Diodes ZLLS500 User Manual

Product Summary

• VR = 40V

• I

= 0.7A

F

• I

= 10μA

R

Description and Applications

This compact SOT23 packaged Schottky diode offers users an
excellent performance combination comprising high current operation,
extremely low leakage and low forward voltage ensuring suitability for
applications requiring efficient operation at higher temperatures
(above 85°C) see Operational efficiency chart on page 3.

• DC – DC Converters

• Strobes

• Mobile Telecomms

• Charging circuits

• Motor Control

Top View

SOT23

Device Schematic Top View

ZLLS500

SURFACE MOUNT SCHOTTKY BARRIER DIODE

Features and Benefits

• Extremely low leakage (10μA @30V)

C
1

= 0.7A)

F

• High current capability (I

• Low V

• ZLLS500 complements low temperature equivalent ZHCS500

• Package thermally rated to 150°C

• Qualified to AEC-Q101 Standards for High Reliability

, fast switching Schottky

F

Mechanical Data

• Case: SOT23

• Case Material: Molded Plastic, “Green” Molding Compound. UL

Flammability Classification Rating 94V-0

• Moisture Sensitivity: Level 1 per J-STD-020

• Terminals: Matte Tin Finish annealed over Alloy 42 leadframe

(Lead Free Plating). Solderable per MIL-STD-202, Method 208

• Weight: 0.0089 grams (approximate)

1

3

32
AN/C

Pin Configuration

Ordering Information (Note 1)

Device Packaging Shipping

ZLLS500TA SOT23 3000/Tape & Reel
ZLLS500TC SOT23 10000/Tape & Reel

Notes: 1. For Packaging Details, go to our website at http://www.diodes.com.

Marking Information

L05

L05 = Product Type Marking Code

ZLLS500

Document number: DS33227 Rev. 6 - 2

1 of 6

www.diodes.com

January 2012

© Diodes Incorporated

ZLLS500

Maximum Ratings @T

Continuous Reverse Voltage
Continuous Forward Current
Peak Repetitive Forward Current

Rectangular Pulse Duty Cycle
Non Repetitive Forward Current

= 25°C unless otherwise specified

A

Characteristic Symbol Value Units

40 V

0.7 A

1.14 A
13 A

3.2 A

≤ 100μs

t

t ≤ 10ms

I

I

V

I

F

FPK

FSM

R

Thermal Characteristics

Characteristic Symbol Value Unit

Power Dissipation, TA = 25°C
Single Die Continuous
Single Die Measured at t < 5 secs

Thermal Resistance, Junction to Ambient
Junction Temperature

Storage Temperature Range

Notes: 2. For a device surface mounted on 25mm x 25mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions.

3. For a device surface mounted on FR4 PCB measured at t < 5 secs.

(Note 2)
(Note 3)

P

D

R

θJA

T

J

T

STG

500
630

250
198

150 °C

-55 to +150 °C

mW

ZLLS500

Document number: DS33227 Rev. 6 - 2

2 of 6

www.diodes.com

January 2012

© Diodes Incorporated