Diodes TPD6V8LP User Manual

Page 1
Features
Planar Die Construction  Ultra-Small Leadless Surface Mount Package  Unidirectional  Ideally Suited for Automated Assembly Processes  Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) Halogen and Antimony Free. “Green” Device (Note 3) Qualified to AEC-Q101 Standards for High Reliability
TPD6V8LP
SURFACE MOUNT TRANSIENT VOLTAGE SUPPRESSOR
Mechanical Data
Case: X1-DFN1006-2 Case Material: Molded Plastic, "Green" Molding Compound.
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020  Terminals: Finish NiPdAu over Copper leadframe.
Solderable per MIL-STD-202, Method 208
Weight: 0.001 grams (approximate)
X1-DFN1006-2
Bottom View
e4
Ordering Information (Note 4)
Part Number Case Packaging
TPD6V8LP-7 X1-DFN1006-2 3000/Tape & Reel
Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
TPD6V8LP-7B X1-DFN1006-2 10,000/Tape & Reel
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds.
4. For packaging details, go to our website at http://www.diodes.com/products/packages.html.
Marking Information
TPD6V8LP
Document number: DS30914 Rev. 9 - 2
TPD6V8LP-7 TPD6V8LP-7B
9C
Dot Denotes
Cathode Side
9C
Bar Denotes
Cathode Side
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9C = Product Type Marking Code
May 2014
© Diodes Incorporated
Page 2
p
pp
P
P
O
R
PATIO
N
Maximum Ratings (@T
= +25°C, unless otherwise specified.)
A
Characteristic Symbol Value Unit
Peak Pulse Power (tp = 8 x 20s) (Note 5) (See Figure 6)
P Forward Voltage (Note 6) @ IF = 10mA VF Peak Pulse Current (tp = 8 x 20s) (Note 5) (See Figure 6)
Human Body Model
ESD Rating
Machine Model 400 V IEC61000-4-2 Air Discharge ±25 kV
V
IEC61000-4-2 Contact Discharge ±8 kV
Thermal Characteristics
Characteristic Symbol Value Unit
Power Dissipation (Note 5) Thermal Resistance, Junction to Ambient Air (Note 5)
Operating and Storage Temperature Range
R
T
J, TSTG
I
P
pp
θJA
TPD6V8LP
k
D
85 W
0.9 V
4.5 A 8 kV
250 mW 500
-65 to +150
C/W
C
Electrical Characteristics (@T
= +25°C, unless otherwise specified.)
A
Characteristic Symbol Value Unit
Reverse Standoff Voltage
Breakdown Voltage @ IT = 5mA (Note 6)
Maximum Reverse Leakage @ V @ V
(Note 6)
RWM
(Notes 6, 7)
R
Minimum
Maximum 7.2
V
VBR
RWM
I
R
Maximum Clamping Voltage @ Ipp = 4.5A (tp = 8x20s) (See Figure 6) VC Typical Total Capacitance (VR = 0V, f = 1MHz) CT
Notes: 5. Part mounted on FR-4 PC board with recommended pad layout, as per http://www.diodes.com.
7. Guaranteed over the temperature range -40°C to +85°C and over the reverse voltage (V
6. Short duration pulse test used to minimize self-heating effect. ) range 2.0V to 2.6V.
R
300
Note 5
250
(mW)
200
150
DISSI
100
WE
,
D
50
5 V
6.4 V
0.5 μA
380 nA
19 V 65 pF
0
0 255075100125150
T , AMBIENT TEMPERATURE (°C)
A
Fig. 1 Power Derating Curve
0
0.3
V , INSTANTANEOUS FORWARD VOLTAGE (V)
F
Fig. 2
0.6
Typical Forward Characteristics
0.9 1.2 1.5
TPD6V8LP
Document number: DS30914 Rev. 9 - 2
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N
TAN
T
N
O
US R
R
CUR
REN
T
TPD6V8LP
(mA)
T = -65°C
A
10
T = 0°C
SE
A
EVE
T = 25°C
A
E A
T = 85°C
S
I, I
R
V , INSTANTANEOUS REVERSE VOLTAGE (V)
R
Fig. 3 Typical Breakdown Characteristics
A
T = 150°C
A
R
I , INSTANTANEOUS REVERSE CURRENT (uA)
V , INSTANTANEOUS REVERSE VOLTAGE (V)
R
Fig. 4 Typical Low Current Reverse Characteristics
f = 1MHz
T
C , TOTAL CAPACITANCE (pF)
PP pp
I , PEAK PULSE CURRENT (%I )
1
V , REVERSE VOLTAGE (V)
Fig. 5 Typical Total Capacitance vs. Reverse Voltage
R
Package Outline Dimensions
Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.
TPD6V8LP
Document number: DS30914 Rev. 9 - 2
A
A1
D
X1-DFN1006-2
Dim Min Max Typ
A 0.47 0.53 0.50
A1 0 0.05 0.03
b 0.45 0.55 0.50 D 0.95 1.075 1.00 E 0.55 0.675 0.60
E
R
b
e - - 0.40 L 0.20 0.30 0.25 R 0.05 0.15 0.10
All Dimensions in mm
L
e
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TPD6V8LP
Suggested Pad Layout
Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel. Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings noted herein may also be covered by one or more United States, international or foreign trademarks.
This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the final and determinative format released by Diodes Incorporated.
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2014, Diodes Incorporated
www.diodes.com
Y
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
X
TPD6V8LP
Document number: DS30914 Rev. 9 - 2
X
1
Dimensions Value (in mm)
C 0.70
G 0.30
X 0.40
X1 1.10
Y 0.70
G
C
IMPORTANT NOTICE
LIFE SUPPORT
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