250V P-CHANNEL ENHANCEMENT MODE MOSFET
ZVP4525G
SUMMARY
V
(BR)DSS
=-250V; R
=14V; ID=-265mA
DS(ON)
DESCRIPTION
This 250V enhancement mode P-channel MOSFET provides users with a
competitive specification offering efficient power handling capability, high
impedance and is free from thermal runaway and thermally induced
secondary breakdown. Applications benefiting from this device include a
variety of telecom and general high voltage circuits.
SOT89 and SOT23-6 versions are also available.
FEATURES
High voltage
•
Low on-resistance
•
Fast switching speed
•
Low gate drive
•
Low threshold
•
•
Complementary N-channel type ZVN4525G
•
SOT223 package
APPLICATIONS
•
Earth recall and dialling switches
•
Electronic hook switches
3
2
2
T
O
S
•
High voltage power MOSFET drivers
•
Telecom call routers
•
Solid state relays
ORDERING INFORMATION
DEVICE REEL SIZE TAPE WIDTH QUANTITY
ZVP4525GTA 7” 8mm embossed 1000 units
ZVP4525GTC 13” 8mm embossed 4000 units
PER REEL
DEVICE MARKING
•
ZVP4525G
ISSUE 4 - JUNE 2004
1
D
TOP VIEW
SEMICONDUCTORS
S
D
G
ZVP4525G
ABSOLUTE MAXIMUM RATINGS.
PARAMETER SYMBOL LIMIT UNIT
V
(a)
(a)
I
I
I
P
DSS
GS
D
D
DM
S
SM
D
Drain-source voltage
Gate source voltage V
Continuous drain current (V
=10V; TA=25°C)
GS
(VGS=10V; TA=70°C)
Pulsed drain current
(c)
Continuous source current (body diode) I
Pulsed source current (body diode) I
(a)
Power dissipation at T
=25°C
A
Linear derating factor
Operating and storage temperature range T
j:Tstg
THERMAL RESISTANCE
PARAMETER SYMBOL VALUE UNIT
Junction to ambient
Junction to ambient
NOTES:
(a) For a device surface mounted on 25mm x 25mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions
(b) For a device surface mounted on FR4 PCB measured at t⭐5 secs.
(c) Repetitive rating - pulse width limited by maximum junction temperature. Refer to Transient Thermal Impedance graph.
(a)
(b)
R
θJA
R
θJA
250 V
±40
-265
-212
mA
mA
-1 A
-0.75 A
-1 A
2
16
mW/°C
-55 to +150 °C
63 °C/W
26 °C/W
V
W
NB High voltage applications
For high voltage applications, the appropriate industry sector guidelines should be considered with regard to
voltage spacing between conductors.
ISSUE 4 - JUNE 2004
SEMICONDUCTORS
2