Diodes ZXM64P03X User Manual

A

f

A

D

Product Summary

Max I

V

Max R

(BR)DSS

-30V

DS(on)

75mΩ @ V

100mΩ @ VGS = -4.5V

= -10V

GS

T

= 25°C

-3.8A

-3.3A

D

Description

This MOSFET utilizes a unique structure that combines the benefits of low on-resistance with fast switching speed, making it ideal for high-efficiency power management applications.

Applications

• DC - DC converters

• Power management functions

• Disconnect switches

• Motor control

MSOP8

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ZXM64P03X

30V P-CHANNEL ENHANCEMENT MODE MOSFET

Features

• Fast switching speed

• Low on-resistance

• Low threshold

• Low gate drive

• Totally Lead-Free & Fully RoHS compliant (Notes 1 & 2)

• Halogen and Antimony Free. “Green” Device (Note 3)

• Qualified to AEC-Q101 Standards for High Reliability

Mechanical Data

• Case: MSOP8

• Case Material: Molded Plastic, UL Flammability Classification

Rating 94V-0

• Moisture Sensitivity: Level 1 per J-STD-020

• Terminals: Matte Tin Finish; Solderable per MIL-STD-202,

Method 208

• Weight: 0.028 grams (approximate)

G

S

Top View

Pin Out

Equivalent Circuit

Ordering Information (Note 4)

Product Marking Reel size (inches) Tape width (mm) Quantity per reel

ZXM64P03XTA

Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.

2. See http://www.diodes.com for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free.

3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds.

4. For packaging details, go to our website at http://www.diodes.com.

ZXM64P03 7 12 1,000 Units

Marking Information

ZXM64P03X

Document Number DS33487 Rev. 2 - 2

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ZXM64P03 = Product Type Marking Code

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Maximum Ratings (@T

= +25°C, unless otherwise specified.)

A

Characteristic Symbol Value Units

Drain-Source Voltage Gate-Source Voltage

Continuous Drain Current

V

GS

= 4.5V

T

T Pulsed Drain Current (Note 7) Continuous Source Current (Body Diode) (Note 6) Pulsed Source Current (Body Diode) (Note 7)

= +25°C (Note 5)

A

= +70°C (Note 5)

A

V

DSS

V

GS

I

D

I

DM

I

S

I

SM

-30 V

±20 V

-3.8

-3.0

-1.9 A

-2.3 A

-19 A

Thermal Characteristics (@T

= +25°C, unless otherwise specified.)

A

Characteristic Symbol Value Unit

Power Dissipation (Note 5) Linear Derating Factor Power Dissipation (Note 6) Linear Derating Factor

Thermal Resistance, Junction to Ambient (Note 5) Thermal Resistance, Junction to Ambient (Note 6) Thermal Resistance, Junction to Ambient (Note 8) Operating and Storage Temperature Range

Notes: 5. For a device surface mounted on 25mm x 25mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions

6. For a device surface mounted on FR4 PCB measured at t 10 secs.

7. Repetitive rating pulse width limited by pulse current limited by maximum junction temperature.

8. Thermal resistance from junction to solder-point (at the end of the Drain lead).

R R R

T

J, TSTG

P

D

P

D

JA JA JL

1.1

8.8

1.8

14.4 113 °C/W

70 °C/W

39.8 °C/W

-55 to +150 °C

A

W

mW/°C

W

mW/°C

Thermal Characteristics

ZXM64P03X

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ZXM64P03X

Electrical Characteristics (@T

= +25°C, unless otherwise specified.)

