Diodes ZLLS400 User Manual

Product Summary

• VR = 40V

• I

= 0.52A

F

• I

= 10μA

R

Description and Applications

This compact SOD323 packaged Schottky diode offers users an
excellent performance combination comprising high current operation,
extremely low leakage and low forward voltage ensuring suitability for
applications requiring efficient operation at higher temperatures
(above 85°C) see Operational efficiency chart on page 4.

• DC – DC Converters

• Mobile Telecomms

• Charging circuits

• Motor control

Top View

40V SURFACE MOUNT SCHOTTKY BARRIER DIODE

Features and Benefits

• Low Equivalent On Resistance

• Extremely low leakage (10μA @30V)

• High current capability (I

• Low V

• ZLLS400 complements low temperature equivalent ZHCS400

• Package thermally rated to 150°C

• Qualified to AEC-Q101 Standards for High Reliability

, fast switching Schottky

F

= 0.52A)

F

Mechanical Data

• Case: SOD323

• Case Material: UL Flammability Classification Rating 94V-0

• Moisture Sensitivity: Level 1 per J-STD-020

• Terminal Connections: Cathode Band

• Terminals: Finish - Matte Tin annealed over Alloy 42 leadframe.

Solderable per MIL-STD-202, Method 208

• Weight: 0.004 grams (approximate)

SOD323

ZLLS400

Ordering Information (Note 1)

Device Packaging Shipping

ZLLS400TA SOD323 3,000/Tape & Reel
ZLLS400TC SOD323 10,000/Tape & Reel

Notes: 1. For Packaging Details, go to our website at http://www.diodes.com.

Marking Information

ZLLS400

Document number: DS33226 Rev. 7 - 2

AC

40

Top View

www.diodes.com

40 = Product Type Marking Code

1 of 6

February 2012

© Diodes Incorporated

Maximum Ratings @T

= 25°C unless otherwise specified

A

Characteristic Symbol Value Units

Continuous Reverse Voltage
Continuous Forward Current
Peak Repetitive Forward Current

Rectangular Pulse Duty Cycle
Non Repetitive Forward Current

≤ 100μs

t

t ≤ 10ms

I

I

V

I

F

FPK

FSM

R

40 V

0.52 A

0.85 A
12 A

2.5 A

Thermal Characteristics

Characteristic Symbol Value Unit

Power Dissipation, TA = 25°C

P

Single Die Continuous

D

Single Die Measured at t < 5 secs
Thermal Resistance, Junction to Ambiet
Junction Temperature

Storage Temperature Range

Notes: 2. For a device surface mounted on 25mm x 25mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions.

3. For a device surface mounted on FR4 PCB measured at t<5 secs.

(Note 2)
(Note 3)

R

T

θJA

T

STG

J

330
390

379
317

150 °C

-55 to +150 °C

ZLLS400

mW

°C/W

ZLLS400

Document number: DS33226 Rev. 7 - 2

2 of 6

www.diodes.com

February 2012

© Diodes Incorporated