Product Summary
Green
ZXMN10A25G
100V N-CHANNEL ENHANCEMENT MODE MOSFET
Features and Benefits
NEW PRODUCT
I
V
R
(BR)DSS
100V
125mΩ @ V
150mΩ @ VGS = 6.0V
DS(on) max
GS
= 10V
D
TA = +25°C
4.0A
3.7A
Description
This new generation MOSFET has been designed to minimize the on-
state resistance (R
performance, making it ideal for high efficiency power management
applications.
) and yet maintain superior switching
DS(on)
Applications
DC Motor Control
DC-AC Inverters
SOT223
Top View
Pin Out - Top View
Low On-Resistance
Low Input Capacitance
Fast Switching Speed
Low Input/Output Leakage
Lead-Free Finish; RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
Qualified to AEC-Q101 Standards for High Reliability
Mechanical Data
Case: SOT223
Case Material: Molded Plastic, “Green” Molding Compound.
UL Flammability Classification Rating 94V-0 (Note 1)
Moisture Sensitivity: Level 1 per J-STD-020
Terminals Connections: See diagram below
Terminals: Finish - Matte Tin annealed over Copper lead frame.
Solderable per MIL-STD-202, Method 208
Weight: 0.112 grams (approximate)
D
G
S
Equivalent Circuit
Ordering Information (Note 4)
Part Number Qualification Case Packaging
ZXMN10A25GTA Standard SOT223 1,000 / Tape & Reel
Notes: 1. EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. All applicable RoHS exemptions applied.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. For packaging details, go to our website at http://www.diodes.com/products/packages.html.
Marking Information
ZXMN10A25G
Document number: DS33568 Rev. 3 - 2
ZXMN
10A25
ZXMN10A25 = Product Type Marking Code
1 of 7
www.diodes.com
April 2014
© Diodes Incorporated
NEW PRODUCT
Maximum Ratings (@T
= +25°C, unless otherwise specified.)
A
Characteristic Symbol Value Units
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current, VGS = 10V, t ≦10 sec
T
= +25°C
A
= +70°C
T
A
V
V
Continuous Drain Current (Note 5) VGS = 10V TA = +25°C ID
Maximum Continuous Body Diode Forward Current (Note 5)
Pulsed Drain Current (10μs pulse, duty cycle = 1%)
Pulsed Source Current (10μs pulse, duty cycle = 1%)
Thermal Resistance (@T
= +25°C, unless otherwise specified.)
A
Characteristic Symbol Value Units
Total Power Dissipation (Note 5), TA = +25°C
Linear derating factor
Thermal Resistance, Junction to Ambient (Note 5)
R
Total Power Dissipation (Note 5), TA = +25°C, t ≦10 sec
Linear derating factor
Thermal Resistance, Junction to Ambient, t ≦10 sec. (Note 5)
Operating and Storage Temperature Range
R
T
J, TSTG
Thermal Characteristics (@T
= +25°C, unless otherwise specified.)
A
DSS
GSS
I
I
I
DM
I
SM
P
P
ZXMN10A25G
D
S
D
JA
D
JA
100 V
20
4.0
3.2
V
A
2.9
5.4 A
17 A
17 A
2.0
16
W
mW/°C
62.5 °C/W
3.9
31
W
mW/°C
32 °C/W
-55 to +150 °C
ZXMN10A25G
Document number: DS33568 Rev. 3 - 2
2 of 7
www.diodes.com
April 2014
© Diodes Incorporated
NEW PRODUCT
Electrical Characteristics (@T
= +25°C, unless otherwise specified.)