A

Characteristic Symbol Min Typ Max Unit Test Condition

OFF CHARACTERISTICS

Drain-Source Breakdown Voltage Zero Gate Voltage Drain Current Gate-Source Leakage

BV

I I

DSS DSS GSS

-30

⎯ ⎯ ⎯ ⎯ ⎯ ⎯

V

ID = -250μA, VGS = 0V

-1

±100 nA

μA

V VGS = ±20V, VDS = 0V

= -30V, VGS = 0V

DS

ON CHARACTERISTICS

Gate Threshold Voltage Static Drain-Source On-Resistance (Note 9) Forward Transconductance (Notes 9 and 11)

Diode Forward Voltage (Note 9) Reverse Recovery Time (Note 11) Reverse Recovery Charge (Note 11)

V

GS(th

R

DS (ON)

V

g

fs

SD

t

r

Q

r

-1.0 ⎯ ⎯

2.3

⎯ ⎯

⎯

⎯ ⎯

30.2

27.8

V

ID = -250μA, VDS = VGS

75

100

-0.95 V

⎯ ⎯

V

m

V

S

VDS = -10V, ID = -1.2A TJ = +25°C, IS = -2.4A, VGS = 0V

ns

T di/dt = 100A/μs

nC

= -10V, ID = -2.4A

GS

= -4.5V, ID = -1.2A

GS

= +25°C, IF = -2.4A,

J

DYNAMIC CHARACTERISTICS (Note 11) Input Capacitance Output Capacitance Reverse Transfer Capacitance Turn-On Delay Time (Note 10) Turn-On Rise Time (Note 10) Turn-Off Delay Time (Note 10) Turn-Off Fall Time (Note 10) Total Gate Charge (Note 10) Gate-Source Charge (Note 10) Gate-Drain Charge (Note 10)

Notes: 9. Measured under pulsed conditions. Pulse width = 300μs. Duty cycle  2%.

10. Switching characteristics are independent of operating junction temperature.

11. For design aid only, not subject to production testing.

C C

t

C

d(on

d(off

Q Q Q

iss oss rss

t

f

s d

⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯

825 250

80

4.4

6.2 40

29.2

⎯

⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯

46

9

11.5

V

pF

ns

DS

f = 1.0MHz

V

DD

= 6.2, RD = 6.2

R

G

(Refer to test circuit)

V

nC

DS

I

= -2.4A

D

(Refer to test circuit)

= -25V, VGS = 0V

= -15V, ID = -2.4A,

= -24V, VGS = -10V,

ZXM64P03X

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Typical Characteristics

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Typical Characteristics - continued

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ZXM64P03X

Test Circuits

ZXM64P03X

Document Number DS33487 Rev. 2 - 2

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Package Outline Dimensions

Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version.

4

x

1

0

°

L

See Detail C

a

c

D

0.25

E

Gauge Plane

x

y

1

A2

A1

b

e

Seating Plane

A3

A

4

x

1

Detail C

E3

E1

0

°

Suggested Pad Layout

Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.

Y1

X C

Y

Dimensions Value (in mm)

C 0.650 X 0.450 Y 1.350

Y1 5.300

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ZXM64P03X

MSOP-8

Dim Min Max Typ

A - 1.10 A1 0.05 0.15 0.10 A2 0.75 0.95 0.86 A3 0.29 0.49 0.39

b 0.22 0.38 0.30

c 0.08 0.23 0.15

D 2.90 3.10 3.00

E 4.70 5.10 4.90 E1 2.90 3.10 3.00 E3 2.85 3.05 2.95

e - - 0.65

L 0.40 0.80 0.60

a 0° 8° 4°

x - - 0.750

y - - 0.750 All Dimensions in mm

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IMPORTANT NOTICE

DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).

Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated website, harmless against all damages.

Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel. Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorize d application, Customers shall indemnify and hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.

Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings noted herein may also be covered by one or more United States, international or foreign trademarks.

This document is written in English but may be translated into multiple languages for reference. Onl y the English version of this document is the final and determinative format released by Diodes Incorporated.

LIFE SUPPORT

Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:

A. Life support devices or systems are devices or systems which:

1. are intended to implant into the body, or

2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the

labeling can be reasonably expected to result in significant injury to the user. B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the

failure of the life support device or to affect its safety or effectiveness. Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and

acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.

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