Diodes ZXGD3104N8 User Manual

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ZXGD3104N8

SYNCHRONOUS MOSFET CONTROLLER IN SO8

Features

• 5-25V Vcc range

• Operating up to 250kHz

• Suitable for Discontinuous Mode (DCM), Critical Conduction

Mode (CrCM) and Continuous Mode (CCM) operation

• Turn-off propagation delay 15ns and turn-off time 20ns.

• Proportional Gate Drive

• Detector threshold voltage -10mV

• Standby current 5mA

• “Lead-Free”, RoHS Compliant (Note 1)

• Halogen and Antimony free. “Green” Device (Note 2)

• Qualified to AEC-Q101 Standards for High Reliability

Mechanical Data

• Case: SO-8

• Case material: Molded Plastic. “Green” Molding Compound.

• UL Flammability Rating 94V-0

• Moisture Sensitivity: Level 1 per J-STD-020

• Terminals: Matte Tin Finish

• Solderable per MIL-STD-202, Method 208

• Weight: 0.074 grams (approximate)

SO-8

DRAINDNC

REF

GATEL

GATEH

Top View

Pin-Out

BIAS

GND

V

CC

Description

The ZXGD3104 is intended to drive MOSFETS configured as ideal diode replacements. The device is comprised of a differential amplifier detector stage and high current driver. The detector monitors the reverse voltage of the MOSFET such that if body diode conduction occurs a positive voltage is applied to the MOSFET’s Gate pin.

Once the positive voltage is applied to the Gate the MOSFET switches on. The detectors’ output voltage is then proportional to the MOSFET Drain-Source voltage and this is applied to the Gate via the driver. This action provides a rapid MOSFET turn off at zero Drain current.

Applications

• Flyback Converters in:

o 90W Laptop Adaptors

Typical Configuration

Ordering Information (Note 3)

Product Marking Reel size (inches) Tape width (mm) Quantity per reel

ZXGD3104N8TC ZXGD3104 13 12 2,500

Notes: 1. No purposefully added lead

2. Diodes Inc’s “Green” Policy can be found on our website at http://www.diodes.com

3. For packaging details, go to our website at http://www.diodes.com

Marking Information

ZXGD = Product Type Marking Code, Line 1 3104 = Product Type Marking Code, Line 2 YY = Year (ex: 11 = 2011) WW = Week (01 - 53)

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ZXGD3104N8

Document Number DS35546 Rev. 1 – 2

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3104 Y W

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Functional Block Diagram

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ZXGD3104N8

Pin No. Name Description and function

1 DNC

2 REF

3 GATEL

4 GATEH

5 VCC

6 GND

7 BIAS

8 DRAIN

Do not connect Leave pin floating. Reference

This pin is connected to VCC via resistor, R 1, in Application Information section.

Gate turn off

This pin sinks current, I

Gate turn on

This pin sources current, I Power Supply This is the supply pin. It is recommended to decouple this point to ground closely with a ceramic capacitor.

Ground

This is the ground reference point. Connect to the synchronous MOSFET Source terminal. Bias This pin is connected to V in Application Information section.

Drain connection

This pin connects directly to the synchronous MOSFET Drain terminal.

Select R

REF.

, from the synchronous MOSFET Gate.

SINK

, to the synchronous MOSFET Gate.

SOURCE

via resistor, R

CC

BIAS.

Select R

to source 2.16mA into this pin. Refer to Table

REF

BIAS

to source 3mA into this pin. Refer to Table 1,

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Maximum Ratings @T

= 25°C unless otherwise specified

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Characteristic Symbol Value Unit

Supply voltage, relative to GND VCC 25 V Drain pin voltage VD -3 to 180 V Gate output voltage VG -3 to V Gate Driver peak source current I Gate Driver peak sink current I Reference voltage V Reference current I Bias voltage V Bias current I

2.5 A

SOURCE

7 A

SINK

V

REF

25 mA

REF

V

BIAS

100 mA

BIAS

+ 3 V

CC

V

CC

V

CC

Thermal Characteristics @T

= 25°C unless otherwise specified

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Characteristic Symbol Value Unit

490

3.92

655

5.24

720

5.76

785

6.28

255

mW

mW/°C

°C/W

Power Dissipation Linear derating factor

Thermal Resistance, Junction to Ambient

(Note 4) (Note 5)

P

(Note 6)

D

(Note 7)

(Note 4) (Note 5) 191 (Note 6) 173

R

JA

(Note 7) 159 Thermal Resistance, Junction to Lead (Note 8) Operating Temperature Range Storage Temperature Range

Notes: 4. For a device surface mounted on minimum recommended pad layout FR4 PCB with high coverage of single sided 1oz copper, in still air conditions; the

device is measured when operating in a steady-state condition.

5. Same as note (4), except pin 5 (V

6. Same as note (5), except both heatsinks are 10mm x 10mm.

7. Same as note (5), except both heatsinks are 15mm x 15mm.

8. Thermal resistance from junction to solder-point at the end of each lead on pin 5 (V

) and pin 6 (GND) are both connected to separate 5mm x 5mm 1oz copper heatsinks.

CC

R

JL

T

J

T

STG

) and pin 6 (GND).

CC

135

-40 to +150

-50 to +150

°C/W

°C

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Thermal Derating Curve

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0.7

0.6

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ZXGD3104N8

15mm x 15mm

10mm x 10mm

ESD Rating

0.5

0.4

Minimum

0.3

Layout

0.2

0.1

0.0

Max Powe r Di ssi p at ion (W)

0 20 40 60 80 100 120 140 160

5mm x 5mm

Junction Temperatu re (°C)

Derating Curve

Characteristic Value Unit

ESD for Human Body Model 2000 ESD for Machine Model 300

V

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