A
Characteristic Symbol Min Typ Max Unit Test Condition
OFF CHARACTERISTICS (Note 6)
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current
Gate-Source Leakage
BV
I
DSS
I
GSS
DSS
100 — — V
— —
— — ±100 nA
0.5 µA
VGS = 0V, ID = 250µA
VDS = 100V, VGS = 0V
VGS = 20V, VDS = 0V
ON CHARACTERISTICS (Note 6)
Gate Threshold Voltage
Static Drain-Source On-Resistance
Forward Transfer Admittance
Diode Forward Voltage
V
GS(th)
R
DS (ON)
|Y
V
fs
SD
2.0
— —
— — 150
|
—
—
—
7.3 — S
0.85 0.95 V
4.0 V
125
VDS = VGS, ID = 250µA
V
mΩ
V
VDS = 15V, ID = 2.9A
VGS = 0V, IS = 4.0A
DYNAMIC CHARACTERISTICS (Note 7)
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Total Gate Charge
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Turn-On Delay Time
Turn-On Rise Time
Turn-Off Delay Time
Turn-Off Fall Time
Body Diode Reverse Recovery Time
Body Diode Reverse Recovery Charge
Notes: 5. Device mounted on FR-4 substrate PC board, 2oz copper, with thermal vias to bottom layer 1inch square copper plate
6 .Short duration pulse test used to minimize self-heating effect.
7. Guaranteed by design. Not subject to production testing.
C
C
C
Q
Q
Q
Q
t
D(on)
t
D(off)
Q
t
iss
oss
rss
gd
t
t
rr
g
g
gs
r
f
rr
— 859 —
—
—
57
33
— 9.6 — nC
—
—
— 5.4 —
—
—
— 18 —
—
17
3.8
4.9
3.7
9.4
— 40.5
— 62
—
—
—
—
—
—
—
V
pF
f = 1.0MHz
VDS = 50V, VGS = 5.0V, ID = 2.9A
nC
V
V
ns
I
ns
V
dI/dt = 100A/μs
nC
ZXMN10A25G
Document number: DS33568 Rev. 3 - 2
3 of 7
www.diodes.com
ZXMN10A25G
= 10V, ID = 2.9A
GS
= 6.0V, ID = 2.6A
GS
= 50V, VGS = 0V
DS
= 50V, VGS = 10V, ID = 2.9A
DS
= 50V, V
DS
= 1.0 ARG = 6.0
D
= 0V, IS = 2.9A,
GS
= 10V,
GS
© Diodes Incorporated
April 2014
NEW PRODUCT
Thermal Characteristics
ZXMN10A25G
ZXMN10A25G
Document number: DS33568 Rev. 3 - 2
4 of 7
www.diodes.com
April 2014
© Diodes Incorporated
NEW PRODUCT
Thermal Characteristics (cont.)
ZXMN10A25G
ZXMN10A25G
Document number: DS33568 Rev. 3 - 2
5 of 7
www.diodes.com
April 2014
© Diodes Incorporated
NEW PRODUCT
Package Outline Dimensions
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version.
D
b1
Q
C
e1
b
e
Gauge
Plane
Seating
Plane
0.25
E1
E
L
°
0
1
-
°
0
A1A
7
°
°
7
Suggested Pad Layout
Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.
Y1
Y2
ZXMN10A25G
Document number: DS33568 Rev. 3 - 2
X2
X1
C2
C1
Dimensions Value (in mm)
X1 3.3
X2 1.2
Y1 1.6
Y2 1.6
C1 6.4
C2 2.3
6 of 7
www.diodes.com
ZXMN10A25G
SOT223
Dim Min Max Typ
A 1.55 1.65 1.60
A1 0.010 0.15 0.05
b 0.60 0.80 0.70
b1 2.90 3.10 3.00
C 0.20 0.30 0.25
D 6.45 6.55 6.50
E 3.45 3.55 3.50
E1 6.90 7.10 7.00
e - - 4.60
e1 - - 2.30
L 0.85 1.05 0.95
Q 0.84 0.94 0.89
All Dimensions in mm
April 2014
© Diodes Incorporated
NEW PRODUCT
IMPORTANT NOTICE
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings
noted herein may also be covered by one or more United States, international or foreign trademarks.
This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the
final and determinative format released by Diodes Incorporated.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2014, Diodes Incorporated
www.diodes.com
ZXMN10A25G
ZXMN10A25G
Document number: DS33568 Rev. 3 - 2
7 of 7
www.diodes.com
April 2014
© Diodes Incorporated
Loading...