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Description and Applications
The ZXGD3005E6 is a high-speed non-inverting single gate driver
capable of driving up to 10A into a MOSFET or IGBT gate capacitive
load from supply voltages up to 25V. With propagation delay times
down to <10ns and correspondingly rise/fall times of <20ns.
This gate driver ensures rapid switching of the MOSFET or IGBT to
minimize power losses and distortion in high current switching
applications. It is ideally suited to act as a voltage buffer between the
typically high output impedances of a controller IC and the effectively
low impedance on the gate of a power MOSFET or IGBT during
switching. Its low input voltage requirement and high current gain
allows high current driving from low voltage controller ICs.
The ZXGD3005E6 has separate source and sink outputs that enables
the turn-on and turn-off times of the MOSFET or IGBT to be
independently controlled. In addition, the wide supply voltage range
allows full enhancement of the MOSFET or IGBT to minimize on-state
losses and permits +15V to -5V gate drive voltage to prevent dV/dt
ADVANCE INFORMATION
induced false triggering of IGBTs. The ZXGD3005E6 has been
designed to be inherently rugged to latch-up and shoot-through
issues. The optimized pin-out SOT26 package eases board layout,
enabling reduced parasitic inductance of traces.
Power MOSFET and IGBT Gate Driving in:
• Synchronous switch-mode power supplies
• Power Factor Correction (PFC) in power supplies
• Secondary side synchronous rectification
• Plasma Display Panel power modules
• 1, 2 and 3-phase motor control circuits
• Audio switching amplifier power output stages
• Solar inverters
SOT26
1
Top View
V
CC
IN
V
EE
Top View
Pin-Out
Features and Benefits
• Emitter-follower configuration for ultra-fast switching
• <10ns propagation delay time
• <20ns rise/fall time
• Non-inverting voltage buffer stage
• Wide supply voltage up to 25V to minimize on-losses
• 10A peak current drive into capacitive loads
• Low input current of 1mA to deliver 4A output current
• Separate source and sink outputs for independent control of rise
and fall time
• Optimized pin-out to ease board layout and minimize parasitic
inductance of traces
• Rugged design that avoids latch-up or shoot-through issues
• Near - Zero quiescent supply current
• “Lead-Free”, RoHS Compliant (Note 1)
• “Green” Devices (Note 2)
• Qualified to AEC-Q101 Standards for High Reliability
Mechanical Data
• Case: SOT26
• Case material: Molded Plastic. “Green” Molding Compound.
• UL Flammability Rating 94V-0
• Moisture Sensitivity: Level 1 per J-STD-020
• Terminals: Matte Tin Finish
• Weight: 0.018 grams (approximate)
Source
Do Not Connect
Sink
Diodes Incorporated
ZXGD3005E6
25V 10A GATE DRIVER IN SOT26
Pin Name Pin Function
VCC
IN Driver input pin
VEE
SOURCE Source current output
SINK Sink current output
Supply voltage high
Supply voltage low
Ordering Information (Note 3)
Product Marking Reel size (inches) Tape width (mm) Quantity per reel
ZXGD3005E6TA 3005 7 8 3000
Notes: 1. No purposefully added lead
2. “Green” devices, Halogen and Antimony Free, Diodes Inc’s “Green” Policy can be found on our website at http://www.diodes.com
3. For packaging details, go to our website at http://www.diodes.com
Marking Information
3005
ZXGD3005E6
Document Number DS35095 Rev. 4 – 2
www.diodes.com
3005 = Product Type Marking Code
1 of 8
March 2011
© Diodes Incorporated
Typical Application Circuit
ADVANCE INFORMATION
Controller IC
IN
VCC
VCC
ZXGD3005
V
EE
SOURCE
SINK
R
SOURCE
R
SINK
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Diodes Incorporated
V
ZXGD3005E6
S
Maximum Ratings @T
= 25°C unless otherwise specified
A
Characteristic Symbol Value Unit
Supply voltage, with respect to VEE
Input voltage, with respect to VEE
Output difference voltage (Source – Sink)
Peak output current
Input current
ΔV
V
CC
V
IN
source-sink
I
PK
I
IN
25 V
25 V
±7.5 V
±10 A
±100 mA
Thermal Characteristics @T
= 25°C unless otherwise specified
A
Characteristic Symbol Value Unit
Power Dissipation (Notes 4 & 5)
Linear derating factor
Thermal Resistance, Junction to Ambient (Notes 4 & 5)
Thermal Resistance, Junction to Lead (Note 6)
Operating and Storage Temperature Range
Notes: 4. For a device surface mounted on 25mm x 25mm x 0.6mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions; the device is
measured when operating in a steady-state condition. The heatsink is split in half with the pin 1 (V
5. For device with two active die running at equal power.
6. Thermal resistance from junction to solder-point at the end of each lead on pin 1 (V
P
R
R
T
J, TSTG
JA
JL
D
CC
CC
) and pin 3 (VEE).
