEMENT MODE MOSFET
Features
Low On-Resistance
Fast Switching Speed
Low Gate Drive
Lead-Free Finish; RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
Qualified to AEC-Q101 Standards for High Reliability
Mechanical Data
Case: TO252 (DPAK)
Case Material: Molded Plastic, “Green” Molding Compound. UL
Flammability Classification Rating 94V-0 (Note 1)
Moisture Sensitivity: Level 1 per J-STD-020
Terminals: Matte Tin Finish annealed over Copper leadframe.
Solderable per MIL-STD-202, Method 208
Weight: 0.33 grams (approximate)
TO252
Top View
D
GS
Pin Out -Top View
Equivalent Circuit
Ordering Information (4 & 5)
Part Number Marking Reel size (inches) Tape width (mm) Quantity per reel
ZXMN10A25KTC ZXMN10A25 13 16 2,500
Notes: 1. EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. All applicable RoHS exemptions applied.
2. See http://www.diodes.com for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free.
4. For Packaging Details, go to our website at http://www.diodes.com.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds.
5. Products with Q-suffix are automotive grade. Automotive products are electrical and thermal the same as the commercial, except where specified.
Marking Information
ZXMN 10A25
ZXMN10A25K
Document number: DS33569 Rev. 3 - 2
www.diodes.com
ZXMN10A25 = Product Type Marking Code
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ZXMN10A25K
Maximum Ratings (@T
= +25°C, unless otherwise specified.)
A
Characteristic Symbol Value Unit
Drain-Source voltage Gate-Source voltage
Continuous Drain current
V
= 10V
GS
(Note 7) TA = +70°C (Note 7)
V
DSS
V
GS
I
D
100 V ±20
V
6.4 5
A
(Note 6) 4.2 Pulsed Drain current (Note 8) Continuous Source current (Body diode) (Note 7) Pulsed Source current (Body diode) (Note 8)
I
DM
I
S
I
SM
21 A 10 A 21 A
Thermal Characteristics
Characteristic Symbol Value Unit
(Note 6)
Power dissipation Linear derating factor
(Note 7)
P
D
(Note 9) (Note 6)
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Lead (Note 10) Operating and storage temperature range
Notes: 6. For a device surface mounted on 50mm x 50mm x 1.6mm FR4 PCB with high coverage of single sided 2oz copper, in still air conditions; the device is
measured when operating in a steady-state condition.
7. For a device surface mounted on FR4 PCB measured at t 10 sec.
8. Repetitive rating 50mm x 50mm x 1.6mm FR4 PCB, D = 0.02 and pulse width 300µs. The pulse current is limited by the maximum junction temperature.
9. For a device surface mounted on 25mm x 25mm x 1.6mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions; the device is measured when operating in a steady-state condition.
10. Thermal resistance from junction to solder-point (at the end of the drain lead).
(Note 7) 12.7 (Note 9) 59.1
R
JA
θ
R
JL
T
, T
J
STG
ZXMN10A25K
Document number: DS33569 Rev. 3 - 2
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www.diodes.com
4.25 34
9.85
78.7
2.11
16.8
29.4
1.43
-55 to 150
W
mW/°C
°C/W
°C
July 2012
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Thermal Characteristics
R
DS(on)
10
Limit
1
DC
1s
100m
Drain Current (A)
D
I
10m
T
amb
25mm x 25 mm
1oz FR4
100ms
=25°C
110100
VDS Drain-Source Voltage (V)
Safe Operating Area
60
50 40
30
T
=25°C
amb
25mm x 25mm
1oz FR4
D=0.5
10ms
1ms
100µs
10
100m
Drain Current (A )
D
I
10m
30
25 20
15
R
DS(on)
Limit
1
DC
1s
100ms
T
=25°C
amb
50mm x 50 mm
2oz FR4
10ms
1ms
1 10 100
VDS Drain-Source Voltage (V)
Safe Operating Area
T
=25°C
amb
50mm x 50mm
2oz FR4
D=0.5
ZXMN10A25K
100µs
20
D=0.2
10
0
100µ 1m 10m 100m 1 10 100 1k
Thermal Resistance (°C/W )
Pulse Width (s)
D=0.1
D=0.05
Single Pulse
Transient Thermal Impedance
Single Pu lse
T
=25°C
100
amb
50mm x 50mm
2oz FR4
10
25mm x 25 mm
1oz FR4
1
100µ 1m 10m 100m 1 10 100 1k
Max Power Dissipation (W)
Pulse Width (s)
Pulse Power Dissipation
10
D=0.2
5 0
100µ 1m 10m 100m 1 10 100 1k
Therma l Re sistance ( °C/W)
Pul se Width (s)
D=0.1
D=0.05
Single Pulse
Transient Thermal Impedance
4.5
4.0
3.5
3.0
2.5
50mm x 50 mm
2oz FR4
25mm x 25 mm
1oz FR4
2.0
1.5
1.0
0.5
0.0
0 20 40 60 80 100 120 140 160
Max Power Dissipation (W)
Temperature (°C)
Derating Curve
ZXMN10A25K
Document number: DS33569 Rev. 3 - 2
3 of 8
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July 2012
© Diodes Incorporated
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