ZXM62P03E6
Document Number: DS33483 Rev. 2 - 2
December 2013
© Diodes Incorporated
Description
This MOSFET utilizes a unique structure that combines the benefits
of low on-resistance with fast switching speed, making it ideal for
high-efficiency power management applications.
Applications
DC - DC converters
Power management functions
Disconnect switches
Motor control
Features and Benefits
Fast switching speed
Low on-resistance
Low threshold
Low gate drive
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
Qualified to AEC-Q101 Standards for High Reliability
Mechanical Data
Case: SOT-26
Case Material: Molded Plastic, UL Flammability Classification
Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminals: Matte Tin Finish; Solderable per MIL-STD-202,
Method 208
Weight: 0.015 grams (approximate)
2P03 = Product Type Marking Code
30V P-CHANNEL ENHANCEMENT MODE MOSFET
Ordering Information (Note 4)
Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. For packaging details, go to our website at http://www.diodes.com/products/packages.html.
Marking Information
ZXM62P03E6
Document Number: DS33483 Rev. 2 - 2
December 2013
© Diodes Incorporated
TA = +25°C (Note 5)
TA = +70°C (Note 5)
Pulsed Drain Current (Note 7)
Continuous Source Current (Body Diode)
Pulsed Source Current (Body Diode)
Power Dissipation (Note 5)
Linear Derating Factor
Power Dissipation (Note 6)
Linear Derating Factor
Thermal Resistance, Junction to Ambient (Note 5)
Thermal Resistance, Junction to Ambient (Note 6)
Operating and Storage Temperature Range
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current
Static Drain-Source On-Resistance (Note 8)
Forward Transconductance (Notes 8 and 10)
Diode Forward Voltage (Note 8)
TJ = +25°C, IS = -1.6A, VGS = 0V
Reverse Recovery Time (Note 10)
TJ = +25°C, IF = -1.6A,
di/dt = 100A/μs
Reverse Recovery Charge (Note 10)
DYNAMIC CHARACTERISTICS (Note 10)
VDS = -25V, VGS = 0V
f = 1.0MHz
Reverse Transfer Capacitance
Turn-On Delay Time (Note 9)
VDD = -15V, ID = -1.6A,
RG 6.2Ω RD 25Ω
Turn-On Rise Time (Note 9)
Turn-Off Delay Time (Note 9)
Turn-Off Fall Time (Note 9)
Total Gate Charge (Note 9)
V
DS
= -24V, VGS = -10V,
ID = -1.6A
Gate-Source Charge (Note 9)
Gate-Drain Charge (Note 9)
Maximum Ratings (@T
= +25°C, unless otherwise specified.)
A
Thermal Characteristics (@T
Notes: 5. For a device surface mounted on 25mm x 25mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions
6. For a device surface mounted on FR4 PCB measured at t ≤5 secs.
7. Repetitive rating - pulse width limited by maximum junction temperature. Refer to Transient Thermal Impedance graph.
= +25°C, unless otherwise specified.)
A
Electrical Characteristics (@T
Notes: 8. Measured under pulsed conditions. Pulse width = 300μs. Duty cycle ≤ 2%.
9. Switching characteristics are independent of operating junction temperature.
10. For design aid only, not subject to production testing.
= +25°C, unless otherwise specified.)
A
ZXM62P03E6
Document Number: DS33483 Rev. 2 - 2
December 2013
© Diodes Incorporated
Typical Characteristics