Diodes ZVP4525Z User Manual

SEMICONDUCTORS
250V P-CHANNEL ENHANCEMENT MODE MOSFET
D
D
S
G
SUMMARY
V
(BR)DSS
DESCRIPTION
This 250V enhancement mode P-channel MOSFET provides users with a competitive specification offering efficient power handling capability, high impedance and is free from thermal runaway and thermally induced secondary breakdown. Applications benefiting from this device include a variety of Telecom and general high voltage switching circuits.
SOT223 and SOT23-6 versions are also available.
FEATURES
High voltage
Low on-resistance
Fast switching speed
Low gate drive
Low threshold
Complementary N-channel Type ZVN4525Z
=14 ; ID=-205mA
DS(ON)
ZVP4525Z
SOT89
SOT89 package
APPLICATIONS
Earth Recall and dialling switches
Electronic hook switches
High Voltage Power MOSFET Drivers
Telecom call routers
Solid state relays
ORDERING INFORMATION
DEVICE REEL SIZE
ZVP4525ZTA 7 12mm embossed 1000 units
ZVP4525ZTC 13 12mm embossed 4000 units
DEVICE MARKING
P52
ISSUE 2 - JUNE 2007
(inches)
TAPE WIDTH (mm) QUANTITY
PER REEL
1
Top View
ZVP4525Z
SEMICONDUCTORS
ABSOLUTE MAXIMUM RATINGS
PARAMETER SYMBOL LIMIT UNIT
V
I
D
I
D
I
DM
S
SM
P
DSS
GS
D
:T
j
stg
Drain-Source Voltage
Gate Source Voltage V
Continuous Drain Current (VGS=10V; TA=25°C)(a)
(VGS=10V; TA=70°C)(a)
Pulsed Drain Current (c)
Continuous Source Current (Body Diode) I
Pulsed Source Current (Body Diode) I
Power Dissipation at TA=25°C (a) Linear Derating Factor
Operating and Storage Temperature Range T
THERMAL RESISTANCE
PARAMETER SYMBOL VALUE UNIT
Junction to Ambient (a)
Junction to Ambient (b)
NOTES (a) For a device surface mounted on 25mm x 25mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions (b) For a device surface mounted on FR4 PCB measured at t5 secs. (c) Repetitive rating - pulse width limited by maximum junction temperature. Refer to Transient Thermal Impedance graph.
R
R
θJA
θJA
250 V
±40
-205
-164
-1 A
-0.75 A
-1 A
1.2
9.6
-55 to +150 °C
103 °C/W
50 °C/W
V
mA mA
W mW/°C
NB High Voltage Applications
For high voltage applications, the appropriate industry sector guidelines should be considered with regard to voltage spacing between conductors.
ISSUE 2 - JUNE 2007
2
SEMICONDUCTORS
CHARACTERISTICS
1 10 100
1m
10m
100m
1
Single Pulse
T
amb
=25°C
R
DS(on)
Limit
100µs
1ms
10ms
100ms
1s
DC
Safe Operating Area
I
C
Collector Current (A)
VCECollector-Emitter Voltage (V)
0 20 40 60 80 100 120 140 160
0.0
0.2
0.4
0.6
0.8
1.0
1.2
Derating Curve
Temperature (°C)
Max Power Dissipation (W)
100µ 1m 10m 100m 1 10 100 1k
0
20
40
60
80
100
120
T
amb
=25°C
Transient Thermal Impedance
D=0.5
D=0.2
D=0.1
Single Pulse
D=0.05
Thermal Resistance (°C/W)
Pulse Width (s)
100µ 1m 10m 100m 1 10 100 1k
0.1
1
10
100
Single Pulse
T
amb
=25°C
Pulse Power Dissipation
Pulse Width (s)
Maximum Power (W)
ZVP4525Z
ISSUE 2 - JUNE 2007
3
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