1.1
8.8
113
105
-55 to +150
) and pin 3 (VEE) connected separately to each half.
W
mW/°C
°C/W
°C
ZXGD3005E6
Document Number DS35095 Rev. 4 – 2
2 of 8
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March 2011
© Diodes Incorporated
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Diodes Incorporated
ZXGD3005E6
Electrical Characteristics @T
Characteristic Symbol Min Typ Max Unit Test Condition
Output voltage, high
Output voltage, low
Supply breakdown voltage
Quiescent supply current
Source current
Sink current
Source current
with varying input resistances
Sink current
with varying input resistances
ADVANCE INFORMATION
Switching times
with low load capacitance C
= 10nF
L
Switching times
with high load capacitance C
= 100nF
L
Switching times
with asymmetric source and sink resistors
Switching Test Circuit and Timing Diagram
= 25°C unless otherwise specified
A
V
OH
V
OL
BV
I
Q
I
source
I
sink
I
(source)
I
(sink)
t
d(rise)
t
t
d(fall)
tf
t
d(rise)
t
t
d(fall)
tf
CC
r
r
-
25 - 25 - -
- - 50
- - 50
- 4.0 -
- 3.8 -
-
-
-
-
VCC- 0.8
VEE+ 0.2 VEE+ 0.5 V
6.4
5.5
3.9
2.2
0.44
7.7
6.5
4.4
2.3
0.46
8
48
16
35
46
419
47
467
t
d(rise)
t
t
d(fall)
tf
r
24
133
16
37
-
- A
- A
- ns
- ns
ns
V
IN
V
IN
I
Q
V
I
Q
V
CC
nA
V
CC
VCC= 5V, IIN= 1mA, V
A
VCC= 5V, IIN=-1mA, V
R
IN
R
IN
R
IN
R
IN
R
IN
R
IN
R
IN
R
IN
R
IN
R
IN
V
CC
V
IN
R
IN
C
L
R
SOURCE
V
CC
V
IN
R
IN
C
L
R
SOURCE
V
CC
V
IN
R
IN
C
L
R
SOURCE
= VCC
= VEE
= 100μA, V
= 100μA, V
= 20V,V
= 20V,V
= 200
= 1k
= 10k
= 100k
= 1000k
= 200
= 1k
= 10k
= 100k
= 1000k
= 15V, V
= VCC
IN
= VEE = 0V
IN
= VCC
IN
= VEE = 0V
IN
OUT
OUT
V
= 15V, V
CC
V
= 15V
IN
C
= 100nF, RL = 0.18
L
R
SOURCE
= 15V, V
V
CC
= 15V
V
IN
C
= 100nF, RL = 0.18
L
R
SOURCE
= 0V
EE
= 0 to 15V
= 1k
= 10nF, RL = 0.18
= 0, R
= 15V, V
EE
SINK
= 0V
= 0
= 0 to 15V
= 1k
= 100nF, RL = 0.18
= 0, R
= 15V, V
EE
SINK
= -5V
= 0
= -5 to 15V
= 1k
= 10nF, RL = 0.18
=4.7, R
SINK
=0
= 0V
= 5V
EE
= 0, R
EE
= 0, R
= 0V
SINK
= 0V
SINK
= 0
= 0
R
SOURCE
R
SINK
90%
CL
L
V
IN
10%
t
t
d(rise)
90%
V
OUT
d(fall)
90%
V
OUT
R
V
50
VIN
50
RIN
IN
CC
VCC
ZXGD3005
V
EE
SOURCE
SINK
10%
10%
ZXGD3005E6
Document Number DS35095 Rev. 4 – 2
www.diodes.com
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tr
t
f
March 2011
© Diodes Incorporated