Diodes SDMG0340L User Manual

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Features

Low Forward Voltage Drop
Fast Switching
Ultra-Small Surface Mount Package
Lead Free/RoHS Compliant (Note 3)
"Green" Device (Note 4 and 5)
Maximum Ratings @T
Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage
RMS Reverse Voltage Forward Continuous Current (Note 1) Non-Repetitive Peak Forward Surge Current @ t = 8.3ms
Top View SDMG0340L SDMG0340LA SDMG0340LC SDMG0340LS
= 25°C unless otherwise specified
A
Characteristic Symbol Value Unit
SDMG0340L /LA /LC /LS
SURFACE MOUNT SCHOTTKY BARRIER DIODE

Mechanical Data

Case: SOT-323
Case Material: Molded Plastic, "Green" Molding Compound,
Note 5. UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020D
Terminals: Solderable Per MIL-STD-202, Method 208
Lead Free Plating (Matte Tin Finish annealed over
Alloy 42 leadframe)
Terminal Connections: See Diagram
Marking Information: See Page 3
Ordering Information: See Page 3
Weight: 0.006 grams (approximate)
V
V
V
R(RMS)
I
RRM
RWM
VR
IFM
FSM
40 V
28 V 30 mA
200 mA
Thermal Characteristics
Characteristic Symbol Value Unit
Power Dissipation (Note 1) Thermal Resistance Junction to Ambient Air (Note 1) Operating and Storage Temperature Range
Electrical Characteristics @T
Characteristic Symbol Min Typ Max Unit Test Condition
Reverse Breakdown Voltage (Note 2) Forward Voltage Leakage Current (Note 2) Total Capacitance
Notes: 1. Device mounted on FR-4 PCB, 1 inch x 0.85 inch x 0.062 inch; pad layout as shown on Diodes Inc. suggested pad layout document AP02001,
which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
2. Short duration pulse test used to minimize self-heating effect.
3. No purposefully added lead.
4. Diodes Inc.'s "Green" Policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
5. Product manufactured with date code 0627 (week 27, 2006) and newer are built with Green Molding Compound. Product manufactured prior to date code 0627 are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
= 25°C unless otherwise specified
A
V
PD
R
JA
θ
T
J, TSTG
40
(BR)R
VF
IR
CT
295 370 mV 150 1000 nA
2.0
200 mW 625
-40 to +125
V
IR = 10μA IF = 1.0mA VR = 10V
pF
VR = 1V, f = 1.0MHz
°C/W
°C
SDMG0340L /LA /LC /LS
Document number: DS30248 Rev. 12 - 2
1 of 4
www.diodes.com
July 2008
© Diodes Incorporated
NSTAN
TANEO
US F
O
R
RD CUR
REN
T
C, TOT
CAPACITAN
C
F
R
R
REC
OVER
Y T
P
P
O
R
P
O
SDMG0340L /LA /LC /LS
1
(A)
100m
10m
WA
1m
100n
10n
F
I, I
0 0.2 0.4 0.6
V , INSTANTANEOUS FORWARD VOLTAGE (V)
F
100
0.8 1.0
1.2 1.4
Fig. 1 Typical Forwar d Characteristics
R
1n
I , INSTANTANEOUS REVERSE CURRENT (A)
0 5 10 15 20 25 30 35
V , INSTANTANEOUS REVERSE VOLTAGE (V)
R
Fig. 2 Typical Revers e C haracteristics
10
5
) E (p
10
IME ( ns)
2
AL
N (mW) ATI
DISSI WE
,
D
T
250
200
150
100
1
0.1 0
5
10 15
V , REVERSE VOLTAGE (V)
R
Fig. 3 Typical Total Capacitance, per Element
50
20
25
1
0.5
SE
EVE
0.2
rr
t,
0.1 0
48
I , FORWARD CURRENT (mA)
Fig. 4 Typical Reverse Recovery Time C haracteristics
F
12 16 20
24 28
0
0
40
T , AMBIENT TEMPERATURE ( C)
A
80
120 160
Fig. 5 Power Derating Curve, Total Package
200
°
SDMG0340L /LA /LC /LS
Document number: DS30248 Rev. 12 - 2
2 of 4
www.diodes.com
July 2008
© Diodes Incorporated
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