A Product Line of
N/C
1
2
3
4
8
7
6
5
REF
GATEH
GATEL
DRAIN
BIAS
V
CC
GND
SM8
Diodes Incorporated
ZXGD3101T8
Synchronous rectifier controller for flyback converters.
Description
The ZXGD3101 is intended to drive MOSFETS
configured as ideal diode replacements. The
device is comprised of a differential amplifier
detector stage and high current driver. The
detector monitors the reverse voltage of the
MOSFET such that if body diode conduction
occurs a positive voltage is applied to the
MOSFET's Gate pin.
Once the positive voltage is applied to the Gate
the MOSFET switches on allowing reverse
current flow. The detectors' output voltage is
then proportional to the MOSFET Drain-Source
reverse voltage drop and this is applied to the
Gate via the driver. This action provides a rapid
turn off as current decays.
Features
• Turn-off propagation delay 15ns and turnoff time 20ns
• Suitable for Discontinuous Mode (DCM),
Critical Conduction Mode (CrCM) and
Continuous conduction mode (CCM)
operation
• Compliant with Energy Star V2.0 and
Applications
Flyback converters in:
• Adaptors
•L C D m o n i t o r s
•S e r v e r P S U ’ s
• Set top boxes
European Code of Conduct V3
• Low component count
• Halogen free
•5 - 1 5 V V
range
CC
Refer to documents; AN54, DN90, DN91 and
DN94 available from the website
Pin out detail Typical configuration
Transformer
R
REF
REF
DRAIN
GATEL
R
BIAS
Vcc
BIAS
ZXGD
3101
GATEH GND
C1
Synchronous Rectifier
MOSFET
Ordering information
Device Status Package Part Mark Reel size
(inches)
ZXGD3101T8TA Active SM8 ZXGD3101 7 12 1000
Issue 4 - January 2009 1 www.zetex.com
© Diodes Incorporated 2009 www.diodes.com
Tape width
(mm)
Quantity
per reel
ZXGD3101T8
Absolute maximum ratings
Parameter Symbol Limit Unit
Supply voltage
Continuous Drain pin voltage
GATEH and GATEL output Voltage
1
1
1
Driver peak source current I
Driver peak sink current I
Reference current I
Bias voltage V
Bias current I
Power dissipation at T
=25° CPD500 mW
A
Operating junction temperature T
Storage temperature T
NOTES:
1. All voltages are relative to GND pin
V
CC
V
D
V
G
SOURCE
SINK
REF
BIAS
BIAS
j
stg
15 V
-3 to180 V
-3 to V
+ 3 V
CC
4A
7A
25 mA
V
CC
100 mA
-40 to +150 °C
-50 to +150 °C
Thermal resistance
Parameter Symbol Value Unit
V
Junction to ambient
Junction to lead
(*) Mounted on minimum 1oz copper on FR4 PCB in still air conditions
(†) Output Drivers - Junction to solder point at end of the lead 5 and 6
(*)
(†)
R
R
θJA
θIA
250 °C/W
54 °C/W
ESD Rating
Model Rating Unit
Human body 4,000 V
Machine 400 V
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ZXGD3101T8
Electrical characteristics at TA = 25°C;
VCC = 10V; R
Parameter Symbol Conditions Min. Typ. Max. Unit
Input and supply characteristics
Operating current
Gate Driver
Turn-off Threshold
Voltage
(**)
GATE output voltage
= 1.8kΩ ; R
BIAS
(**)
REF
=3kΩ
V
T
V
I
OP
G(off)
V
G
V
V
DRAIN
DRAIN
≤ -200m V
≥ 0V
VG = 1V,
V
V
V
V
V
V
DRAIN
DRAIN
DRAIN
DRAIN
DRAIN
DRAIN
≥ 0V,
= -60mV,
= -80mV,
= -100mV,
≤ -140mV,
≤ -200mV,
(*)
(*)
(†)
(†)
(†)
(†)
(†)
-3 -
-8 -
-45 -16 0 mV
-0 . 6 1
5.0 7.5 -
7.0 8.5 -
8.4 9 -
9.2 9.4 -
9.3 9.5 -
mA
V
V
GATEH peak source current
GATEL peak sink current
Turn on Propagation delay
Turn off Propagation delay
Gate rise time
Gate fall time
NOTES:
(**) GATEH connected to GATEL
= 100KΩ, R L = 0/C
(*) R
H
(†) R
= 100KΩ, R
L
(a) (Refer to Fig 4; Test circuit and Fig 5; Timing diagram on page 11
= 0/C
H
I
SOURCE
I
SINK
t
d1
t
d2
t
r
t
f
= 1V
GH
V
= 5V
GL
CL = 2.2nF,
(†)
(a)
2.5 - A
2.5 - A
525 ns
15 ns
305 ns
20 ns
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Schematic symbol and pin description
High Volt
comparator
High Volt
comparator
Threshold Voltage
Control
Driver
+
+
-
-
DRAIN
GND
GATEH
GATEL
BIAS
REF
Gate Drive Control
Turn-on/off Control
Vcc
ZXGD3101T8
Pin No. Symbol Description and function
1 NC No connection
This pin can be connected to GND
2 REF Reference
This pin is connected to V
~3mA into this pin. See note 1
3 GATEL Gate turn off
This pin sinks current, I
4 GATEH Gate turn on
This pin sources current, I
5V
CC
Power Supply
This is the supply pin. It is recommended to decouple this point to ground
closely with a ceramic capacitor.
6 GND Ground
This is the ground reference point. Connect to the synchronous MOSFET Source
terminal.
7 BIAS Bias
This pin is connected to V
source 1.6 times I
8 DRAIN Drain connection
This pin connects directly to the synchronous MOSFET Drain terminal.
SINK
into this pin. See note 1
REF
via resistor, R
CC
REF
. R
should be selected to source
REF
, from the synchronous MOSFET Gate.
SOURCE
CC
, to the synchronous MOSFET Gate.
via resistor, R
BIAS
. R
should be selected to
BIAS
NOTES:
1. BIAS and REF pins should be assumed to be at GND+0.7V
Issue 4 - January 2009 4 www.zetex.com
© Diodes Incorporated 2009 www.diodes.com
ZXGD3101T8
Operation
Normal Operation
The operation of the device is described step-by-step with reference to the timing diagram below.
1. The detector monitors the MOSFET Drain-Source voltage.
2. When, due to transformer action, the MOSFET body diode is forced to conduct there is
approximately -0.6V on the Drain pin.
3. The detector outputs a positive voltage with respect to ground, this voltage is then fed to the
MOSFET driver stage and current is sourced out of the GATEH pin.
4. The current out of the GATEH pin is sourced into the synchronous MOSFET Gate to turn the
device on.
5. The GATEH output voltage is now proportional to the Drain-Source voltage drop across the
MOSFET due to the current flowing through the MOSFET.
6. MOSFET conduction continues until the drain current reaches zero.
7. At zero current the detector output voltage is zero and the synchronous MOSFET Gate voltage
is pulled low by the GATEL, turning the device off.
MOSFET
Drain Voltage
MOSFET
Gate Voltage
MOSFET
Gate Current
Body Diode
Conduction
2
1
3
4
Drain
current
zero
6
5
7
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